公开(公告)号：US20080124836A1

公开(公告)日：2008-05-29

申请号：US11646244

申请日：2006-12-28

申请人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

发明人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

IPC分类号： H01L21/77

CPC分类号： H01L22/20 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

公开(公告)号：US20080044931A1

公开(公告)日：2008-02-21

申请号：US11646291

申请日：2006-12-28

申请人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Che-Ya Chou ,  Shin-Hua Chao ,  Teck-Chong Lee ,  Song-Fu Yang ,  Chian-Chi Lin

发明人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Che-Ya Chou ,  Shin-Hua Chao ,  Teck-Chong Lee ,  Song-Fu Yang ,  Chian-Chi Lin

IPC分类号： H01L21/98

CPC分类号： H05K3/0052 ,  H01L21/485 ,  H01L24/97 ,  H01L24/98 ,  H01L25/50 ,  H05K3/225 ,  H05K2201/10598

摘要： A packaging substrate and a method of manufacturing the same are provided. The method includes following steps. First, a first substrate including at least one defected packaging unit and several first packaging units is provided. The defected packaging unit and the first packaging units are arranged in an array on the first substrate. Next, the defected packaging unit is removed from the first substrate to correspondingly form at least one opening in the first substrate. Then, a second substrate including at least one second packaging unit is provided. Later, the second packaging unit is separated from the second substrate. The area of the second packaging unit is less than that of the opening. Subsequently, the second packaging unit is disposed in the opening. The edge of the second packaging unit is placed partially against an inner wall of the opening.

摘要翻译： 提供了一种封装基板及其制造方法。 该方法包括以下步骤。 首先，提供包括至少一个缺陷包装单元和多个第一包装单元的第一基板。 缺陷包装单元和第一包装单元以阵列布置在第一基板上。 接下来，将缺陷的包装单元从第一基板移除，以相应地形成第一基板中的至少一个开口。 然后，提供包括至少一个第二包装单元的第二基板。 之后，第二包装单元与第二基板分离。 第二包装单元的面积小于开口面积。 随后，第二包装单元设置在开口中。 第二包装单元的边缘部分地放置在开口的内壁上。

公开(公告)号：US07445944B2

公开(公告)日：2008-11-04

申请号：US11646244

申请日：2006-12-28

申请人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

发明人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

IPC分类号： H01L21/00

CPC分类号： H01L22/20 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

摘要翻译： 提供了一种封装基板及其制造方法。 制造方法包括以下步骤。 首先，提供包括几个第一基板单元和至少一个缺陷基板单元的第一封装基板。 接下来，将缺陷的基板单元与包装基板分离，并且相应地在第一包装基板的框架中形成至少一个开口。 然后，设置第二基板单元。 第二基板单元的形状与开口的形状不同。 之后，第二基板单元设置在开口中。

公开(公告)号：US07581666B2

公开(公告)日：2009-09-01

申请号：US11905868

申请日：2007-10-05

申请人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

发明人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

IPC分类号： B23K31/12 ,  B23K20/00 ,  B23K31/00

CPC分类号： H01L24/93 ,  B23K20/004 ,  H01L2224/78901 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10S228/904

摘要： A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

摘要翻译： 提供了一种用于引线接合装置的引线接合方法。 引线接合装置至少包括第一引线接合器和第二引线接合器，用于分别在基板上的第一区域中的至少几个第一芯片和第二区域中的第二区域中的几个第二芯片。 引线键合方法包括以下步骤。 首先，获得第一区域和第二区域的初始位置坐标。 接下来，确定第一区域和第二区域之间的空间是否大于预定空间。 当第一区域和第二区域之间的空间大于预定空间时，第一引线接合器和第二引线接合器分别同时地接合第一芯片和第二芯片。

公开(公告)号：US20080035706A1

公开(公告)日：2008-02-14

申请号：US11646304

申请日：2006-12-28

申请人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

发明人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

IPC分类号： B23K20/12

CPC分类号： B23K20/005 ,  H01L2224/78 ,  H01L2924/14 ,  H01L2924/1433

摘要： A wire-bonding apparatus is used for wire-bonding at least a first chip and a second chip on a substrate at the same time. The wire-bonding apparatus includes at least a first capillary, a second capillary, a driving unit, a processing unit and a database. The driving unit is used for driving the first capillary and the second capillary. The processing unit is used for outputting a command to the driving unit to control the first capillary and the second capillary. The database is used for storing an operating parameter data. The processing unit controls the first capillary and the second capillary according to the operating parameter data.

摘要翻译： 引线接合装置用于同时将至少第一芯片和第二芯片引线接合在基板上。 引线接合装置至少包括第一毛细管，第二毛细管，驱动单元，处理单元和数据库。 驱动单元用于驱动第一毛细管和第二毛细管。 处理单元用于向驱动单元输出命令以控制第一毛细管和第二毛细管。 数据库用于存储操作参数数据。 处理单元根据操作参数数据控制第一毛细管和第二毛细管。

公开(公告)号：US07547575B2

公开(公告)日：2009-06-16

申请号：US11905804

申请日：2007-10-04

申请人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

发明人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

IPC分类号： B29C65/48 ,  H01L21/58

CPC分类号： H01L24/83 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/95 ,  H01L2221/68354 ,  H01L2224/743 ,  H01L2224/83 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10T156/1744

摘要： A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.

摘要翻译： 提供了一种管芯接合器及其管芯接合方法。 芯片焊接机包括晶片平台，排列平台，输送机，至少一个第一拾取装置和第二拾取装置。 晶片平台用于放置具有多个模具的晶片。 输送机用于承载和输送基材。 第一拾取装置用于拾取一个模具并将每个模具放置在排列平台上。 第二拾取装置用于拾取排列平台上的模具并将模具同时放置在基板上。

公开(公告)号：US20080102539A1

公开(公告)日：2008-05-01

申请号：US11905868

申请日：2007-10-05

申请人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

发明人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

IPC分类号： H01L21/60

CPC分类号： H01L24/93 ,  B23K20/004 ,  H01L2224/78901 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10S228/904

摘要： A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

摘要翻译： 提供了一种用于引线接合装置的引线接合方法。 引线接合装置至少包括第一引线接合器和第二引线接合器，用于分别在基板上的第一区域中的至少几个第一芯片和第二区域中的第二区域中的多个第二芯片接合。 引线键合方法包括以下步骤。 首先，获得第一区域和第二区域的初始位置坐标。 接下来，确定第一区域和第二区域之间的空间是否大于预定空间。 当第一区域和第二区域之间的空间大于预定空间时，第一引线接合器和第二引线接合器分别同时地接合第一芯片和第二芯片。

公开(公告)号：US20080085571A1

公开(公告)日：2008-04-10

申请号：US11905804

申请日：2007-10-04

申请人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

发明人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

IPC分类号： B29C65/48 ,  H01L21/58

CPC分类号： H01L24/83 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/95 ,  H01L2221/68354 ,  H01L2224/743 ,  H01L2224/83 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10T156/1744

摘要： A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.

摘要翻译： 提供了一种管芯接合器及其管芯接合方法。 芯片焊接机包括晶片平台，排列平台，输送机，至少一个第一拾取装置和第二拾取装置。 晶片平台用于放置具有多个模具的晶片。 输送机用于承载和输送基材。 第一拾取装置用于拾取一个模具并将每个模具放置在排列平台上。 第二拾取装置用于拾取排列平台上的模具并将模具同时放置在基板上。