Method of manufacturing vertical light emitting device
    1.
    发明授权
    Method of manufacturing vertical light emitting device 有权
    制造垂直发光装置的方法

    公开(公告)号:US07781246B2

    公开(公告)日:2010-08-24

    申请号:US11882259

    申请日:2007-07-31

    CPC classification number: H01L33/0079 H01L33/44

    Abstract: Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.

    Abstract translation: 提供一种垂直发光装置的制造方法。 制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层,有源层和p型半导体层的发射层,形成将发光层划分成发光器件的第一沟槽 其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度,在发射层上形成钝化层,在p型半导体层上形成p型电极 发射层,在钝化层和p型电极上形成金属支撑层,去除衬底,当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分,形成n型 电极,并且切割金属支撑层以将发光层划分为发光器件单元。

    Light emitting device having protrusion and recess structure and method of manufacturing the same
    3.
    发明授权
    Light emitting device having protrusion and recess structure and method of manufacturing the same 有权
    具有突出和凹陷结构的发光器件及其制造方法

    公开(公告)号:US07785910B2

    公开(公告)日:2010-08-31

    申请号:US12215407

    申请日:2008-06-27

    CPC classification number: H01L33/382

    Abstract: The semiconductor light emitting device having a protrusion and recess structure includes: a lower clad layer disposed on a substrate; an active layer formed on one portion of a top surface of the lower clad layer; an upper clad layer formed on the active layer; a first electrode formed on the upper clad layer; and a second electrode that is formed on a protrusion and recess structural pattern region formed on a portion of the top surface of the lower clad layer not occupied by the active layer.

    Abstract translation: 具有突起和凹陷结构的半导体发光器件包括:设置在基板上的下覆盖层; 形成在所述下包层的顶表面的一部分上的有源层; 形成在有源层上的上覆层; 形成在所述上包层上的第一电极; 以及第二电极,其形成在形成在未被有源层占据的下包层的顶表面的一部分上的突起和凹陷结构图案区域上。

    Light emitting diode and method of fabricating the same
    4.
    发明授权
    Light emitting diode and method of fabricating the same 有权
    发光二极管及其制造方法

    公开(公告)号:US07482189B2

    公开(公告)日:2009-01-27

    申请号:US11896634

    申请日:2007-09-04

    CPC classification number: H01L33/24 H01L33/0075

    Abstract: A light emitting diode (LED) and a method are provided for fabricating the a LED with an improved structure for better light emitting efficiency and better light output performance. The LED includes an n-GaN layer formed on a substrate to have a plurality of protrusions, thereby having an uneven surface, wherein a side surface of the protrusions is inclined with a first inclination angle α (35°≦α≦90°) with respect to an upper surface of the substrate; an active layer conformally formed on the surface of the n-GaN layer, wherein the surface of the active layer formed on the side surface of the protrusions is inclined with a second inclination angle β (35°≦β≦α) with respect to the upper surface of the substrate; a p-GaN layer conformally formed on the surface of the active layer, wherein the surface of the p-GaN layer formed on the surface of the inclined portion of the active layer is inclined with a third inclination angle γ (20°≦γ≦β) with respect to the upper surface of the substrate; and an n-electrode formed on a predetermined area of the n-GaN layer to correspond to the p-electrode.

    Abstract translation: 提供了一种发光二极管(LED)和方法,用于制造具有改进结构的LED,以获得更好的发光效率和更好的光输出性能。 LED包括形成在基板上的n-GaN层,以具有多个突起,从而具有不平坦表面,其中突起的侧表面以第一倾斜角α(35°<=α<= 90°)倾斜 )相对于衬底的上表面; 在n-GaN层的表面上保形地形成的有源层,其中形成在突起的侧表面上的有源层的表面相对于第二倾斜角β(35°,β=α)倾斜, 到基板的上表面; 在有源层的表面上保形地形成的p-GaN层,其中形成在有源层的倾斜部分的表面上的p-GaN层的表面以第三倾斜角γ(20°,γ= 相对于衬底的上表面<=β); 以及形成在n-GaN层的预定区域上以对应于p电极的n电极。

    Light emitting diode and method of fabricating the same
    5.
    发明申请
    Light emitting diode and method of fabricating the same 有权
    发光二极管及其制造方法

    公开(公告)号:US20080032436A1

    公开(公告)日:2008-02-07

    申请号:US11896634

    申请日:2007-09-04

    CPC classification number: H01L33/24 H01L33/0075

    Abstract: A light emitting diode (LED) and a method are provided for fabricating the a LED with an improved structure for better light emitting efficiency and better light output performance. The LED includes an n-GaN layer formed on a substrate to have a plurality of protrusions, thereby having an uneven surface, wherein a side surface of the protrusions is inclined with a first inclination angle α (35°≦α≦90°) with respect to an upper surface of the substrate; an active layer conformally formed on the surface of the n-GaN layer, wherein the surface of the active layer formed on the side surface of the protrusions is inclined with a second inclination angle β (35°≦β≦α) with respect to the upper surface of the substrate; a p-GaN layer conformally formed on the surface of the active layer, wherein the surface of the p-GaN layer formed on the surface of the inclined portion of the active layer is inclined with a third inclination angle γ (20°≦γ≦β) with respect to the upper surface of the substrate; and an n-electrode formed on a predetermined area of the n-GaN layer to correspond to the p-electrode.

    Abstract translation: 提供了一种发光二极管(LED)和方法,用于制造具有改进结构的LED,以获得更好的发光效率和更好的光输出性能。 LED包括形成在基板上的n-GaN层,以具有多个突起,从而具有不平坦表面,其中突起的侧表面以第一倾斜角α(35°<=α<= 90°)倾斜 )相对于衬底的上表面; 在n-GaN层的表面上保形地形成的有源层,其中形成在突起的侧表面上的有源层的表面相对于第二倾斜角β(35°,β=α)倾斜, 到基板的上表面; 在有源层的表面上保形地形成的p-GaN层,其中形成在有源层的倾斜部分的表面上的p-GaN层的表面以第三倾斜角γ(20°,γ= 相对于衬底的上表面<=β); 以及形成在n-GaN层的预定区域上以对应于p电极的n电极。

    Light emitting diode and method of fabricating the same
    6.
    发明申请
    Light emitting diode and method of fabricating the same 有权
    发光二极管及其制造方法

    公开(公告)号:US20070012933A1

    公开(公告)日:2007-01-18

    申请号:US11448832

    申请日:2006-06-08

    CPC classification number: H01L33/24 H01L33/0075

    Abstract: A light emitting diode (LED) and a method are provided for fabricating the a LED with an improved structure for better light emitting efficiency and better light output performance. The LED includes an n-GaN layer formed on a substrate to have a plurality of protrusions, thereby having an uneven surface, wherein a side surface of the protrusions is inclined with a first inclination angle α (35°≦α≦90°) with respect to an upper surface of the substrate; an active layer conformally formed on the surface of the n-GaN layer, wherein the surface of the active layer formed on the side surface of the protrusions is inclined with a second inclination angle β (35°≦β≦α) with respect to the upper surface of the substrate; a p-GaN layer conformally formed on the surface of the active layer, wherein the surface of the p-GaN layer formed on the surface of the inclined portion of the active layer is inclined with a third inclination angle γ (20°≦γ

    Abstract translation: 提供了一种发光二极管(LED)和方法,用于制造具有改进结构的LED,以获得更好的发光效率和更好的光输出性能。 LED包括形成在基板上的n-GaN层,以具有多个突起,从而具有不平坦表面,其中突起的侧表面以第一倾斜角α(35°<=α<= 90°)倾斜 )相对于衬底的上表面; 在n-GaN层的表面上保形地形成的有源层,其中形成在突起的侧表面上的有源层的表面相对于第二倾斜角β(35°,β=α)倾斜, 到基板的上表面; 在有源层的表面上保形地形成的p-GaN层,其中形成在有源层的倾斜部分的表面上的p-GaN层的表面以第三倾斜角γ(20°,γ= β)相对于所述基板的上表面; 以及形成在n-GaN层的预定区域上以对应于p电极的n电极。

    Method of manufacturing vertical light emitting device
    7.
    发明授权
    Method of manufacturing vertical light emitting device 有权
    制造垂直发光装置的方法

    公开(公告)号:US07888153B2

    公开(公告)日:2011-02-15

    申请号:US12805132

    申请日:2010-07-14

    CPC classification number: H01L33/0079 H01L33/44

    Abstract: Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.

    Abstract translation: 提供一种垂直发光装置的制造方法。 制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层,有源层和p型半导体层的发射层,形成将发光层划分成发光器件的第一沟槽 其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度,在发射层上形成钝化层,在p型半导体层上形成p型电极 发射层,在钝化层和p型电极上形成金属支撑层,去除衬底,当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分,形成n型 电极,并且切割金属支撑层以将发光层划分为发光器件单元。

    LIGHT EMITTING DEVICE HAVING PROTRUSION AND RECESS STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    LIGHT EMITTING DEVICE HAVING PROTRUSION AND RECESS STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权
    具有推进和恢复结构的发光装置及其制造方法

    公开(公告)号:US20110006337A1

    公开(公告)日:2011-01-13

    申请号:US12842141

    申请日:2010-07-23

    CPC classification number: H01L33/382

    Abstract: The semiconductor light emitting device having a protrusion and recess structure includes: a lower clad layer disposed on a substrate; an active layer formed on one portion of a top surface of the lower clad layer; an upper clad layer formed on the active layer; a first electrode formed on the upper clad layer; and a second electrode that is formed on a protrusion and recess structural pattern region formed on a portion of the top surface of the lower clad layer not occupied by the active layer.

    Abstract translation: 具有突起和凹陷结构的半导体发光器件包括:设置在基板上的下覆盖层; 形成在所述下包层的顶表面的一部分上的有源层; 形成在有源层上的上覆层; 形成在所述上包层上的第一电极; 以及第二电极,其形成在形成在未被有源层占据的下包层的顶表面的一部分上的突起和凹陷结构图案区域上。

    Light emitting device having protrusion and recess structure and method of manufacturing the same
    9.
    发明申请
    Light emitting device having protrusion and recess structure and method of manufacturing the same 有权
    具有突出和凹陷结构的发光器件及其制造方法

    公开(公告)号:US20080286893A1

    公开(公告)日:2008-11-20

    申请号:US12215407

    申请日:2008-06-27

    CPC classification number: H01L33/382

    Abstract: The semiconductor light emitting device having a protrusion and recess structure includes: a lower clad layer disposed on a substrate; an active layer formed on one portion of a top surface of the lower clad layer; an upper clad layer formed on the active layer; a first electrode formed on the upper clad layer; and a second electrode that is formed on a protrusion and recess structural pattern region formed on a portion of the top surface of the lower clad layer not occupied by the active layer.

    Abstract translation: 具有突起和凹陷结构的半导体发光器件包括:设置在基板上的下覆盖层; 形成在所述下包层的顶表面的一部分上的有源层; 形成在有源层上的上覆层; 形成在所述上包层上的第一电极; 以及第二电极,其形成在形成在未被有源层占据的下包层的顶表面的一部分上的突起和凹陷结构图案区域上。

    Light emitting diode and method of fabricating the same

    公开(公告)号:US07282746B2

    公开(公告)日:2007-10-16

    申请号:US11448832

    申请日:2006-06-08

    CPC classification number: H01L33/24 H01L33/0075

    Abstract: A light emitting diode (LED) and a method are provided for fabricating the a LED with an improved structure for better light emitting efficiency and better light output performance. The LED includes an n-GaN layer formed on a substrate to have a plurality of protrusions, thereby having an uneven surface, wherein a side surface of the protrusions is inclined with a first inclination angle α (35°≦α≦90°) with respect to an upper surface of the substrate; an active layer conformally formed on the surface of the n-GaN layer, wherein the surface of the active layer formed on the side surface of the protrusions is inclined with a second inclination angle β (35°≦β≦α) with respect to the upper surface of the substrate; a p-GaN layer conformally formed on the surface of the active layer, wherein the surface of the p-GaN layer formed on the surface of the inclined portion of the active layer is inclined with a third inclination angle γ (20°≦γ

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