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公开(公告)号：US11359055B2
公开(公告)日：2022-06-14
申请号：US16676501
申请日：2019-11-07
发明人： Takao Tanigawa , Yasuyuki Mizuno , Tomio Fukuda , Yuki Nagai , Hikari Murai
IPC分类号： C08G73/10 , C08G65/333 , C08J5/24 , C08K5/51 , C08L63/00 , C08L71/12 , C08L79/04 , B32B27/00 , H05K1/03
摘要： Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
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公开(公告)号：US11930594B2
公开(公告)日：2024-03-12
申请号：US16325493
申请日：2016-08-15
发明人： Aya Kasahara , Yasuyuki Mizuno , Hikari Murai
IPC分类号： H05K1/03 , C09J163/00 , H05K3/38 , H05K3/46
CPC分类号： H05K1/0373 , C09J163/00 , H05K3/38 , H05K3/4626 , C09J163/00 , C08L61/06 , C08K3/36
摘要： The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive film for a multilayer printed-wiring board, which includes a resin composition layer that is obtained by forming a layer of a resin composition containing: (A) a novolac type phenolic resin in which a dispersity (Mw/Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) ranges from 1.05 to 1.8; (B) an epoxy resin represented by general formula (1); and (C) inorganic filler, on a support film. An average particle size of the (C) inorganic filler in the resin composition layer is 0.1 μm or more, and a content of the (C) inorganic filler in a resin solid content ranges from 20% to 95% by mass.
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3.发明申请公开(公告)号：US20180098425A1
公开(公告)日：2018-04-05
申请号：US15831667
申请日：2017-12-05
发明人： Akiko Kawaguchi , Nozomu Takano , Yasuyuki Mizuno , Kazumasa Takeuchi , Shigeru Haeno , Yoshinori Nagai , Masato Fukui
IPC分类号： H05K1/03 , H01L23/14 , C08F220/18 , H05K3/42
CPC分类号： H05K1/0326 , C08F220/18 , C08F2220/1808 , C08F2220/1891 , H01L23/145 , H01L2924/0002 , H05K3/427 , Y10T428/31692 , Y10T428/31855 , H01L2924/00
摘要： The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm−1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm−1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
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公开(公告)号：US11432400B2
公开(公告)日：2022-08-30
申请号：US16324716
申请日：2017-08-14
摘要： Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150° C. to 230° C. in an amount of 10% by mass or more in a total amount of the residual solvent.
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公开(公告)号：US11041045B2
公开(公告)日：2021-06-22
申请号：US15570215
申请日：2016-04-28
发明人： Yuki Nagai , Yasuyuki Mizuno , Tomio Fukuda , Takao Tanigawa , Hikari Murai
IPC分类号： C08G65/333 , C08J5/24 , C08K5/3415 , C08L25/08 , C08L53/02 , C08L71/12 , B32B27/00 , C08K3/00 , C08L63/00 , C08G73/12 , C08L79/08 , C08L79/04 , C08K3/16 , C08L63/10
摘要： Provided are a resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a styrenic thermoplastic elastomer: wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
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公开(公告)号：US10519279B2
公开(公告)日：2019-12-31
申请号：US15570174
申请日：2016-04-28
发明人： Takao Tanigawa , Yasuyuki Mizuno , Tomio Fukuda , Yuki Nagai , Hikari Murai
IPC分类号： C08G73/10 , C08G65/333 , C08J5/24 , C08K5/51 , C08L63/00 , C08L71/12 , C08L79/04 , B32B27/00 , H05K1/03
摘要： Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
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7.发明授权公开(公告)号：US10251265B2
公开(公告)日：2019-04-02
申请号：US15831667
申请日：2017-12-05
发明人： Akiko Kawaguchi , Nozomu Takano , Yasuyuki Mizuno , Kazumasa Takeuchi , Shigeru Haeno , Yoshinori Nagai , Masato Fukui
IPC分类号： H05K1/03 , H01L23/14 , C08F220/18 , H05K3/42
摘要： The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm−1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm−1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
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公开(公告)号：US09828466B2
公开(公告)日：2017-11-28
申请号：US15301655
申请日：2015-04-06
发明人： Yasuyuki Mizuno , Tomio Fukuda , Takao Tanigawa , Yuki Nagai , Hikari Murai
IPC分类号： C08G65/48 , C08J5/24 , C08K3/00 , C08K5/3415 , C08L63/00 , C08L71/12 , H05K1/03 , C08L63/04 , C09D171/12 , C08G73/10
CPC分类号： C08G65/485 , C08G65/48 , C08G73/1071 , C08J5/24 , C08J2371/12 , C08J2400/24 , C08K3/00 , C08K5/3415 , C08L63/00 , C08L63/04 , C08L71/12 , C08L71/126 , C08L2201/02 , C08L2201/08 , C08L2203/20 , C09D171/12 , H05K1/0326 , H05K1/0373
摘要： A polyphenylene ether derivative having at least one N-substituted maleimide group represented by the following general formula (I) in a molecule, and a heat curable resin composition, a prepreg, a metal-clad laminate, and a multilayer printed wiring board, each of which uses the polyphenylene ether derivative: wherein R1 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, R2 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A1 represents a residual group represented by a specific general formula, m is an integer of 1 or more as the number of the structural unit, and x and y each is an integer of 1 to 4.
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