公开(公告)号：US20140287227A1

公开(公告)日：2014-09-25

申请号：US14178847

申请日：2014-02-12

申请人： HITACHI, LTD.

发明人： Motomune KODAMA ,  Takashi NAITO ,  Tadashi FUJIEDA ,  Yuichi SAWAI ,  Takuya AOYAGI ,  Masanori MIYAGI

IPC分类号： H01L23/00 ,  C03C8/24

CPC分类号： H01L24/29 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/10 ,  C04B2237/12 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/55 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2731 ,  H01L2224/29082 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29169 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29213 ,  H01L2224/29218 ,  H01L2224/29224 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29269 ,  H01L2224/29288 ,  H01L2224/29294 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29369 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32505 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83487 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/15788 ,  H01L2924/351 ,  Y10T428/265 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.

摘要翻译： 公开了一种接合体，其中多个基底构件通过接合层彼此接合，并且至少一个基底构件是陶瓷材料，半导体或玻璃的基底构件。 接合材料层含有金属和氧化物。 氧化物含有V和Te，并且存在于金属和基体之间。 还公开了含有含有V和Te，金属颗粒和溶剂的氧化物玻璃的糊状物的接合材料; 以包含V和Te的氧化物玻璃的颗粒嵌入的箔片或板的形式; 或以包含含有V和Te的氧化物玻璃层和金属层的箔片或板的形式。

公开(公告)号：US20150337106A1

公开(公告)日：2015-11-26

申请号：US14655522

申请日：2012-12-26

申请人： HITACHI, LTD.

发明人： Yuri KAJIHARA ,  Satoru AMOU ,  Takashi NAITO ,  Yuichi SAWAI ,  Motomune KODAMA

IPC分类号： C08K3/22

CPC分类号： C08K3/22 ,  C03C3/122 ,  C03C3/21 ,  C03C8/14 ,  C08K3/40 ,  C08K2003/2286

摘要： The purpose of the present invention is to provide a low-melting-point glass resin composite material with which the heat resistance and heat conductivity of an insulating resin can be improved. The low-melting-point glass resin composite material includes: a lead-free low-melting-point glass composition that contains Ag2O, V2O5, and TeO2, and in which the total content of Ag2O, V2O5, and TeO2 is 75 mass % or more; and a resin composition having a 5% thermal weight reduction temperature equal to or greater than a softening point temperature of the low-melting-point glass composition.

摘要翻译： 本发明的目的是提供一种能够提高绝缘树脂的耐热性和导热性的低熔点玻璃树脂复合材料。 低熔点玻璃树脂复合材料包括：含有Ag2O，V2O5和TeO2的无铅低熔点玻璃组合物，其中Ag2O，V2O5和TeO2的总含量为75质量％，或 更多; 以及具有等于或高于低熔点玻璃组合物的软化点温度的5％热重量还原温度的树脂组合物。

公开(公告)号：US20140285039A1

公开(公告)日：2014-09-25

申请号：US14177988

申请日：2014-02-11

申请人： Hitachi, Ltd.

发明人： Takuya AOYAGI ,  Motomune KODAMA ,  Takashi NAITO ,  Tadashi FUJIEDA ,  Yuichi SAWAI ,  Masanori MIYAGI ,  Haruo AKAHOSHI ,  Norihisa IWASAKI

IPC分类号： B23K35/02 ,  H02K3/02 ,  H01R4/02 ,  H02K5/00

CPC分类号： B23K35/025 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/282 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/32 ,  B23K35/3602 ,  H01R4/023 ,  H01R4/625 ,  H02K3/02

摘要： An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag2O in terms of oxides and the glass transition point is 180° C. or less.

摘要翻译： 一种铝线体，其中铝或铝合金电线和待接合的金属通过焊料接合，其中焊料包括包含钒和导电颗粒的氧化物玻璃。 焊料中所含的导电粒子优选为90体积％以下，氧化物玻璃为20体积％〜90体积％。 进一步优选地，氧化物玻璃的氧化物含有40质量％以上的Ag 2 O，玻璃化转变点为180℃以下。

公开(公告)号：US20130260095A1

公开(公告)日：2013-10-03

申请号：US13770722

申请日：2013-02-19

申请人： HITACHI, LTD.

发明人： Yuzuru SHIMAZAKI ,  Takashi NAITO ,  Takuya AOYAGI ,  Yuichi SAWAI ,  Tadashi FUJIEDA ,  Akihiro MIYAUCHI ,  Masahiko OGINO

IPC分类号： C03C4/00

CPC分类号： C03C4/00 ,  C03C3/16 ,  C03C3/21 ,  Y10T428/24355

摘要： A glass substrate having a fine structure on the surface thereof, wherein said glass substrate is made of vanadium-containing glass and said vanadium-containing glass has a resistivity no higher than 109 Ω·cm, with the content of vanadium (in the form of V2O5) being no less than 10 wt % and no more than 60 wt %. The glass substrate prevents dust attraction and retains its antifouling properties over a long period of time.

摘要翻译： 在其表面具有微细结构的玻璃基板，其中所述玻璃基板由含钒玻璃制成，所述含钒玻璃的电阻率不高于109Ω·cm，钒的含量（以 V 2 O 5）不小于10重量％且不大于60重量％。 玻璃基板防止吸尘，并在长时间内保持其防污性能。