摘要:
A hierarchical power supply noise monitoring device and system for very large scale integrated circuits. The noise-monitoring device is fabricated on-chip to measure the noise on the chip. The noise-monitoring system includes a plurality of on-chip noise-monitoring devices distributed strategically across the chip. A noise-analysis algorithm analyzes the noise characteristics from the noise data collected from the noise-monitoring devices, and a hierarchical noise-monitoring system maps the noise of each core to the system on chip.
摘要:
In a high density dynamic memory circuit, the sense amplifiers are shared by several bitlines in order to maintain a high density and low power design. However, the bitline equalization level drifts after several cycles of operation, caused by an unbalanced capacitance resulting from a size difference of n-FET and p-FET latches in the sense amplifiers. An extra compensating capacitance Ce is added to the NCS node to adjust the loading capacitance to eliminate the bitline drifting.
摘要:
A static redundancy arrangement for a circuit using a focused ion beam anti-fuse methodology which reduces the circuit layout area and the switching activity compared to a prior art dynamic redundancy scheme, resulting in less power, a simpler design and higher speed. Focused ion beam anti-fuse methodology is used to program redundancy for circuits, particularly wide I/O embedded DRAM macros. An anti-fuse array circuit is comprised of a plurality of anti-fuse programming elements, each of which comprises a latch circuit controlled by a set input signal, and an anti-fuse device which is programmed by a focused ion beam.
摘要:
A stacked block array architecture.for a SRAM memory for low power applications. The architecture turns on only the required data cells and sensing circuitry to access a particular set of data cells of interest. The wordline delay is reduced by using a shorter and wider wordline wire size. Although less power is consumed, the performance is improved by the reduction in loading of wordlines and bitlines.
摘要:
A static column redundancy scheme for a semiconductor memory such as an eDRAM. By utilizing the existing scan registers for SRAM array testing, the column redundancy information of each bank or each microcell of the memory chip can be scanned, stored and programmed during the power-on period. Two programming methods are disclosed to find the column redundancy information on the fly. In the first method, the column redundancy information is first stored in the SRAM, and is then written into the program registers of the corresponding bank or microcell location. In the second method, the column redundancy information is loaded directly into the program registers of a bank or microcell location according to the bank address information without loading the SRAM. Since the new static column redundancy scheme does not need to compare the incoming addresses, it eliminates the use of control and decoding circuits, which significantly reduces the power consumption for memory macros.
摘要:
The present invention is directed to a method of fabricating a dual gate structure for use in FET devices wherein the dual gate structure comprises a bottom gate that is substantially a mirror image of the top gate. The method utilizes a shallow trench isolation process for the purpose of planarization and gate alignment. Also disclosed is a dual gate structure which is fabricated utilizing the method of the present invention.
摘要:
The present invention is directed to a method of fabricating a dual gate structure for use in FET devices wherein the dual gate structure comprises a bottom gate that is substantially a mirror image of the top gate. The method utilizes a shallow trench isolation process for the purpose of planarization and gate alignment. Also disclosed is a dual gate structure which is fabricated utilizing the method of the present invention.
摘要:
A structure. The structure includes: a substrate, a first electrode in the substrate, first dielectric layer above both the substrate and the first electrode, a second dielectric layer above the first dielectric layer, and a fuse element buried in the first dielectric layer. The first electrode includes a first electrically conductive material. A top surface of the first dielectric layer is further from a top surface of the first electrode than is any other surface of the first dielectric layer. The first dielectric layer includes a first dielectric material and a second dielectric material. A bottom surface of the second dielectric layer is in direct physical contact with the top surface of the first dielectric layer. The second dielectric layer includes the second dielectric material.
摘要:
Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes semiconductor device structures characterized by reduced junction capacitance and drain induced barrier lowering. The semiconductor device structure of the design structure includes a semiconductor layer and a dielectric layer disposed between the semiconductor layer and the substrate. The dielectric layer includes a first dielectric region with a first dielectric constant and a second dielectric region with a second dielectric constant that is greater than the first dielectric constant.
摘要:
Contact forming methods and a related semiconductor device are disclosed. One method includes forming a first liner over the structure and the substrate, the first liner covering sidewall of the structure; forming a dielectric layer over the first liner and the structure; forming a contact hole in the dielectric layer to the first liner; forming a second liner in the contact hole including over the first liner covering the sidewall; removing the first and second liners at a bottom of the contact hole; and filling the contact hole with a conductive material to form the contact. The thicker liner(s) over the sidewall of the structure prevents shorting, and allows for at least maintaining any intrinsic stress in one or more of the liner(s).