公开(公告)号：US20130247682A1

公开(公告)日：2013-09-26

申请号：US13888959

申请日：2013-05-07

Applicant: Hysitron Inc.

Inventor： Yunje Oh ,  Edward Cyrankowski ,  Zhiwei Shan ,  Syed Amanula Syed Asif

IPC: G01L1/00

CPC classification number: G01L1/005 ,  B81C99/005 ,  G01N3/08 ,  G01N2203/0286 ,  G01N2203/0647

Abstract: A micromachined or microelectromechanical system (MEMS) based push-to-pull mechanical transformer for tensile testing of micro-to-nanometer scale material samples including a first structure and a second structure. The second structure is coupled to the first structure by at least one flexible element that enables the second structure to be moveable relative to the first structure, wherein the second structure is disposed relative to the first structure so as to form a pulling gap between the first and second structures such that when an external pushing force is applied to and pushes the second structure in a tensile extension direction a width of the pulling gap increases so as to apply a tensile force to a test sample mounted across the pulling gap between a first sample mounting area on the first structure and a second sample mounting area on the second structure.

Abstract translation: 一种用于对包括第一结构和第二结构的微米至纳米尺度材料样品的拉伸测试的基于微机械或微机电系统（MEMS）的推挽式机械变压器。 第二结构通过至少一个可使第二结构相对于第一结构运动的柔性元件耦合到第一结构，其中第二结构相对于第一结构设置，以便在第一结构之间形成牵引间隙 以及第二结构，使得当在拉伸延伸方向上施加外推力并推动所述第二结构时，所述牵引间隙的宽度增加，以便对安装在所述牵引间隙上的第一样品 第一结构上的安装区域和第二结构上的第二样品安装区域。

公开(公告)号：US09829417B2

公开(公告)日：2017-11-28

申请号：US14407783

申请日：2013-03-14

Applicant: Hysitron, Inc.

Inventor： Roger William Schmitz ,  Ude D. Hangen ,  Lucas Paul Keranen ,  Ryan Major ,  Yunje Oh ,  Jeremiah Vieregge ,  Christopher David Young

IPC: G01N3/42 ,  G01N1/28 ,  G01B3/00 ,  F28F9/26 ,  G01N1/44 ,  G01N19/00 ,  G01N27/14

CPC classification number: G01N1/28 ,  F28F9/26 ,  G01B3/00 ,  G01N1/44 ,  G01N3/42 ,  G01N19/00 ,  G01N27/14

Abstract: An environmental conditioning assembly for use in mechanical testing at scales of microns or less. The assembly includes an enclosure housing with an environmental cavity therein. A sample stage is positioned within the environmental cavity and includes an option sample heater. The enclosure housing includes a cavity perimeter clustered around the sample stage, and the enclosure housing isolates the environmental cavity and the sample stage from an environment exterior to the enclosure housing. In an example, an expansion and contraction linkage maintains a sample on the sample stage at a static elevation according to heating or cooling fluctuations within the environmental cavity. A testing instrument access port extends through the enclosure housing into the environmental cavity.

公开(公告)号：US20160123859A1

公开(公告)日：2016-05-05

申请号：US14948549

申请日：2015-11-23

Applicant: Hysitron, Inc.

Inventor： Yunje Oh ,  Syed Amanulla Syed Asif ,  Edward Cyrankowski ,  Oden Lee Warren

IPC: G01N1/42 ,  H05B1/02 ,  H05B3/22 ,  G01N3/08

CPC classification number: G01N1/42 ,  G01N3/08 ,  G01N3/18 ,  G01N3/42 ,  G01N2203/0226 ,  G01N2203/0286 ,  G01N2203/04 ,  G01N2223/418 ,  H01J37/20 ,  H05B1/023 ,  H05B3/06 ,  H05B3/22

Abstract: A sub-micron scale property testing apparatus including a test subject holder and heating assembly. The assembly includes a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly. The assembly further includes a test subject stage coupled with the holder base. The test subject stage is thermally isolated from the holder base. The test subject stage includes a stage subject surface configured to receive a test subject, and a stage plate bracing the stage subject surface. The stage plate is under the stage subject surface. The test subject stage further includes a heating element adjacent to the stage subject surface, the heating element is configured to generate heat at the stage subject surface.

Abstract translation: 一种亚微米级属性测试装置，包括测试对象支架和加热组件。 组件包括构造成与亚微米机械测试仪器和电 - 机械换能器组件联接的保持器基座。 组件还包括与保持器基座联接的测试对象级。 测试对象阶段与保持器基座热隔离。 测试对象阶段包括被配置为接收测试对象的舞台对象表面和支撑舞台对象表面的舞台。 舞台板在舞台主体表面下。 测试对象阶段还包括与舞台对象表面相邻的加热元件，加热元件构造成在舞台对象表面处产生热量。

公开(公告)号：US08789425B2

公开(公告)日：2014-07-29

申请号：US13888959

申请日：2013-05-07

Applicant: Hysitron Inc.

Inventor： Yunje Oh ,  Edward Cyrankowski ,  Zhiwei Shan ,  Syed Amanula Syed Asif

IPC: G01L1/00

CPC classification number: G01L1/005 ,  B81C99/005 ,  G01N3/08 ,  G01N2203/0286 ,  G01N2203/0647

Abstract: A micromachined or microelectromechanical system (MEMS) based push-to-pull mechanical transformer for tensile testing of micro-to-nanometer scale material samples including a first structure and a second structure. The second structure is coupled to the first structure by at least one flexible element that enables the second structure to be moveable relative to the first structure, wherein the second structure is disposed relative to the first structure so as to form a pulling gap between the first and second structures such that when an external pushing force is applied to and pushes the second structure in a tensile extension direction a width of the pulling gap increases so as to apply a tensile force to a test sample mounted across the pulling gap between a first sample mounting area on the first structure and a second sample mounting area on the second structure.

Abstract translation: 一种用于对包括第一结构和第二结构的微米至纳米尺度材料样品的拉伸测试的基于微机械或微机电系统（MEMS）的推挽式机械变压器。 第二结构通过至少一个可使第二结构相对于第一结构运动的柔性元件耦合到第一结构，其中第二结构相对于第一结构设置，以便在第一结构之间形成牵引间隙 以及第二结构，使得当在拉伸延伸方向上施加外推力并推动所述第二结构时，所述牵引间隙的宽度增加，以便对安装在所述牵引间隙上的第一样品 第一结构上的安装区域和第二结构上的第二样品安装区域。

公开(公告)号：US09804072B2

公开(公告)日：2017-10-31

申请号：US14361133

申请日：2012-11-28

Applicant: Hysitron, Inc.

Inventor： Syed Amanulla Syed Asif ,  Edward Cyrankowski ,  Lucas Paul Keranen ,  Ryan Major ,  Yunje Oh ,  Oden Lee Warren ,  Maciej W. Misiak

IPC: G01N3/42 ,  G01N3/54 ,  G01N3/18 ,  G01N3/08 ,  H05B1/02 ,  H05B3/32

CPC classification number: G01N3/54 ,  G01N3/08 ,  G01N3/18 ,  G01N2203/0078 ,  G01N2203/0226 ,  G01N2203/0282 ,  G01N2203/0286 ,  G01N2203/0482 ,  H05B1/023 ,  H05B3/32

Abstract: A heating system for use in mechanical testing at scales of microns or less includes a stage heater. The stage heater having a stage plane, and a stage heating element distributed across the stage plane. Two or more support mounts are on opposed sides of the stage plane. A first bridge extends from the stage plane to a first mount of the two or more support mounts, and a second bridge extends from the stage plane to a second mount of the two or more support mounts. The first and second bridges provide a plurality of supports between the stage plane and two or more support mounts to accordingly support the stage plane. In another example, the heating system includes a probe heater configured to heat a probe as part of mechanical testing.

公开(公告)号：US09476816B2

公开(公告)日：2016-10-25

申请号：US14358065

申请日：2012-11-14

Applicant: Hysitron, Inc.

Inventor： Roger William Schmitz ,  Yunje Oh

IPC: G01N3/40 ,  H05B3/03 ,  G01Q30/02 ,  G01Q30/10 ,  G01Q60/36 ,  G01N3/42

CPC classification number: G01N3/40 ,  G01N3/42 ,  G01N2203/0226 ,  G01N2203/0282 ,  G01Q30/02 ,  G01Q30/10 ,  G01Q60/366 ,  H05B3/03

Abstract: A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.

Abstract translation: 一种加热组件，其配置用于以微米或更小的尺度进行机械测试。 加热组件包括构造成与机械测试系统的换能器耦合的探针末端组件。 探针头组件包括具有加热元件的探针尖端加热器系统，与探针末端加热器系统耦合的探针末端和加热器插座组件。 在一个示例中，加热器插座组件包括在加热器插座组件内形成插座的磁轭和加热器接口。 与探针头相连的探头尖端加热器系统可滑动地接收并夹紧在插座内。

公开(公告)号：US20140331782A1

公开(公告)日：2014-11-13

申请号：US14361094

申请日：2012-11-28

Applicant: Hysitron, Inc.

Inventor： Lucas Paul Keranen ,  Syed Amanulla Syed Asif ,  Ryan Major ,  Yunje Oh

IPC: G01N3/18

CPC classification number: G01N3/54 ,  G01N3/08 ,  G01N3/18 ,  G01N2203/0078 ,  G01N2203/0226 ,  G01N2203/0282 ,  G01N2203/0286 ,  G01N2203/0482 ,  H05B1/023 ,  H05B3/32

Abstract: A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.

Abstract translation: 样品夹持和加热组件包括组件壳体和与组件壳体耦合的第一和第二加热夹具。 第一和第二加热夹具各自包括抓握表面，并且第一和第二加热夹的夹持表面彼此相对。 第一和第二加热夹具中的每一个还包括与抓握表面相邻的加热元件。 可选地，样品夹持和加热组件包括在包括具有用于加热探针的探针加热元件的探针加热器的加热系统中。 加热系统包括具有与样品夹持和加热组件耦合的台架的测试组件以及与探针加热器耦合的换能器组件。

公开(公告)号：US09759641B2

公开(公告)日：2017-09-12

申请号：US14948549

申请日：2015-11-23

Applicant: Hysitron, Inc.

Inventor： Yunje Oh ,  Syed Amanulla Syed Asif ,  Edward Cyrankowski ,  Oden Lee Warren

IPC: H05B3/20 ,  H05B3/10 ,  G01N1/42 ,  H01J37/20 ,  G01N3/08 ,  H05B1/02 ,  H05B3/22 ,  G01N3/18 ,  G01N3/42

CPC classification number: G01N1/42 ,  G01N3/08 ,  G01N3/18 ,  G01N3/42 ,  G01N2203/0226 ,  G01N2203/0286 ,  G01N2203/04 ,  G01N2223/418 ,  H01J37/20 ,  H05B1/023 ,  H05B3/06 ,  H05B3/22

Abstract: A sub-micron scale property testing apparatus including a test subject holder and heating assembly. The assembly includes a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly. The assembly further includes a test subject stage coupled with the holder base. The test subject stage is thermally isolated from the holder base. The test subject stage includes a stage subject surface configured to receive a test subject, and a stage plate bracing the stage subject surface. The stage plate is under the stage subject surface. The test subject stage further includes a heating element adjacent to the stage subject surface, the heating element is configured to generate heat at the stage subject surface.

公开(公告)号：US20150185117A1

公开(公告)日：2015-07-02

申请号：US14407783

申请日：2013-03-14

Applicant: Hysitron, Inc.

Inventor： Roger William Schmitz ,  Ude D. Hangen ,  Lucas Paul Keranen ,  Ryan Major ,  Yunje Oh ,  Jeremiah Vieregge ,  Christopher David Young

IPC: G01N1/28 ,  G01N1/44 ,  G01N19/00 ,  F28F9/26 ,  G01N27/14

CPC classification number: G01N1/28 ,  F28F9/26 ,  G01B3/00 ,  G01N1/44 ,  G01N3/42 ,  G01N19/00 ,  G01N27/14

Abstract: An environmental conditioning assembly for use in mechanical testing at scales of microns or less. The assembly includes an enclosure housing with an environmental cavity therein. A sample stage is positioned within the environmental cavity and includes an option sample heater. The enclosure housing includes a cavity perimeter clustered around the sample stage, and the enclosure housing isolates the environmental cavity and the sample stage from an environment exterior to the enclosure housing. In an example, an expansion and contraction linkage maintains a sample on the sample stage at a static elevation according to heating or cooling fluctuations within the environmental cavity. A testing instrument access port extends through the enclosure housing into the environmental cavity.

Abstract translation: 用于微米或更小尺寸的机械测试的环境调理组件。 组件包括其中具有环境空腔的外壳壳体。 样品台位于环境腔内，并包括一个选件样品加热器。 外壳壳体包括围绕样品台聚集的空腔周边，并且外壳壳体将环境腔和样品台与外壳外部的环境隔离。 在一个示例中，膨胀和收缩连接根据环境空腔内的加热或冷却波动在样品台上保持样品在静态高度。 测试仪器进出口延伸穿过外壳进入环境空腔。

公开(公告)号：US20140326707A1

公开(公告)日：2014-11-06

申请号：US14358065

申请日：2012-11-14

Applicant: Hysitron, Inc.

Inventor： Roger William Schmitz ,  Yunje Oh

IPC: G01N3/40 ,  H05B3/03

CPC classification number: G01N3/40 ,  G01N3/42 ,  G01N2203/0226 ,  G01N2203/0282 ,  G01Q30/02 ,  G01Q30/10 ,  G01Q60/366 ,  H05B3/03

Abstract: A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.

Abstract translation: 一种加热组件，其配置用于以微米或更小的尺度进行机械测试。 加热组件包括构造成与机械测试系统的换能器耦合的探针末端组件。 探针头组件包括具有加热元件的探针尖端加热器系统，与探针末端加热器系统耦合的探针末端和加热器插座组件。 在一个示例中，加热器插座组件包括在加热器插座组件内形成插座的磁轭和加热器接口。 与探针头相连的探头尖端加热器系统可滑动地接收并夹紧在插座内。