摘要:
Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.
摘要:
Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.
摘要:
There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts. wt. or more and 250 pts. wt. or less with respect to 100 pts. wt. of the mixed resin composition.
摘要:
A crosslinked rubber is composed of rubber molecules, which, before crosslinking, contain hot dissociatable and cold associatable crosslinking groups to dissociate from each other in a hot state and associate together in a cold state, and silane crosslinking groups, and which, after molding, are silane-crosslinked together by a silanol condensation reaction of the silane crosslinking groups together with moisture, with the hot dissociatable and cold associatable crosslinking groups associated together.