公开(公告)号：US20230204884A1

公开(公告)日：2023-06-29

申请号：US18111357

申请日：2023-02-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Lu Cao ,  Shimin Gao

IPC: G02B6/42 ,  H01R43/20 ,  H01R13/518 ,  H01R31/06 ,  H01R13/26

CPC classification number: G02B6/4293 ,  G02B6/4246 ,  H01R13/26 ,  H01R13/518 ,  H01R31/06 ,  H01R43/20

Abstract: A composite module includes a housing, an optical component, and a power supply component. A first end of the housing is provided with a first socket, and a second end of the housing is provided with a second socket. The optical component includes a first optical connector, an optical-to-electrical conversion component, and a second optical connector. One end of the optical-to-electrical conversion component is connected to the first optical connector, and the other end of the optical-to-electrical conversion component is connected to the second optical connector. The power supply component includes a first electrical connector, a power supply line, and a second electrical connector. One end of the power supply line is connected to the first electrical connector, and the other end of the power supply line is connected to the second electrical connector.

公开(公告)号：US09462673B2

公开(公告)日：2016-10-04

申请号：US14570080

申请日：2014-12-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jun Zhang ,  Yongsheng Wang ,  Lu Cao

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/367 ,  H01L23/40

CPC classification number: H05K1/0203 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink, including a heat sink body and a filling material. A through hole is disposed in a position, corresponding to a to-be-cooled electronic element, on the heat sink body. The to-be-cooled electronic element is mounted on a circuit board and located between the circuit board and the heat sink body. There is a gap between the to-be-cooled electronic element and the heat sink body. The gap is connected to the through hole. The filling material is injected into the through hole and fills the gap. The present invention further discloses a heat dissipation system having the heat sink. The heat sink resolves problems in the prior art that, a heat sink has low thermal conduction efficiency and it is difficult to control a filling volume of a thermally conductive material in a gap between a heat sink and a chip.

Abstract translation: 散热器，包括散热器主体和填充材料。 通孔设置在散热体上对应于被冷却电子元件的位置。 待冷却的电子元件安装在电路板上并且位于电路板和散热体之间。 要冷却的电子元件和散热体之间存在间隙。 间隙连接到通孔。 将填充材料注入通孔并填充间隙。 本发明还公开了一种具有散热器的散热系统。 散热器解决了现有技术中的问题，散热片具有低热传导效率，并且难以控制导热材料在散热片和芯片之间的间隙中的填充体积。

公开(公告)号：US20230273380A1

公开(公告)日：2023-08-31

申请号：US18170885

申请日：2023-02-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shimin Gao ,  Lu Cao ,  Xue Yin ,  Jiansi Tan ,  Dada Liu

IPC: G02B6/42 ,  H01R13/10 ,  H01R13/22 ,  H01R13/26 ,  H01R13/08

CPC classification number: G02B6/4278 ,  G02B6/4292 ,  H01R13/10 ,  H01R13/22 ,  H01R13/26 ,  H01R13/08

Abstract: An optical module includes a housing, an optical component, and a power supply component. The housing has a first socket and a second socket. The optical component includes a first optical connector, an optical-to-electrical conversion component, and a second optical connector that are sequentially connected. The power supply component includes a first electrical connector, a power supply line, and a second electrical connector that are sequentially connected. The optical-to-electrical conversion component and the power supply line are both located in the housing, the first optical connector is located in the first socket, the first electrical connector is located at the first socket, and the second optical connector and the second electrical connector are both located in the second socket.

公开(公告)号：US20230208534A1

公开(公告)日：2023-06-29

申请号：US18171005

申请日：2023-02-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shimin Gao ,  Lu Cao ,  Xue Yin ,  Jiansi Tan ,  Dada Liu

IPC: H04B10/80 ,  G02B6/38

CPC classification number: H04B10/808 ,  H04B10/801 ,  G02B6/3817

Abstract: An optical module includes a housing, an optical component, and a power supply component. The housing is provided with a first socket and a second socket. The optical component includes a first optical connector, an optical-to-electrical conversion component, and a second optical connector that are sequentially connected. The power supply component includes a first electrical connector, a power supply line, and a second electrical connector that are sequentially connected. Both the optical-to-electrical conversion component and the power supply line are located in the housing, the first optical connector is located in the first socket, a part that is of the first electrical connector and that is exposed from the housing is located at any position at the first end of the housing.

公开(公告)号：US20230204883A1

公开(公告)日：2023-06-29

申请号：US18111338

申请日：2023-02-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shimin Gao ,  Lu Cao ,  Xue Yin ,  Jiansi Tan ,  Dada Liu

IPC: G02B6/42 ,  H01R31/06 ,  H01R13/24 ,  H01R13/05

CPC classification number: G02B6/4293 ,  G02B6/428 ,  H01R31/06 ,  H01R13/2471 ,  H01R13/05

Abstract: An optical module includes a housing, an optical component, and a power supply component. A second end of the housing is provided with a second socket, and the second end of the housing is an end part configured to be inserted into an optical communication device. The optical component includes a second optical connector, and the power supply component includes a second electrical connector. Both the optical component and the power supply component are located in the housing, both the second optical connector and the second electrical connector are located in the second socket, and positions of the second optical connector and the second electrical connector are independent of each other.

公开(公告)号：US20150173169A1

公开(公告)日：2015-06-18

申请号：US14570080

申请日：2014-12-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jun Zhang ,  Yongsheng Wang ,  Lu Cao

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink, including a heat sink body and a filling material. A through hole is disposed in a position, corresponding to a to-be-cooled electronic element, on the heat sink body. The to-be-cooled electronic element is mounted on a circuit board and located between the circuit board and the heat sink body. There is a gap between the to-be-cooled electronic element and the heat sink body. The gap is connected to the through hole. The filling material is injected into the through hole and fills the gap. The present invention further discloses a heat dissipation system having the heat sink. The heat sink resolves problems in the prior art that, a heat sink has low thermal conduction efficiency and it is difficult to control a filling volume of a thermally conductive material in a gap between a heat sink and a chip.

Abstract translation: 散热器，包括散热器主体和填充材料。 通孔设置在散热体上对应于被冷却电子元件的位置。 待冷却的电子元件安装在电路板上并且位于电路板和散热体之间。 要冷却的电子元件和散热体之间存在间隙。 间隙连接到通孔。 将填充材料注入通孔并填充间隙。 本发明还公开了一种具有散热器的散热系统。 散热器解决了现有技术中的问题，散热片具有低热传导效率，并且难以控制导热材料在散热片和芯片之间的间隙中的填充体积。

公开(公告)号：US10031880B2

公开(公告)日：2018-07-24

申请号：US14565982

申请日：2014-12-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianzhao Li ,  Lu Cao

IPC: G06F13/42 ,  H04L12/933 ,  H04L12/931

CPC classification number: G06F13/4282 ,  H04L49/15 ,  H04L49/352

Abstract: The application provides a network device, which includes: a main control board and a service board, where the main control board includes a processor and a switching chip, and the service board includes a physical layer component. The switching chip is connected to the physical layer component by using a system bus. The system bus consists of a SerDes link, and is configured to transmit service data and control information of a port of the physical layer component. The processor controls the port of the physical layer component by using the control information of the port of the physical layer component. The network device transmits the service data and the control information by using the system bus, so that the service board does not need to set a CPU processing the control information, thereby expanding an interface flexibly, and reducing device complexity and hardware costs.

公开(公告)号：US20230194812A1

公开(公告)日：2023-06-22

申请号：US18172214

申请日：2023-02-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shimin Gao ,  Lu Cao ,  Xue Yin ,  Jiansi Tan ,  Dada Liu

IPC: G02B6/42 ,  H01R31/06 ,  H01R13/26 ,  H01R13/24 ,  H01R13/04 ,  H01R13/10

CPC classification number: G02B6/4293 ,  G02B6/4284 ,  H01R31/06 ,  H01R13/26 ,  H01R13/2471 ,  H01R13/04 ,  H01R13/10

Abstract: An optical module, a communication device, and a Power over Ethernet (PoE) device are provided. The optical module includes a housing, an optical component, and a power supply component. The housing has a first socket and a second socket. The optical component also includes a first optical connector, an optical-to-electrical conversion component, and a second optical connector that are sequentially connected. The power supply component includes a first electrical connector, a power supply line, and a second electrical connector that are sequentially connected. The first socket is configured to insert a composite cable that matches the optical module. A power connector of the composite cable can be connected to the communication device by using the optical module, and the power connector of the composite cable does not need to be inserted into the communication device, so that panel space of the communication device can be reduced and miniaturization facilitated.