Method for optimizing electrodeposition process of a plurality of vias in wafer
    1.
    发明授权
    Method for optimizing electrodeposition process of a plurality of vias in wafer 有权
    用于优化晶片中多个通孔的电沉积工艺的方法

    公开(公告)号:US09075941B2

    公开(公告)日:2015-07-07

    申请号:US13894420

    申请日:2013-05-14

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5009 G06F17/5077

    摘要: The presently claimed invention provides a method for optimizing an electrodeposition process of a plurality of vias in a wafer. Instead of simulating a large number of via on the wafer for via filling, a representative via is selected with the maximum value of critical factor, which is a function of process parameters. The filling of the representative via is simulated with different sampling points to find out the filling goodness in order to find out the optimized process windows of process parameters. An optimizer is also disclosed, which either provides sampling points or reduces sampling points under artificial neural network method. Calculation of filling goodness is used for evaluating via filling quality and further comparing among via fillings simulated at different sampling points. Consequently, the method of present invention is able to shorten the simulation time for via filling as well as provide a process window with high accuracy.

    摘要翻译: 本发明提供一种用于优化晶片中多个通孔的电沉积工艺的方法。 代替在晶片上模拟大量通孔以进行通孔填充,代表性通孔被选择为关键因素的最大值,其是过程参数的函数。 通过不同的采样点模拟代表通孔的填充,以找出填充性,以便找出工艺参数的优化过程窗口。 还公开了一种优化器,其可以在人工神经网络方法下提供采样点或减少采样点。 填充质量计算用于通过灌装质量进行评估,并进一步比较不同采样点模拟的通孔填充。 因此,本发明的方法能够缩短通孔填充的模拟时间,并且能够提供高精度的处理窗口。

    Method of analyzing at least two inhibitors simultaneously in a plating bath
    7.
    发明授权
    Method of analyzing at least two inhibitors simultaneously in a plating bath 有权
    在电镀浴中同时分析至少两种抑制剂的方法

    公开(公告)号:US09575032B2

    公开(公告)日:2017-02-21

    申请号:US14453636

    申请日:2014-08-07

    摘要: The presently claimed invention provides an accurate, fast, and cost effective method for determining the additive concentrations of at least two inhibitors simultaneously in an electroplating bath by using different electrical load conditions. The method of the present invention is able to determine additive concentrations of different inhibitors effectively during on-line feedback control for adjusting the amount of additives in the electroplating bath to maintain the additive concentrations within pre-defined limits during device production.

    摘要翻译: 本发明提供了通过使用不同的电负载条件在电镀浴中同时确定至少两种抑制剂的添加剂浓度的精确,快速和成本有效的方法。 本发明的方法能够在在线反馈控制期间有效地测定不同抑制剂的添加剂浓度,以调节电镀槽中的添加剂的量,以在装置生产期间将添加剂浓度保持在预定限度内。