摘要:
A hinge is mounted between a cover and a base of an electronic device. A lid covers the hinge and is attached securely to the base. The hinge has two tilting brackets, two tilting shafts, two linking assemblies and two actuating washers. Each tilting bracket has a mounting wing with an elongated hole and a mounting hole and a connecting wing with an abutting surface. The tilting shafts are mounted movably through the elongated holes. Each linking assembly has an actuating seat mounted around the tilting shaft, a holding seat formed on the actuating seat and protruding into the mounting hole and a resilient element mounted in the mounting hole and pressing against the holding seat. The actuating washers are mounted securely around the tilting shafts and selectively abut the abutting surfaces of the connecting wings to lift up the cover.
摘要:
A hinge is mounted between a cover and a base of an electronic device. A lid covers the hinge and is attached securely to the base. The hinge has an arced surface and a rotating shaft. When the cover is pivoted to a certain angle, the rotating shaft abuts the arced surface to lift up the cover so the cover is selectively distant away from the lid. Therefore, the shape of the electronic device does not need to be disfigured and the cover still does not bump against the lid.
摘要:
A hinge is mounted between a cover and a base of an electronic device. A lid covers the hinge and is attached securely to the base. The hinge has an arced surface and a rotating shaft. When the cover is pivoted to a certain angle, the rotating shaft abuts the arced surface to lift up the cover so the cover is selectively distant away from the lid. Therefore, the shape of the electronic device does not need to be disfigured and the cover still does not bump against the lid.
摘要:
A hinge is mounted between a cover and a base of an electronic device. A lid covers the hinge and is attached securely to the base. The hinge has a cam wing, a sleeve, a rotating shaft and a pin. The rotating shaft is mounted slidably in the sleeve. The pin is mounted slidably and transversely through the sleeve, is attached securely to the rotating shaft and slides along the outer edge of the cam wing. When the cover is pivoted to a certain angle, the pin slide at part of the cam wing having larger diameter to gradually lift up the cover so the cover is selectively distant away from the lid. Therefore, the shape of the electronic device does not need to be disfigured and the cover still does not bump against the lid.
摘要:
A hinge is mounted between a cover and a base of an electronic device. A lid covers the hinge and is attached securely to the base. The hinge has two cam wings, two tilting shafts and two actuating disks. The tilting shafts are mounted movably through the cam wings. The actuating disks are mounted respectively around the tilting shafts. Each actuating disk has an actuating protrusion sliding along the outer edge of the cam wing. When the cover is pivoted to a certain angle, the actuating protrusions slide at part of the cam wing having larger diameter to gradually lift up the cover so the cover is selectively distant away from the lid. Therefore, the shape of the electronic device does not need to be disfigured and the cover still does not bump against the lid.
摘要:
A handling device and method for voltage faults applicable for using in a computer system. The handling method includes acquiring a signal of voltage fault. According to the signal of voltage fault and by looking up at tables, an operating status of the computer system corresponding to the signal of voltage fault is acquired, and generating a control signal according to the operating status. Then, the computer system according to the control signal is restarted.
摘要:
A method for processing booting errors for a computer having multiple voltage regulator downs (VRDs) includes reading a boot sequence including multiple power-on stages, and each power-on stage corresponds to a boot voltage and one of the VRDs; performing the power-on stages according to the boot sequence, and determining whether an output voltage of the VRD corresponding to each power-on stage is equal to the corresponding boot voltage; and when the output voltage of any one of the VRDs is not equal to the corresponding boot voltage, performing a debugging procedure.
摘要:
An oxide semiconductor thin film transistor structure includes a substrate, a gate electrode disposed on the substrate, a semiconductor insulating layer disposed on the substrate and the gate electrode, an oxide semiconductor layer disposed on the semiconductor insulating layer, a patterned semiconductor layer disposed on the oxide semiconductor layer, and a source electrode and a drain electrode respectively disposed on the patterned semiconductor layer. The source electrode and the drain electrode are made of a metal layer.
摘要:
A process for fabricating passive plastic displays, comprising the steps of: adopting a roll-to-roll coating machine for fabricating a bottom substrate having a fist patterned conducting line, fabricating a top substrate having a second patterned conducting line and an active area of polymeric liquid crystal on the surface of the top substrate by means of a roll-to-roll coating machine, and sealing the top and the bottom substrates by means of a roll-to-roll coating machine to form a plurality of display panels. Due to the continuous fabrication of the present invention with the low-cost apparatuses, applications of the plastic displays in the low-end products can be accelerated.
摘要:
The invention provides a TFT electrode structure and its manufacturing method that can prevent metal diffusion occurring in the fabrication of a TFT, and thereby reduce the risk of contamination of the chemical vapor deposition process due to metallic ion diffusion. The transparent pixel electrode is formed after the gate electrode metal so that the pixel transparent electrode can be used as a barrier layer to prevent metal diffusion under high temperature from the gate electrode metal to adjacent insulating layers or the active layer. Further, the method used to form the transparent pixel electrode is a low-temperature physical vapor deposition process, which affected less by the processing environment, and the transparent pixel electrode is a conductive layer that is not affected by metal diffusion.