Bendable cutting device
    1.
    发明授权
    Bendable cutting device 有权
    弯曲切割装置

    公开(公告)号:US07229440B2

    公开(公告)日:2007-06-12

    申请号:US10783714

    申请日:2004-02-20

    IPC分类号: A61B18/14

    摘要: Devices and methods for a minimally invasive procedure for cutting tissue are disclosed. The device generally includes a probe with a distal exit at an exit angle relative to the probe, a cutting loop with shape memory having a preconfigured shape, and a loop securing mechanism to secure the cutting loop in a penetrating configuration and to release the cutting loop into a cutting configuration. The cutting loop is generally within a profile of the probe in the penetrating configuration. In the cutting configuration, the cutting loop extends through the cutting loop exit and generally returns to the preconfigured shape at a cutting angle generally defined by the exit angle. The cutting loop securing mechanism may be, for example, a cover slidable over the probe, a slidable member extending from a distal tip of the probe, or a groove defined in the probe proximal to the cutting loop exit.

    摘要翻译: 公开了用于切割组织的微创程序的装置和方法。 该装置通常包括具有相对于探针出射角度的远端出口的探针,具有预配置形状的形状记忆体的切割环以及将切割环固定在穿透构型中并释放切割环的环固定机构 进入切割配置。 切割环通常在探针的剖面中处于穿透构型。 在切割配置中,切割环延伸穿过切割环出口并且通常以通常由出射角限定的切割角返回到预配置的形状。 切割环固定机构可以是例如可以在探头上滑动的盖,从探头的远端延伸的可滑动构件或限定在探针中的靠近切割环出口的凹槽。