Top-emitting light emitting diodes and methods of manufacturing thereof
    1.
    发明授权
    Top-emitting light emitting diodes and methods of manufacturing thereof 有权
    顶部发光二极管及其制造方法

    公开(公告)号:US08053786B2

    公开(公告)日:2011-11-08

    申请号:US12923053

    申请日:2010-08-31

    IPC分类号: H01L33/00

    CPC分类号: H01L33/42 H01L33/32

    摘要: Provided are a top-emitting nitride based light emitting device having an n-type clad layer, an active layer and a p-type clad layer sequentially stacked thereon, comprising an interface modification layer formed on the p-type clad layer and a transparent conductive thin film layer made up of a transparent conductive material formed on the interface modification layer; and a process for preparing the same. In accordance with the top-emitting nitride-based light emitting device of the present invention and a process for preparing the same, there are provided advantages such as improved ohmic contact with the p-type clad layer, leading to increased wire bonding efficiency and yield upon packaging the light emitting device, capability to improve luminous efficiency and life span of the device due to low specific contact resistance and excellent current-voltage properties.

    摘要翻译: 本发明提供一种具有依次层叠的n型覆盖层,有源层和p型覆盖层的顶部发光氮化物系发光元件,其特征在于,具有形成在p型覆盖层上的界面改性层和透明导电性 由形成在界面改性层上的透明导电材料构成的薄膜层; 及其制备方法。 根据本发明的顶部发光氮化物系发光器件及其制备方法,提供了与p型覆盖层的欧姆接触改善的优点,从而提高引线键合效率和产率 在包装发光器件时,能够通过低比接触电阻和优异的电流 - 电压特性提高器件的发光效率和使用寿命。

    Method of manufacturing light emitting device
    3.
    发明授权
    Method of manufacturing light emitting device 有权
    制造发光器件的方法

    公开(公告)号:US08003419B2

    公开(公告)日:2011-08-23

    申请号:US12458900

    申请日:2009-07-27

    IPC分类号: H01L21/00

    摘要: Provided is a method of manufacturing a light emitting device from a large-area bonding wafer by using a wafer bonding method using. The method may include forming a plurality of semiconductor layers, each having an active region for emitting light, on a plurality of growth substrates. The method may also include arranging the plurality of growth substrates on which the semiconductor layers are formed on one bonding substrate and simultaneously processing each of the semiconductor layers formed on each of the growth substrates through subsequent processes. The bonding wafer may be formed of a material that reduces or prevents bending or warping due to a difference of thermal expansion coefficients between a wafer material, such as sapphire, and a bonding wafer. According to the above method, because a plurality of wafers may be processed by one process, mass production of LEDs may be possible which may reduce manufacturing costs.

    摘要翻译: 提供了一种使用晶片接合方法从大面积接合晶片制造发光器件的方法。 该方法可以包括在多个生长衬底上形成多个半导体层,每个半导体层具有发射光的有源区。 该方法还可以包括在其上形成半导体层的多个生长衬底布置在一个接合衬底上,并且通过后续处理同时处理在每个生长衬底上形成的每个半导体层。 接合晶片可以由减少或防止由于晶片材料(例如蓝宝石)和接合晶片之间的热膨胀系数的差异而导致的弯曲或翘曲的材料形成。 根据上述方法,由于可以通过一个处理来处理多个晶片,因此大量生产LED可能会降低制造成本。

    Flip-chip light emitting diodes and method of manufacturing thereof

    公开(公告)号:US20110086448A1

    公开(公告)日:2011-04-14

    申请号:US12926638

    申请日:2010-12-01

    IPC分类号: H01L33/60

    CPC分类号: H01L33/405 H01L33/32

    摘要: Provided are a flip-chip nitride-based light emitting device having an n-type clad layer, an active layer and a p-type clad layer sequentially stacked thereon, comprising a reflective layer formed on the p-type clad layer and at least one transparent conductive thin film layer made up of transparent conductive materials capable of inhibiting diffusion of materials constituting the reflective layer, interposed between the p-type clad layer and reflective layer; and a process for preparing the same. In accordance with the flip-chip nitride-based light emitting device of the present invention and a process for preparing the same, there are provided advantages such as improved ohmic contact properties with the p-type clad layer, leading to increased wire bonding efficiency and yield upon packaging the light emitting device, capability to improve luminous efficiency and life span of the device due to low specific contact resistance and excellent current-voltage properties.

    Nitride-based semiconductor light emitting device and method of manufacturing the same
    6.
    发明授权
    Nitride-based semiconductor light emitting device and method of manufacturing the same 有权
    氮化物系半导体发光元件及其制造方法

    公开(公告)号:US07871845B2

    公开(公告)日:2011-01-18

    申请号:US11808368

    申请日:2007-06-08

    IPC分类号: H01L21/00

    摘要: Provided is a nitride-based semiconductor light emitting device having increased efficiency and power characteristics and method of manufacturing the same. The method may include forming a sacrificial layer on a substrate, forming a passivation layer on the sacrificial layer, forming a plurality of masking dots of a metal nitride on the passivation layer, laterally epitaxially growing a nitride-based semiconductor layer on the passivation layer using the masking dots as masks, forming a semiconductor device on the nitride-based semiconductor layer, and wet etching the sacrificial layer to separate and/or remove the substrate from the semiconductor device.

    摘要翻译: 提供了一种具有提高的效率和功率特性的氮化物基半导体发光器件及其制造方法。 该方法可以包括在衬底上形成牺牲层,在牺牲层上形成钝化层,在钝化层上形成金属氮化物的多个掩蔽点,在钝化层上横向外延生长氮化物基半导体层,使用 掩模点作为掩模,在氮化物基半导体层上形成半导体器件,以及湿蚀刻牺牲层,以从半导体器件分离和/或去除衬底。

    Nitride-based light emitting device and method of manufacturing the same
    8.
    发明授权
    Nitride-based light emitting device and method of manufacturing the same 有权
    氮化物基发光器件及其制造方法

    公开(公告)号:US07180094B2

    公开(公告)日:2007-02-20

    申请号:US10957704

    申请日:2004-10-05

    IPC分类号: H01L29/04

    摘要: Provided are a nitride-based light emitting device and a method of manufacturing the same. The nitride-based light emitting device has a structure in which at least an n-cladding layer, an active layer, and a p-cladding layer are sequentially formed on a substrate. The light emitting device further includes an ohmic contact layer composed of a zinc (Zn)-containing oxide containing a p-type dopant formed on the p-cladding layer. The method of manufacturing the nitride-based light emitting device includes forming an ohmic contact layer composed of Zn-containing oxide containing a p-type dopant on the p-cladding layer, the ohmic contact layer being made and annealing the resultant structure. The nitride-based light emitting device and manufacturing method provide excellent I–V characteristics by improving ohmic contact with a p-cladding layer while significantly enhancing light emission efficiency of the device due to high light transmittance of a transparent electrode.

    摘要翻译: 提供一种氮化物系发光器件及其制造方法。 氮化物系发光器件具有在衬底上依次形成至少n包层,有源层和p包层的结构。 发光装置还包括由含有含锌(Zn)的氧化物构成的欧姆接触层,该氧化物含有形成在p包覆层上的p型掺杂剂。 制造氮化物系发光器件的方法包括在p包覆层上形成由含有p型掺杂剂的含Zn氧化物构成的欧姆接触层,形成欧姆接触层并退火所得到的结构。 基于氮化物的发光器件和制造方法通过改善与p型覆层的欧姆接触而提供优异的I-V特性,同时由于透明电极的高透光率而显着提高了器件的发光效率。

    Top-emitting nitride-based light-emitting device with ohmic characteristics and luminous efficiency
    9.
    发明授权
    Top-emitting nitride-based light-emitting device with ohmic characteristics and luminous efficiency 有权
    发光氮化物基发光器件具有欧姆特性和发光效率

    公开(公告)号:US08395176B2

    公开(公告)日:2013-03-12

    申请号:US11076249

    申请日:2005-03-10

    IPC分类号: H01L33/00

    摘要: A top-emitting nitride-based light-emitting device and a method of manufacturing the same. The top-emitting nitride-based light-emitting device having a substrate, an n-cladding layer, an active layer, and a p-cladding layer sequentially formed includes: a grid cell layer formed on the p-cladding layer by a grid array of separated cells formed from a conducting material with a width of less than 30 micrometers to improve electrical and optical characteristics; a surface protective layer that is formed on the p-cladding layer and covers at least regions between the cells to protect a surface of the p-cladding layer; and a transparent conducting layer formed on the surface protective layer and the grid cell layer using a transparent conducting material. The light-emitting device and the method of manufacturing the same provide an improved ohmic contact to the p-cladding layer, excellent I-V characteristics, and high light transmittance, thus increasing luminous efficiency of the device.

    摘要翻译: 顶部发光氮化物系发光器件及其制造方法。 具有依次形成的基板,n包层,有源层和p型包覆层的顶部发射氮化物系发光器件包括:网格单元层,其通过栅格阵列形成在p包层上 由宽度小于30微米的导电材料形成的分离的电池,以改善电气和光学特性; 表面保护层,其形成在所述p包覆层上并且覆盖所述电池之间的至少区域以保护所述p型覆层的表面; 以及使用透明导电材料形成在表面保护层和栅极电池层上的透明导电层。 发光器件及其制造方法提供了对p型覆层的改善的欧姆接触,优异的I-V特性和高透光率,从而提高了器件的发光效率。