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公开(公告)号：US08502620B2
公开(公告)日：2013-08-06
申请号：US12944847
申请日：2010-11-12
申请人： Jhe-Ching Lu , Hsiao-Tsung Yen , Sally Liu , Tzu-Jin Yeh , Min-Chie Jeng
发明人： Jhe-Ching Lu , Hsiao-Tsung Yen , Sally Liu , Tzu-Jin Yeh , Min-Chie Jeng
CPC分类号： H01F21/12 , H01F27/2804 , H01F2027/2809 , H03H7/42 , Y10T29/49117
摘要： A system and method for transmitting signals is disclosed. An embodiment comprises a balun, such as a Marchand balun, which has a first transformer with a primary coil and a first secondary coil and a second transformer with the primary coil and a second secondary coil. The first secondary coil and the second secondary coil are connected to a ground plane, and the ground plane has slot lines located beneath the separation of the coils in the first transformer and the second transformer. The slot lines may also have fingers.
摘要翻译： 公开了一种用于发送信号的系统和方法。 一个实施例包括一个平衡 - 不平衡变换器，例如Marchand平衡 - 不平衡转换器，其具有带初级线圈的第一变压器和第一次级线圈，以及具有初级线圈的第二变压器和第二次级线圈。 第一次级线圈和第二次级线圈连接到接地平面，并且接地平面具有位于第一变压器和第二变压器中的线圈分离下方的槽线。 缝线也可以具有手指。
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公开(公告)号：US20120119845A1
公开(公告)日：2012-05-17
申请号：US12944847
申请日：2010-11-12
申请人： Jhe-Ching Lu , Hsiao-Tsung Yen , Sally Liu , Tzu-Jin Yeh , Min-Chie Jeng
发明人： Jhe-Ching Lu , Hsiao-Tsung Yen , Sally Liu , Tzu-Jin Yeh , Min-Chie Jeng
CPC分类号： H01F21/12 , H01F27/2804 , H01F2027/2809 , H03H7/42 , Y10T29/49117
摘要： A system and method for transmitting signals is disclosed. An embodiment comprises a balun, such as a Marchand balun, which has a first transformer with a primary coil and a first secondary coil and a second transformer with the primary coil and a second secondary coil. The first secondary coil and the second secondary coil are connected to a ground plane, and the ground plane has slot lines located beneath the separation of the coils in the first transformer and the second transformer. The slot lines may also have fingers.
摘要翻译： 公开了一种用于发送信号的系统和方法。 一个实施例包括一个平衡 - 不平衡变换器，例如Marchand平衡 - 不平衡转换器，其具有带初级线圈的第一变压器和第一次级线圈，以及具有初级线圈的第二变压器和第二次级线圈。 第一次级线圈和第二次级线圈连接到接地平面，并且接地平面具有位于第一变压器和第二变压器中的线圈分离下方的槽线。 缝线也可以具有手指。
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公开(公告)号：US20090224791A1
公开(公告)日：2009-09-10
申请号：US12042606
申请日：2008-03-05
申请人： Hsiao-Tsung Yen , Tzu-Jin Yeh , Sally Liu
发明人： Hsiao-Tsung Yen , Tzu-Jin Yeh , Sally Liu
IPC分类号： G01R31/27
CPC分类号： G01R31/2884 , H01L22/34
摘要： A method and system for de-embedding an on-wafer device is disclosed. The method comprises representing the intrinsic characteristics of a test structure using a set of ABCD matrix components; determining the intrinsic characteristics arising from the test structure; and using the determined intrinsic characteristics of the test structure to produce a set of parameters representative of the intrinsic characteristics of a device-under-test (“DUT”).
摘要翻译： 公开了一种用于去嵌入晶片装置的方法和系统。 该方法包括使用一组ABCD矩阵分量表示测试结构的固有特性; 确定测试结构产生的内在特性; 并且使用确定的测试结构的固有特性来产生表示待测器件（“DUT”）的固有特性的一组参数。
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公开(公告)号：US07954080B2
公开(公告)日：2011-05-31
申请号：US12042606
申请日：2008-03-05
申请人： Hsiao-Tsung Yen , Tzu-Jin Yeh , Sally Liu
发明人： Hsiao-Tsung Yen , Tzu-Jin Yeh , Sally Liu
IPC分类号： G06F17/50
CPC分类号： G01R31/2884 , H01L22/34
摘要： A method and system for de-embedding an on-wafer device is disclosed. The method comprises representing the intrinsic characteristics of a test structure using a set of ABCD matrix components; determining the intrinsic characteristics arising from the test structure; and using the determined intrinsic characteristics of the test structure to produce a set of parameters representative of the intrinsic characteristics of a device-under-test (“DUT”).
摘要翻译： 公开了一种用于去嵌入晶片装置的方法和系统。 该方法包括使用一组ABCD矩阵分量表示测试结构的固有特性; 确定测试结构产生的内在特性; 并且使用确定的测试结构的固有特性来产生表示待测器件（“DUT”）的固有特性的一组参数。
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公开(公告)号：US20090195327A1
公开(公告)日：2009-08-06
申请号：US12023184
申请日：2008-01-31
申请人： Shu-Ying Cho , Tzu-Jin Yeh , Sally Liu
发明人： Shu-Ying Cho , Tzu-Jin Yeh , Sally Liu
IPC分类号： H01P3/08
CPC分类号： H01P3/003 , H01P3/06 , H05K1/0219 , H05K1/0242 , H05K1/025 , H05K2201/09236 , H05K2201/09727 , H05K2201/09781
摘要： A semiconductor device for transmitting a radio frequency signal along a signal line includes a signal line that extends along a principal axis. On one side of the signal line is a first dielectric, and on the opposite side of the signal line is a second dielectric. First and second ground lines are proximate to the first and second dielectrics, respectively, and the ground lines are approximately parallel to the signal line. The device has a transverse cross-section that varies along the principal axis.
摘要翻译： 沿着信号线发送射频信号的半导体装置包括沿主轴延伸的信号线。 在信号线的一侧是第一电介质，信号线的相对侧是第二电介质。 第一和第二接地线分别靠近第一和第二电介质，并且接地线近似平行于信号线。 该装置具有沿主轴变化的横截面。
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公开(公告)号：US20110265051A1
公开(公告)日：2011-10-27
申请号：US12766732
申请日：2010-04-23
申请人： Tzu-Jin Yeh , Kal-Wen Tan , Chewn-Pu Jou , Sally Liu , Fu-Lung Hsueh
发明人： Tzu-Jin Yeh , Kal-Wen Tan , Chewn-Pu Jou , Sally Liu , Fu-Lung Hsueh
IPC分类号： G06F17/50
CPC分类号： G06F17/5036 , G06F2217/82
摘要： In accordance with an embodiment, a method for substrate noise analysis comprises using a first processor based system, creating and simulating a circuit schematic comprising a multi-terminal model of a transistor, and thereafter, creating a layout based on properties represented in the circuit schematic and simulation results of the simulating. The multi-terminal model comprises a source terminal, a gate terminal, a drain terminal, a body terminal, and a guard-ring terminal.
摘要翻译： 根据实施例，用于衬底噪声分析的方法包括使用基于第一处理器的系统，创建和模拟包括晶体管的多端子模型的电路原理图，然后基于电路原理图中所示的特性创建布局 和仿真结果的模拟。 多端子模型包括源极端子，栅极端子，漏极端子，主体端子和保护环端子。
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公开(公告)号：US08627253B2
公开(公告)日：2014-01-07
申请号：US12766732
申请日：2010-04-23
申请人： Tzu-Jin Yeh , Kal-Wen Tan , Chewn-Pu Jou , Sally Liu , Fu-Lung Hsueh
发明人： Tzu-Jin Yeh , Kal-Wen Tan , Chewn-Pu Jou , Sally Liu , Fu-Lung Hsueh
IPC分类号： G06F17/50
CPC分类号： G06F17/5036 , G06F2217/82
摘要： In accordance with an embodiment, a method for substrate noise analysis comprises using a first processor based system, creating and simulating a circuit schematic comprising a multi-terminal model of a transistor, and thereafter, creating a layout based on properties represented in the circuit schematic and simulation results of the simulating. The multi-terminal model comprises a source terminal, a gate terminal, a drain terminal, a body terminal, and a guard-ring terminal.
摘要翻译： 根据实施例，用于衬底噪声分析的方法包括使用基于第一处理器的系统，创建和模拟包括晶体管的多端子模型的电路原理图，然后基于电路原理图中所示的特性创建布局 和仿真结果的模拟。 多端子模型包括源极端子，栅极端子，漏极端子，主体端子和保护环端子。
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公开(公告)号：US08193880B2
公开(公告)日：2012-06-05
申请号：US12023184
申请日：2008-01-31
申请人： Shu-Ying Cho , Tzu-Jin Yeh , Sally Liu
发明人： Shu-Ying Cho , Tzu-Jin Yeh , Sally Liu
CPC分类号： H01P3/003 , H01P3/06 , H05K1/0219 , H05K1/0242 , H05K1/025 , H05K2201/09236 , H05K2201/09727 , H05K2201/09781
摘要： A semiconductor device for transmitting a radio frequency signal along a signal line includes a signal line that extends along a principal axis. On one side of the signal line is a first dielectric, and on the opposite side of the signal line is a second dielectric. First and second ground lines are proximate to the first and second dielectrics, respectively, and the ground lines are approximately parallel to the signal line. The device has a transverse cross-section that varies along the principal axis.
摘要翻译： 沿着信号线发送射频信号的半导体装置包括沿主轴延伸的信号线。 在信号线的一侧是第一电介质，信号线的相对侧是第二电介质。 第一和第二接地线分别靠近第一和第二电介质，并且接地线近似平行于信号线。 该装置具有沿主轴变化的横截面。
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9.发明授权Through-chip interface (TCI) structure for wireless chip-to-chip communication 有权用于无线芯片到芯片通信的片上接口（TCI）结构公开(公告)号：US09064631B2
公开(公告)日：2015-06-23
申请号：US13350206
申请日：2012-01-13
申请人： Jun-De Jin , Tzu-Jin Yeh
发明人： Jun-De Jin , Tzu-Jin Yeh
IPC分类号： H01F38/14 , H01F37/00 , H01F27/28 , H01L23/522 , H01L23/64 , H01L25/065 , H01L23/48
CPC分类号： H01F38/14 , H01F27/2804 , H01F37/00 , H01L23/48 , H01L23/5227 , H01L23/64 , H01L25/0657 , H01L2224/32145 , H01L2225/06531
摘要： A transformer for RF and other frequency through-chip-interface (TCI) applications includes multiple chips in wireless electronic communication with one another in three-dimensional integrated circuit, 3DIC, technology. Each of the chips includes an inductor coil and a matching network that matches the impedance of the inductor coil. The matching network is electrically coupled between the inductor coil and further components and circuits formed on the chip.
摘要翻译： 用于RF和其他频率通过芯片接口（TCI）应用的变压器包括在三维集成电路，3DIC技术中彼此无线电子通信的多个芯片。 每个芯片包括电感线圈和与电感线圈的阻抗匹配的匹配网络。 匹配网络电耦合在电感线圈和形成在芯片上的其它部件和电路之间。
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公开(公告)号：US20130328623A1
公开(公告)日：2013-12-12
申请号：US13494263
申请日：2012-06-12
申请人： Jun-De Jin , Tzu-Jin Yeh
发明人： Jun-De Jin , Tzu-Jin Yeh
CPC分类号： H03H7/0115 , H03H7/1758 , H03H11/48
摘要： Some embodiments relate to a band-pass filter arranged in a ladder-like structure. The band-pass filter includes respective inductor-capacitor (LC) resonators arranged on respective rungs of the ladder-like structure. Respective matching circuits are arranged on a leg of the ladder-like structure between neighboring rungs.
摘要翻译： 一些实施例涉及布置成阶梯状结构的带通滤波器。 带通滤波器包括布置在阶梯状结构的各个梯级上的相应的电感器 - 电容器（LC）谐振器。 相应的匹配电路布置在相邻梯级之间的梯状结构的腿上。
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