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公开(公告)号：US5173544A
公开(公告)日：1992-12-22
申请号：US523814
申请日：1990-05-16
摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, and a copolymer mixture comprising a long-chain organopolysiloxane copolymer [I] and a short-chain organopolysiloxane copolymer [II] which are each prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain or short-chain organopolysiloxane containing pendant phenyl groups at a weight ratio of [II] to [I] of 0.3 to 0.6 is disclosed. The epoxy resin composition exhibits excellent printability, crack resistance, and moldability properties.
摘要翻译： 包含环氧树脂，固化剂和包含长链有机聚硅氧烷共聚物[I]和短链有机聚硅氧烷共聚物[II]的共聚物混合物的环氧树脂组合物，其各自通过含链烯基的 公开了具有含有重量比[II]至[I]为0.3至0.6的侧基苯基的长链或短链有机聚硅氧烷的环氧树脂。 环氧树脂组合物表现出优异的可印刷性，抗龟裂性和成型性。
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2.发明授权
公开(公告)号：US5298548A
公开(公告)日：1994-03-29
申请号：US885965
申请日：1992-05-20
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/32 , C08G59/38 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/22
CPC分类号： H01B3/40 , C08G59/3218 , C08G59/38 , C08L63/00
摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
摘要翻译： 包含（A）含萘环氧树脂，（B）含联苯的环氧树脂，（C）特定酚醛树脂和（D）无机填料的环氧树脂组合物显示出良好的流动性和固化性， 弹性模量，特别是在高于Tg的温度下，低膨胀系数，高Tg，不论低应力如何，吸水率最小化。 然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。
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公开(公告)号：US5243058A
公开(公告)日：1993-09-07
申请号：US824967
申请日：1992-01-24
IPC分类号： C07C39/225 , C07C43/215 , C07D303/24 , C08G59/24 , C08G59/32 , C08G59/40
CPC分类号： C07C43/215 , C07C39/225 , C07D303/24 , C08G59/245 , C08G59/3218 , C08G59/4042
摘要： A naphthalene derivative of the following general formula (1) having at least one allyl or propenyl group is described. ##STR1## In the formula, each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom, an allyl group or a propenyl group provided that at least one or R.sup.1 's is an allyl group or a propenyl group, and R.sup.2 's independently represent a hydrogen atom, an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, or a halogen atom. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.
摘要翻译： 描述了具有至少一个烯丙基或丙烯基的下述通式（1）的萘衍生物。 （1）在该式中，每个G表示氢原子，或者如果至少一个或R 1为烯丙基或丙烯基，则R 1独立地表示氢原子，烯丙基或丙烯基， 并且R 2独立地表示氢原子，具有1至6个碳原子的未取代或取代的一价烃基或卤素原子。 该衍生物可用于改性可固化树脂或树脂组合物以提供具有低吸水性，高强度和高玻璃化转变温度的固化产物。 该衍生物具有良好的加工性能和良好的耐热性。
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公开(公告)号：US5171869A
公开(公告)日：1992-12-15
申请号：US825222
申请日：1992-01-24
IPC分类号： C07D303/27 , C07C39/225 , C07D303/24 , C08F290/00 , C08F299/02 , C08G8/08 , C08G8/24 , C08G8/36 , C08G59/08 , C08G59/32
CPC分类号： C07D303/24 , C08G59/3218 , C08G8/08
摘要： A naphthalene of the following formula (1) having at least two allyl or propenyl groups ##STR1## wherein each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, R.sup.2 's independently represent a hydrogen atom, an allyl group or a propenyl group, R.sup.3 represents an allyl group or a propenyl group, X represents a hydrogen atom or a halogen atom, and n is an integer of from 0 to 6. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.
摘要翻译： 具有至少两个烯丙基或丙烯基的下式（1）的萘，其中每个G表示氢原子，或者R 1独立地表示氢原子或未取代或取代的一价烃基，其具有 1〜6个碳原子，R2独立地表示氢原子，烯丙基或丙烯基，R3表示烯丙基或丙烯基，X表示氢原子或卤素原子，n表示0〜 该衍生物可用于改性可固化树脂或树脂组合物以提供具有低吸水性，高强度和高玻璃化转变温度的固化产物。 该衍生物具有良好的加工性能和良好的耐热性。
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公开(公告)号：US5053445A
公开(公告)日：1991-10-01
申请号：US397739
申请日：1989-08-23
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
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公开(公告)号：US5300588A
公开(公告)日：1994-04-05
申请号：US863271
申请日：1992-04-03
CPC分类号： C08L79/085 , C08L83/10
摘要： A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer wherein component (B) and/or (C) has a double bond conjugated with an aromatic group and component (B) and/or (C) has a naphthalene ring. The composition is easily workable and cures to products having improved adhesion, heat resistance, low thermal expansion, and low water absorption.
摘要翻译： 热固性树脂组合物含有（A）具有马来酰亚胺基团的酰亚胺化合物，（B）环氧树脂，（C）酚醛树脂和任选的（D）芳族聚合物/有机聚硅氧烷共聚物，其中组分（B）和/或 （C）具有与芳族基团共轭的双键和（B）成分和/或（C）具有萘环。 该组合物易于加工和固化，具有改进的粘合性，耐热性，低热膨胀性和低吸水性的产品。
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公开(公告)号：US4877822A
公开(公告)日：1989-10-31
申请号：US179538
申请日：1988-04-08
CPC分类号： C08G59/027 , C08G77/42 , C08L63/00 , H05K1/0353
摘要： An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.
摘要翻译： 一种环氧树脂组合物，其包含可固化环氧树脂，固化剂，无机填料和至少一种共聚物，所述共聚物选自通过在含有一个或多个环氧基和一个或多个烯基的芳族聚合物之间的加成反应获得的共聚物， 有机聚硅氧烷; 通过含有一个或多个环氧基的芳族聚合物与特定含氨基的有机聚硅氧烷之间的加成反应获得的共聚物。
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公开(公告)号：US4701482A
公开(公告)日：1987-10-20
申请号：US865416
申请日：1986-05-21
CPC分类号： H01L23/293 , C08K3/0033 , C08L63/00 , H01L2924/0002
摘要： An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.
摘要翻译： 提出了适用于半导体器件封装的基于环氧树脂的组合物。 除了可热固化的环氧树脂和无机填料之外，树脂组合物还可以通过其中独特的成分提供高度抗裂纹形成的固化树脂封装，该无机填料是具有被烃基取代的烃基的有机聚硅氧烷的组合 某些功能组，例如 缩水甘油基，氨基，巯基等，以及由聚合芳族部分的链段和有机聚硅氧烷部分的链段组成的嵌段共聚物。
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9.发明授权White heat-curable silicone resin composition, optoelectronic part case, and molding method 有权白色可热固化硅树脂组合物，光电部件外壳和成型方法公开(公告)号：US08013056B2
公开(公告)日：2011-09-06
申请号：US12344048
申请日：2008-12-24
CPC分类号： C08L83/04 , C08G77/16 , C08G77/18 , C08K3/011 , C08K3/10 , C08K3/22 , C08K5/0025 , C08K5/56 , C08K2003/2241 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
摘要翻译： 一种有机硅树脂组合物，其包含（A）熔点为40-130℃的可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）固化催化剂的转移或压缩 在高温下成型为具有白色，耐热性，耐光性和最小黄化的固化产物。 固化产品适用于封装有光电子部件的情况。
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10.发明申请WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTOELECTRONIC PART CASE, AND MOLDING METHOD 有权白色可固化硅树脂组合物，光电部件和模制方法公开(公告)号：US20090171013A1
公开(公告)日：2009-07-02
申请号：US12344048
申请日：2008-12-24
CPC分类号： C08L83/04 , C08G77/16 , C08G77/18 , C08K3/011 , C08K3/10 , C08K3/22 , C08K5/0025 , C08K5/56 , C08K2003/2241 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
摘要翻译： 一种有机硅树脂组合物，其包含（A）熔点为40-130℃的可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）固化催化剂的转移或压缩 在高温下成型为具有白色，耐热性，耐光性和最小黄化的固化产物。 固化产品适用于封装有光电子部件的情况。
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