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    Barbituric acid derivatives
    2.
    发明授权
    Barbituric acid derivatives 失效
    巴比妥酸衍生物

    公开(公告)号：US3999974A

    公开(公告)日：1976-12-28

    申请号：US581625

    申请日：1975-05-28

    申请人： Yoshihiko Hirono ,  Hisao Ishikawa ,  Isao Iwataki ,  Mikio Sawaki ,  Osami Nomura

    发明人： Yoshihiko Hirono ,  Hisao Ishikawa ,  Isao Iwataki ,  Mikio Sawaki ,  Osami Nomura

    IPC分类号： C07D239/62 ,  A01M20060101 ,  A01N43/54 ,  A01N47/34 ,  A01P13/00 ,  C07D20060101 ,  C07D239/60

    CPC分类号： C07D413/12

    摘要： A compound of the formula ##STR1## wherein R.sub.1 is selected from the group consisting of hydrogen, lower alkyl, phenyl and phenyl substituted with halogen or halogenated methyl;R.sub.2 is selected from the group consisting of hydrogen, lower alkyl and lower alkenyloxy;R.sub.3 is selected from the group consisting of lower alkyl and phenyl substituted with halogen;R.sub.4 is selected from the group consisting of lower alkyl, lower alkenyl and benzyl;Or a metal salt of the compound defined herein above; is useful as herbicide.

    摘要翻译： 式IMA的化合物，其中R 1选自氢，低级烷基，苯基和被卤素或卤代甲基取代的苯基; R2选自氢，低级烷基和低级烯氧基; R3选自低级烷基和被卤素取代的苯基; R4选自低级烷基，低级烯基和苄基; 或以上定义的化合物的金属盐; 有用作除草剂。

    .alpha.-Pyrone derivatives
    3.
    发明授权
    .alpha.-Pyrone derivatives 失效
    {60-吡喃酮衍生物

    公开(公告)号：US3972899A

    公开(公告)日：1976-08-03

    申请号：US414300

    申请日：1973-11-09

    申请人： Mikio Sawaki ,  Isao Iwataki ,  Hisao Ishikawa ,  Shozo Yamada ,  Yasushi Yasuda

    发明人： Mikio Sawaki ,  Isao Iwataki ,  Hisao Ishikawa ,  Shozo Yamada ,  Yasushi Yasuda

    IPC分类号： C07D309/38 ,  A01N9/20

    摘要： Compounds of the formula ##SPC1##Wherein R.sub.1 and R.sub.2 are alkyl having 2 to 6 carbon atoms or phenyl; R.sub.3 is alkyl having 1 to 10 carbon atoms, alkenyl or alkynyl having up to six carbon atoms; R is alkyl of 1 to 20 carbon atoms, phenyl or phenyl substituted with halogen, methyl, methoxy or nitro; and A is carbonyl or sulfonyl, are effective as herbicides, plant growth regulators and fungicides.

    摘要翻译： 式WHEREIN R 1和R 2的化合物是具有2至6个碳原子的烷基或苯基; R3是具有1至10个碳原子的烷基，具有至多6个碳原子的烯基或炔基; R为1-20个碳原子的烷基，苯基或被卤素，甲基，甲氧基或硝基取代的苯基; A为羰基或磺酰基，作为除草剂，植物生长调节剂和杀真菌剂有效。

    Soldering equipment and soldering method for electronic components
    4.
    发明授权
    Soldering equipment and soldering method for electronic components 有权
    焊接设备及焊接方法

    公开(公告)号：US08011562B2

    公开(公告)日：2011-09-06

    申请号：US12600399

    申请日：2009-08-29

    申请人： Hisao Ishikawa ,  Masanori Yokoyama

    发明人： Hisao Ishikawa ,  Masanori Yokoyama

    IPC分类号： B23K31/02

    CPC分类号： B23K1/085 ,  B23K1/0016 ,  B23K3/0653 ,  B23K2101/42 ,  B23K2103/12 ,  C22B25/08 ,  H05K3/3468

    摘要： A tin or solder alloy film is formed by ejecting molten tin liquid or molten solder alloy liquid in a jet state onto a copper surface of an electronic component. The overflowing molten tin or molten solder alloy liquid is transported to a stirrer. Then, cuprate and the like mixed in the overflowing molten tin or molten solder alloy liquid are taken in to the organic fatty acid solution by fiercely stirring and mixing the molten tin or molten solder alloy liquid in contact with a solution at a temperature of 180 to 350° C. containing 1 to 80 weight % of organic fatty acid having 12 to 20 carbon number that circulates in the stirrer to purify the overflowing molten tin or molten solder alloy liquid. The mixed solution is introduced into a reservoir of the organic fatty acid solution, and the purified molten tin solution or molten solder alloy liquid separated according to the specific gravity difference in the reservoir of the organic fatty acid solution is returned from the bottom of the organic fatty acid solution reservoir to the reservoir of the molten tin or molten solder liquid by a pump for circulation use. By means of this, copper is prevented from accumulating in the molten tin or molten solder liquid, and thus it is possible to continuously perform a stable soldering process for a long term.

    摘要翻译： 通过将喷射状态的熔融锡液体或熔融焊料合金液体喷射到电子部件的铜表面上来形成锡或焊料合金膜。 将溢出的熔融锡或熔融的焊料合金液体输送到搅拌器。 然后，在溢出的熔融锡或熔融的焊料合金液中混合的铜酸盐等通过在与180℃的温度下与溶液接触的熔融锡或熔融焊料合金液体剧烈搅拌和混合而被吸入有机脂肪酸溶液中 350℃，含有1至80重量％的具有12至20个碳数的有机脂肪酸，其在搅拌器中循环以净化溢出的熔融锡或熔融的焊料合金液体。 将混合溶液引入有机脂肪酸溶液的储存器中，并且根据有机脂肪酸溶液的储存器中的比重差分离的纯化的熔融锡溶液或熔融的焊料合金液体从有机脂肪酸溶液的底部返回 通过用于循环使用的泵将脂肪酸溶液储存在熔融锡或熔融焊料液体的储存器中。 借此，可以防止铜在熔融锡或熔融焊料液中积聚，从而可以长期连续地进行稳定的焊接工艺。

    Production Method and Production Apparatus of Tin or Solder Alloy for Electronic Components, and Solder Alloy
    5.
    发明申请
    Production Method and Production Apparatus of Tin or Solder Alloy for Electronic Components, and Solder Alloy 有权
    锡或锡合金电子元器件和焊料合金的生产方法和生产设备

    公开(公告)号：US20110089567A1

    公开(公告)日：2011-04-21

    申请号：US12600410

    申请日：2009-04-13

    申请人： Hisao Ishikawa ,  Masanori Yokoyama

    发明人： Hisao Ishikawa ,  Masanori Yokoyama

    IPC分类号： H01L23/48 ,  B23K35/22 ,  C22B9/10

    CPC分类号： C22B9/10 ,  B23K35/262 ,  B23K35/40 ,  B23K2101/36 ,  C22B9/02 ,  C22B9/106 ,  C22B25/08 ,  H01L2924/0002 ,  Y02P10/234 ,  H01L2924/00

    摘要： The invention provides a technique and a device that dramatically improve joint reliability of miniature joints of fine electronic components. According to the invention, when producing a tin or a solder alloy used for electronic components, an ingot of a tin or a solder alloy is heated, melted and delivered to a reactor. Also, a solution containing organic acid having a carboxyl group (—COOH) is delivered to the reactor. After stirring and mixing the two liquids intensively, the mixed liquid is separated into a molten tin or a molten solder alloy liquid and an organic acid solution according to the difference in specific gravity. Then, the respective liquids are circulated to the reactor, and the metal oxides and the impurities existing in the molten tin or the molten solder alloy are removed, and the molten tin or the molten alloy is purified to have oxygen concentration of 5 ppm or less.

    摘要翻译： 本发明提供了一种显着提高精细电子部件的微型接头的接头可靠性的技术和装置。 根据本发明，当制造用于电子部件的锡或焊料合金时，锡或焊料合金的锭被加热，熔化并输送到反应器。 此外，将含有羧基（-COOH）的有机酸的溶液输送到反应器。 在两种液体浓缩搅拌混合后，根据比重差将混合液分离成熔融锡或熔融焊剂合金液体和有机酸溶液。 然后，将各液体循环到反应器中，除去存在于熔融锡或熔融焊料合金中的金属氧化物和杂质，将熔融锡或熔融合金纯化成氧浓度为5ppm以下 。

    Soldering Equipment and Soldering Method for Electronic Components
    9.
    发明申请
    Soldering Equipment and Soldering Method for Electronic Components 有权
    电子元器件焊接设备及焊接方法

    公开(公告)号：US20110079633A1

    公开(公告)日：2011-04-07

    申请号：US12600399

    申请日：2009-08-29

    申请人： Hisao Ishikawa ,  Masanori Yokoyama

    发明人： Hisao Ishikawa ,  Masanori Yokoyama

    IPC分类号： B23K1/20 ,  B23K3/00

    CPC分类号： B23K1/085 ,  B23K1/0016 ,  B23K3/0653 ,  B23K2101/42 ,  B23K2103/12 ,  C22B25/08 ,  H05K3/3468

    摘要： A tin or solder alloy film is formed by ejecting molten tin liquid or molten solder alloy liquid in a jet state onto a copper surface of an electronic component. The overflowing molten tin or molten solder alloy liquid is transported to a stirrer. Then, cuprate and the like mixed in the overflowing molten tin or molten solder alloy liquid are taken in to the organic fatty acid solution by fiercely stirring and mixing the molten tin or molten solder alloy liquid in contact with a solution at a temperature of 180 to 350° C. containing 1 to 80 weight % of organic fatty acid having 12 to 20 carbon number that circulates in the stirrer to purify the overflowing molten tin or molten solder alloy liquid. The mixed solution is introduced into a reservoir of the organic fatty acid solution, and the purified molten tin solution or molten solder alloy liquid separated according to the specific gravity difference in the reservoir of the organic fatty acid solution is returned from the bottom of the organic fatty acid solution reservoir to the reservoir of the molten tin or molten solder liquid by a pump for circulation use. By means of this, copper is prevented from accumulating in the molten tin or molten solder liquid, and thus it is possible to continuously perform a stable soldering process for a long term.

    摘要翻译： 通过将喷射状态的熔融锡液体或熔融焊料合金液体喷射到电子部件的铜表面上来形成锡或焊料合金膜。 将溢出的熔融锡或熔融的焊料合金液体输送到搅拌器。 然后，在溢出的熔融锡或熔融的焊料合金液中混合的铜酸盐等通过在与180℃的温度下与溶液接触的熔融锡或熔融焊料合金液体剧烈搅拌和混合而被吸入有机脂肪酸溶液中 350℃，含有1至80重量％的具有12至20个碳数的有机脂肪酸，其在搅拌器中循环以净化溢出的熔融锡或熔融的焊料合金液体。 将混合溶液引入有机脂肪酸溶液的储存器中，并且根据有机脂肪酸溶液的储存器中的比重差分离的纯化的熔融锡溶液或熔融的焊料合金液体从有机脂肪酸溶液的底部返回 通过用于循环使用的泵将脂肪酸溶液储存在熔融锡或熔融焊料液体的储存器中。 借此，可以防止铜在熔融锡或熔融焊料液中积聚，从而可以长期连续地进行稳定的焊接工艺。