公开(公告)号：US06375545B1

公开(公告)日：2002-04-23

申请号：US09484252

申请日：2000-01-18

申请人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Masayuki Motonari

发明人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Masayuki Motonari

IPC分类号： B24B100

CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053 ,  Y10S977/775 ,  Y10S977/888

摘要： It is an object of the present invention to provide an aqueous dispersion and CMP slurry that can achieve polishing at an adequate rate without producing scratches in the polishing surfaces of wafer working films, and a polishing process for wafer surfaces and a process for manufacture of a semiconductor device using them. A CMP slurry and the like of the present invention contains polymer particles with a crosslinked structure and a mean particle size of 0.13-0.8 &mgr;m. The CMP slurry may contain no surfactant, and may contain the surfactant of not greater than 0.15 wt %. A CMP slurry and the like of another present invention contains polymer particles and inorganic particles of silica, aluminum and the like. A mean particle size of the polymer particles may be not greater than a mean particle size of the inorganic particles. And the mean particle size of the inorganic coagulated particles may be 0.1-1.0 &mgr;m, and may be smaller than the mean particle size of the polymer particles. The CMP slurry is used as a polishing agent and a working film of a silicon oxide film, an aluminum film, a tungsten film or a copper film formed on a wafer is polished. And a semiconductor device is manufactured by using the CMP slurry.

摘要翻译： 本发明的目的是提供一种水分散体和CMP浆料，其可以以足够的速率实现抛光，而不会在晶片工作薄膜的抛光表面中产生划痕，以及用于晶片表面的抛光工艺和制造 半导体器件使用它们。 本发明的CMP浆料等含有交联结构，平均粒径为0.13〜0.8μm的聚合物粒子。 CMP浆料可以不含表面活性剂，并且可以含有不大于0.15重量％的表面活性剂。 另一个本发明的CMP浆料等含有聚合物颗粒和二氧化硅，铝等的无机颗粒。 聚合物颗粒的平均粒径可以不大于无机颗粒的平均粒度。 无机凝结粒子的平均粒径可以为0.1〜1.0μm，并且可以小于聚合物粒子的平均粒径。 将CMP浆料用作抛光剂，并且研磨在晶片上形成的氧化硅膜，铝膜，钨膜或铜膜的工作膜。 并且通过使用CMP浆料制造半导体器件。

公开(公告)号：US06454819B1

公开(公告)日：2002-09-24

申请号：US09484064

申请日：2000-01-18

申请人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Katsuya Okumura ,  Masayuki Motonari ,  Masayuki Hattori ,  Akira Iio

发明人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Katsuya Okumura ,  Masayuki Motonari ,  Masayuki Hattori ,  Akira Iio

IPC分类号： C09K314

CPC分类号： C09K3/1463 ,  C08G83/001 ,  C08J3/128 ,  C08K3/36 ,  C08K5/057 ,  C08K2201/013 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/02024 ,  H01L21/31053 ,  H01L21/3212

摘要： A process for chemical mechanical polishing of a working film on a wafer, which entails conducting the chemical mechanical polishing with an aqueous dispersion containing water and composite particles, the composite particles containing polymer particles having at least one of a silicon compound portion or section and a metal compound portion or section formed directly or indirectly on the polymer particles.

摘要翻译： 一种用于化学机械抛光晶片上的工作薄膜的方法，该方法需要用含水和复合颗粒的水性分散体进行化学机械抛光，所述复合颗粒含有具有硅化合物部分或部分和 在聚合物颗粒上直接或间接形成的金属化合物部分或部分。

公开(公告)号：US06740590B1

公开(公告)日：2004-05-25

申请号：US09531163

申请日：2000-03-17

申请人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori

发明人： Hiroyuki Yano ,  Gaku Minamihaba ,  Yukiteru Matsui ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori

IPC分类号： H01L21302

CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/7684

摘要： The object of the present invention is to provide an aqueous dispersion that can give the required properties for a wide range of uses including electronic materials, magnetic materials, optical materials and polishing materials, and to provide an aqueous dispersion for chemical mechanical polishing (CMP slurry) that gives an adequate polishing rate without creating scratches in polishing surfaces. Another object of the present invention is, to provide a method for manufacture of semiconductor devices using a CMP slurry that can control progressive erosion due to scratches and the like during polishing and that can achieve efficient flattening of working films, and to provide a method for formation of embedded wiring. The aqueous dispersion or CMP slurry of the present invention contains polymer particles made of thermoplastic resins or the like, and inorganic particles made of alumina, silica or the like, wherein the zeta potentials of the polymer particles and inorganic particles are of opposite signs, and they are bonded by electrostatic force to form aggregates as composite particles. The aggregates are subjected to ultrasonic wave irradiation or shear stress with a homogenizer to give more uniformly dispersed composite particles.

摘要翻译： 本发明的目的是提供一种水性分散体，其可以为包括电子材料，磁性材料，光学材料和抛光材料在内的广泛用途提供所需的性能，并提供用于化学机械抛光的水性分散体（CMP浆料 ），其提供足够的抛光速率，而不会在抛光表面中产生划痕。 本发明的另一个目的是提供一种使用CMP浆料制造半导体器件的方法，所述CMP浆料可以在抛光期间控制由划痕等引起的逐渐侵蚀，并且可以实现工作膜的有效平坦化，并提供一种方法 形成嵌入式布线。 本发明的水性分散体或CMP浆料含有由热塑性树脂等构成的聚合物颗粒和由氧化铝，二氧化硅等制成的无机颗粒，其中聚合物颗粒和无机颗粒的ζ电位具有相反的标志， 它们通过静电力结合以形成作为复合颗粒的聚集体。 聚集体用均化器进行超声波照射或剪切应力，得到更均匀分散的复合颗粒。

公开(公告)号：US06409780B1

公开(公告)日：2002-06-25

申请号：US09482937

申请日：2000-01-14

申请人： Hiroyuki Yano ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Kiyonobu Kubota

发明人： Hiroyuki Yano ,  Nobuo Hayasaka ,  Katsuya Okumura ,  Akira Iio ,  Masayuki Hattori ,  Kiyonobu Kubota

IPC分类号： C09K314

CPC分类号： C09G1/02 ,  C09K3/1463

摘要： Water-laden solid matter is provided which is obtained by adding 40 to 300 weight parts of water to 100 weight parts of inorganic oxide particles synthesized by fumed process or metal evaporation oxidation process, slurry for polishing is provided which is manufactured by using the water-laden solid matter, and a method for manufacturing a semiconductor device using the above slurry. Said water-laden solid matter is within a range of 0.3 to 3 g/cm3 in bulk density and within a range of 0.5 to 100 mm&phgr; in average particle size when manufactured granular. Said slurry for polishing is manufactured from the water-laden solid matter, and the average particle size thereof after being dispersed in water is within a range of 0.05 to 1.0 &mgr;m.

摘要翻译： 提供含水固体物质，其通过向通过热解法或金属蒸发氧化法合成的100重量份的无机氧化物颗粒中加入40至300重量份的水而获得，提供了通过使用水 - 负载固体物质，以及使用上述浆料制造半导体器件的方法。 所述含水固体物质的体积密度为0.3〜3g / cm 3，制粒时的平均粒径为0.5〜100mmφ的范围。 用于抛光的所述浆料由含水固体物质制成，其在分散在水中的平均粒径在0.05-1.0μm的范围内。

公开(公告)号：US06068769A

公开(公告)日：2000-05-30

申请号：US135840

申请日：1998-08-18

申请人： Akira Iio ,  Masayuki Hattori ,  Masayuki Motonari

发明人： Akira Iio ,  Masayuki Hattori ,  Masayuki Motonari

IPC分类号： B01F3/12 ,  B01F7/00 ,  B01F7/30 ,  B24B37/04 ,  B24B57/02 ,  C09D17/00 ,  C09K3/14 ,  B01D24/00 ,  B01D37/00 ,  B03B1/00 ,  C04B33/00

CPC分类号： B24B37/04 ,  B01F3/1221 ,  B01F3/1271 ,  B01F7/30 ,  B24B57/02 ,  C09D17/004 ,  C09K3/1463 ,  B01F2215/0031 ,  B01F2215/005 ,  B01F7/00991

摘要： The present invention provides aqueous dispersion slurry of inorganic particles which is so stable as not to increase in viscosity, gel or sediment even if stored for a long time and therefore can be used as raw materials for, for example, cosmetics, paint, coating materials and lapping slurry for semiconductor wafers, and production method of such aqueous dispersion slurry. The aqueous dispersion slurry according to the present invention has the number of particles whose a particle diameter of 1.3 .mu.m or more is 180,000 or less per mL in terms of 30 wt % in concentration, and the average particle diameter thereof is in a range of 0.05-0.9 .mu.m. The number of particles having aparticle diameter of 1.3 .mu.m or more is counted by using Particle Sensor KS-60, which is a light extinction type sensor for detecting particles, and Particle Counter KL-11, which is a particle counter, both of which made by the same manufacturer, Rion Electro Corp. The average particle diameter is measured by using Laser Particle Analyzer System Par-III made by Otsuka Denshi Co., Ltd.

摘要翻译： 本发明提供无机颗粒的水性分散体浆料，其即使长时间贮存也非常稳定，不会增加粘度，凝胶或沉淀物，因此可用作例如化妆品，油漆，涂料的原料 和研磨用于半导体晶片的浆料，以及这种水分散浆料的制造方法。 本发明的水性分散体浆料的粒径为1.3μm以上的粒子数为30,000重量％以下，其浓度为30重量％，平均粒径为 0.05-0.9亩。 通过使用作为用于检测粒子的消光型传感器的粒子传感器KS-60和作为粒子计数器的粒子计数器KL-11，对具有1.3μm以上的粒径的粒子的数量进行计数 由同一制造商Rion Electro Corp.制造。平均粒径通过使用由Otsuka Denshi Co.，Ltd制造的激光粒子分析仪系统Par-III来测量。

公开(公告)号：US06565767B2

公开(公告)日：2003-05-20

申请号：US09897129

申请日：2001-07-03

申请人： Masayuki Hattori ,  Masayuki Motonari ,  Akira Iio

发明人： Masayuki Hattori ,  Masayuki Motonari ,  Akira Iio

IPC分类号： C09K1300

CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1436

摘要： The polymer particles of the invention are characterized by being obtained by polycondensation of at least one from among Compound 1 represented by general formula (1), its hydrolysates and its partial condensates, and at least one from among Compound 2 represented by general formula (2), its hydrolysates and its partial condensates, and by having a mean particle size of 3-1000 nm. M(OR1)z  (1) (R2)nM(OR3)z-n  (2) where M is Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ge, Zr, Nb, Mo, Sn, Sb, Ta, W, Pb or Ce; z is the atomic valence of M; R1 and R3 are each an alkyl group of 1-5 carbon atoms, an acyl group of 1-6 carbon atoms or an aryl group of 1-9 carbon atoms; R2 is a monovalent organic group of 1-8 carbon atoms; n is an integer of from 1 to (z−2); and R1, R2 and R3 may be the same or different. These particles are used in polishing compositions used for chemical mechanical polishing.

摘要翻译： 本发明的聚合物颗粒的特征在于通过由通式（1）表示的化合物1，其水解产物和其部分缩合物中的至少一种和通式（2）表示的化合物2中的至少一种缩合得到 ），其水解物及其部分缩合物，平均粒径为3-1000nm。其中，M为Al，Si，Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Zn，Ge，Zr ，Nb，Mo，Sn，Sb，Ta，W，Pb或Ce; z是M的原子价; R1和R3分别是1-5个碳原子的烷基，1-6个碳原子的酰基或1-9个碳原子的芳基; R2是1-8个碳原子的一价有机基团; n为1〜（z-2）的整数。 并且R 1，R 2和R 3可以相同或不同。 这些颗粒用于用于化学机械抛光的抛光组合物中。

公开(公告)号：US4036901A

公开(公告)日：1977-07-19

申请号：US625380

申请日：1975-10-24

申请人： Masato Kawakami ,  Naoki Andoh ,  Akira Iio ,  Haruo Yamanouchi

发明人： Masato Kawakami ,  Naoki Andoh ,  Akira Iio ,  Haruo Yamanouchi

IPC分类号： C07C5/367 ,  B01J23/00 ,  B01J23/31 ,  B01J23/887 ,  C07B61/00 ,  C07C1/00 ,  C07C5/48 ,  C07C15/46 ,  C07C67/00 ,  C07C15/00 ,  C07C15/10

CPC分类号： B01J23/8876 ,  B01J23/31 ,  C07C5/48

摘要： A process for producing styrene which comprises subjecting 4-vinylcyclohexene to gas phase catalytic oxidation with a molecular oxygen-containing gas, for example, air, characterized in that the oxidation is carried out by use of a catalyst composition represented by the general formula,Mo.sub.12 Bi.sub.0.1.sub.-10 Fe.sub.0.sub.-15 Co.sub.0.sub.-15 Pb.sub.0.sub.-15 X.sub.0.sub.-10 Y.sub.0.sub.-3 O.sub.nwherein X is at least one element selected from the group consisting of zirconium, cadmium, niobium, and antimony; Y is at least one element selected from the group consisting of lithium, sodium, potassium, rubidium, cesium and thallium; 1.ltoreq.Fe + Co + Pb.ltoreq.25; and n is the number of oxygen atoms sufficient to replenish the valences of other elements. According to the above-mentioned process, styrene can be produced in a high yield.

摘要翻译： 一种生产苯乙烯的方法，其包括用含有分子氧的气体例如空气对4-乙烯基环己烯进行气相催化氧化，其特征在于，使用由通式Mo12Bi0表示的催化剂组合物进行氧化 .1-10Fe0-15Co0-15Pb0-15X0-10Y0-3On其中X是选自锆，镉，铌和锑中的至少一种元素; Y是选自锂，钠，钾，铷，铯和铊中的至少一种元素; 1 25; 并且n是足以补充其它元素的化合价的氧原子数。 根据上述方法，可以高产率生产苯乙烯。

公开(公告)号：US5164469A

公开(公告)日：1992-11-17

申请号：US648237

申请日：1991-01-31

申请人： Kohei Goto ,  Zen Komiya ,  Noboru Yamahara ,  Akira Iio ,  Masao Hisatomi ,  Hiroshi Oka

发明人： Kohei Goto ,  Zen Komiya ,  Noboru Yamahara ,  Akira Iio ,  Masao Hisatomi ,  Hiroshi Oka

IPC分类号： C08G61/08 ,  C08L65/00

CPC分类号： C08L65/00 ,  C08G61/08

摘要： A transparent resin material consisting of a hydrogenation product of a (co)polymer obtained by subjecting at least one compound represented by general formula (I) or a combination of at least 5% by weight of said compound and 95% by weight or less of other copolymerizable cyclic olefin monomer to metathesis polymerization: ##STR1## wherein A and B are independently hydrogen atoms or C.sub.1-10 hydrocarbon groups; and X and Y are independently hydrogen atoms, C.sub.1-10 hydrocarbon groups, --C(CH.sub.2).sub.n COOR.sup.1 groups or --(CH.sub.2).sub.n OCOR.sup.1 groups [R.sup.1 is a C.sub.1-20 hydrocarbon group and n is 0 or an integer of 1-10] with the proviso that at least one of X and Y is selected from the above --(CH.sub.2).sub.n COOR.sup.1 and --(CH.sub.2).sub.n OCOR.sup.1 groups. Said transparent resin material is moldable and has sufficient optical properties, low hygroscopicity, good heat resistance and excellent adhesion to recording layer.

摘要翻译： 将由通式（I）表示的至少一种化合物或至少5重量％的所述化合物的组合和95重量％以下的化合物所得的（共）聚合物的氢化产物组成的透明树脂材料 其它可共聚的环烯烃单体进行复分解聚合反应：其中A和B独立地为氢原子或C 1-10烃基; 并且X和Y独立地是氢原子，C 1-10烃基，-C（CH 2）n COOR 1基团或 - （CH 2）nOCOR 1基团[R 1是C 1-20烃基，n是0或1-10的整数] 条件是X和Y中的至少一个选自上述 - （CH 2）n COOR 1和 - （CH 2）nOCOR 1基团。 所述透明树脂材料是可模塑的并且具有足够的光学性能，低吸湿性，良好的耐热性和对记录层的优异粘合性。

公开(公告)号：US5053471A

公开(公告)日：1991-10-01

申请号：US613939

申请日：1990-11-13

申请人： Kohei Goto ,  Zen Komiya ,  Noboru Yamahara ,  Akira Iio

发明人： Kohei Goto ,  Zen Komiya ,  Noboru Yamahara ,  Akira Iio

IPC分类号： C08G61/08 ,  C08L65/00

CPC分类号： C08L65/00 ,  C08G61/08 ,  G11B7/2538

摘要： A transparent resin material consisting of a (co)polymer obtained by subjecting at least one compound represented by the general formula (I) or a combination of said compound and other copolymerizable monomer to metathesis polymerization, or a hydrogenation product of the (co)polymer: ##STR1## wherein A and B are independently hydrogen atoms or C.sub.1-10 hydrocarbon groups; X and Y are independently hydrogen atoms, C.sub.1-10 hydrocarbon groups, halogen atoms, halogen-substituted C.sub.1-10 hydrocarbon groups, --(CH.sub.2).sub.n COOR.sup.1, --(CH.sub.2).sub.n OCOR.sup.1, --(CH.sub.2).sub.n OR.sup.1, --(CH.sub.2).sub.n CN, --(CH.sub.2).sub.n CONR.sup.2 R.sup.3, --(CH.sub.2).sub.n COOZ, --(CH.sub.2).sub.n OCOZ, --(CH.sub.2).sub.n OZ or --(CH.sub.2).sub.n W [R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are independently C.sub.1-20 hydrocarbon groups, Z is a halogen-substituted hydrocarbon group, W is SiR.sub.p.sup.5 D.sub.3-p (R.sup.5 is a C.sub.1-10 hydrocarbon group, D is a halogen atom, --OCOR.sup.5 or --OR.sup.5, p is 0 or an integer of 1-3), n is 0 or an integer of 1-10] with the proviso that at least one of X and Y is selected from the above groups other than the hydrogen atom and the hydrocarbon groups, or X and Y may form together ##STR2## and m is 0 or 1. Said transparent resin material is moldable and has sufficient optical properties, low hygroscopicity, good heat resistance and excellent adhesion to recording layer.

公开(公告)号：US5202388A

公开(公告)日：1993-04-13

申请号：US800231

申请日：1991-11-29

申请人： Akira Iio ,  Noboru Oshima ,  Yosihiro Ohira ,  Masao Sakamoto ,  Hiroshi Oka

发明人： Akira Iio ,  Noboru Oshima ,  Yosihiro Ohira ,  Masao Sakamoto ,  Hiroshi Oka

IPC分类号： C08F8/04 ,  C08G61/08

CPC分类号： C08G61/08

摘要： A process for producing a hydrogenation product of ring-opening polymer by hydrogenating, in the presence of a hydrogenation catalyst, the non-aromatic carbon-to-carbon double bond present in a ring-opening polymer obtained by subjecting to ring-opening polymerization at least one norbornene derivative represented by general formula (I): ##STR1## wherein A and B independently represent hydrogen atoms or hydrocarbon groups having 1-10 carbon atoms, X and Y independently represent hydrogen atoms, halogen atoms or monovalent organic groups, and m is 0 or 1, alone or in combination with a monomer copolymerizable with said norbronene derivative, characterized by using, as the hydrogenation catalyst, a ruthenium compound represented by general formula (II):RuH.sub.k Q.sub.n T.sub.p Z.sub.q (11)wherein Q represents a halogen atom, T represents at least one atomic group selected from the group consisting of CO, NO and CH.sub.3 COCH.sub.2 COCH.sub.3, Z represents PR.sup.1 R.sup.2 R.sup.3 (R.sup.1, R.sub.2 and R.sup.3 independently represent alkyl groups, alkenyl groups or phenyl groups), k is 1 or 2, n is 0, 1 or 2, p is 1 or 2, and q is 2 or 3. This process enables hydrogenation with a small amount of a hydrogenation catalyst in a very high hydrogenation degree even when the polymer to be hydrogenated is a ring-opening polymer of a specific tetracyclodeodecene compound, and enables the hydrogenation reaction to be carried out easily.

摘要翻译： 一种开环聚合物的氢化产物的制备方法，在氢化催化剂的存在下，通过在通式（I）中进行开环聚合得到的开环聚合物中存在的非芳族碳 - 碳双键氢化， 由通式（I）表示的至少一种降冰片烯衍生物：其中A和B独立地表示氢原子或具有1-10个碳原子的烃基，X和Y独立地表示氢原子，卤素原子或一价有机基团 ，并且m为0或1，单独或与可与所述降冰片烯衍生物共聚的单体组合，其特征在于使用由通式（II）表示的钌化合物作为氢化催化剂：RuHkQnTpZq（11）其中Q表示卤素 原子，T表示选自CO，NO和CH 3 COCH 2 COCH 3中的至少一个原子团，Z表示PR1R2R3（R1，R2和R3独立地表示烷基，烯烃 基团或苯基），k为1或2，n为0,1或2，p为1或2，q为2或3.该方法可使用少量氢化催化剂进行非常高的氢化 氢化程度即使待氢化的聚合物是特定四环十二碳烯化合物的开环聚合物，并且能够容易地进行氢化反应。