公开(公告)号：US20120056227A1

公开(公告)日：2012-03-08

申请号：US13224658

申请日：2011-09-02

Applicant: Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon ,  Gwang Bok Woo

Inventor： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon ,  Gwang Bok Woo

IPC: H01L33/62 ,  H01L33/58

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2933/0075 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package is disclosed. The LED package includes a lead frame comprising a thermal pad and at least two electrode pads disposed at a distance from the thermal pad; at least one LED mounted on the thermal pad and electrically connected with the at least two electrode pads through a wire; a package mold comprising a first cavity to receive the thermal pad and the at least two electrode pads and to partially expose the thermal pad and the at least two electrode pads through a first surface of the package mold, the first surface on which the at least one LED is mounted, and exposing the thermal pad and the at least two electrode pads through a surface coplanar with a second surface opposite to the first surface; and a molding unit disposed in the first cavity.

Abstract translation: 公开了一种发光二极管（LED）封装。 所述LED封装包括引线框架，所述引线框架包括散热焊盘和至少两个设置在距离所述散热焊盘一定距离的电极焊盘; 至少一个LED，其安装在所述散热垫上并通过导线与所述至少两个电极焊盘电连接; 封装模具，其包括用于接收所述热垫和所述至少两个电极焊盘的第一腔，并且通过所述封装模具的第一表面部分地暴露所述热垫和所述至少两个电极焊盘，所述第一表面至少在所述第一表面上， 安装一个LED，并且通过与第一表面相对的第二表面共面的表面暴露热衬垫和至少两个电极焊盘; 以及设置在所述第一腔中的模制单元。

公开(公告)号：US20120043896A1

公开(公告)日：2012-02-23

申请号：US13215619

申请日：2011-08-23

Applicant: Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon

Inventor： Young Jin LEE ,  Hyung Kun Kim ,  Kyung Mi Moon

IPC: H05B37/02

CPC classification number: H05B33/0821 ,  H05B33/0806

Abstract: There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.

Abstract translation: 提供了一种包括串联连接的多个LED阵列的交流（AC）驱动的发光器件，每个LED阵列具有多个LED电连接以形成两端电路并通过双向电压发光的结构 当对两端电路施加交流电压时; 以及连接到所述多个LED阵列中的至少一个并且控制相对于所述多个LED阵列的总驱动电压的开关装置。 交流驱动发光器件允许从低驱动电压Vf进行操作，同时具有高电压Vf的高驱动电压，从而在功率因数，THD和能量效率方面实现卓越。

公开(公告)号：US20090322248A1

公开(公告)日：2009-12-31

申请号：US12262801

申请日：2008-10-31

Applicant: Young Jin LEE ,  Joong Kon SON ,  Hyung Kun KIM ,  Jung Ja YANG ,  Grigory ONUSHKIN

Inventor： Young Jin LEE ,  Joong Kon SON ,  Hyung Kun KIM ,  Jung Ja YANG ,  Grigory ONUSHKIN

IPC: H05B41/36

CPC classification number: H05B33/0821

Abstract: There is provided an LED driving circuit. The LED driving circuit according to an aspect of the invention may include: at least one ladder circuit including: (n−1) number (here, n is a positive integer satisfying n≧2) of first branches provided between first and second junction points, and connected in-line with each other by n number of first middle junction points, (n−1) number of second branches arranged in parallel with the first branches, and connected in-line with each other by n number of second middle junction points between the first and second junction points, and n number of middle branches connecting m-th first and second middle junction points to each other, wherein at least one LED device is disposed on each of the first, second, and middle branches. Here, the number of LED devices included in each of the first and second branches is greater than the number of LED devices included in each of the middle branches.

Abstract translation: 提供了LED驱动电路。 根据本发明的一个方面的LED驱动电路可以包括：至少一个梯形电路，包括：设置在第一和第二结之间的第一分支的（n-1）个数（这里，n是满足n> = 2的正整数） 点，并且通过n个第一中间连接点彼此并排连接，（n-1）个与第一分支平行布置的第二分支，并且彼此连接成n个第二中间 第一和第二接合点之间的接合点以及将第m个第一和第二中间接合点彼此连接的n个中间分支，其中至少一个LED器件设置在第一，第二和中间分支中的每一个上。 这里，包括在第一和第二分支中的每个中的LED装置的数量大于包括在每个中间分支中的LED装置的数量。

公开(公告)号：US20100127300A1

公开(公告)日：2010-05-27

申请号：US12343455

申请日：2008-12-23

Applicant: Young Jin LEE ,  Hyung Kun Kim

Inventor： Young Jin LEE ,  Hyung Kun Kim

IPC: H01L31/00

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2924/00

Abstract: Provided is a ceramic package for headlamp, and a headlamp module having the same. The ceramic package for headlamp includes a body part, a pair of internal electrodes, and an electrode exposing part. The body part has a cavity formed therein. The cavity is upwardly opened to expose a light emitting diode mounted on a mounting part. The pair of internal electrodes in the body part is electrically connected to the light emitting diode. The electrode exposing part is stepped at either side of the body part to upwardly expose the internal electrode to the outside.

Abstract translation: 提供了一种用于头灯的陶瓷封装件和具有该陶瓷封装件的前照灯模块。 用于头灯的陶瓷封装包括主体部分，一对内部电极和电极暴露部分。 主体部分具有形成在其中的空腔。 空腔向上打开以暴露安装在安装部件上的发光二极管。 主体部分中的一对内部电极电连接到发光二极管。 电极暴露部分在主体部分的任一侧是阶梯状的，以将内部电极向外暴露于外部。

公开(公告)号：US20120153849A1

公开(公告)日：2012-06-21

申请号：US13324514

申请日：2011-12-13

Applicant: Young Jin LEE ,  Hyung Kun Kim

Inventor： Young Jin LEE ,  Hyung Kun Kim

IPC: H05B37/02

CPC classification number: H05B33/0821

Abstract: Provided is an alternating current (AC) driven light emitting device, including: a plurality of half-wave driving units respectively having at least one light emitting diode (LED) and provided in a loop connecting respective half-wave driving unit terminals; and at least one full-wave driving unit having at least one LED and connecting one node between two of the plurality of half-wave driving units to another node between another two of the plurality of half-wave driving units, at least one of the half-wave driving unit and the full-wave driving unit having a parallel connection structure of at least two LEDs. An array of LEDs appropriate to being drivable by AC is provided to secure reliability in error in operation of some LEDs.

Abstract translation: 提供一种交流（AC）驱动的发光器件，包括：多个半波驱动单元，分别具有至少一个发光二极管（LED），并且设置在连接各个半波驱动单元端子的环路中; 以及至少一个全波驱动单元，其具有至少一个LED并且将所述多个半波驱动单元中的两个之间的一个节点连接到所述多个半波驱动单元中的另两个之间的另一节点，所述至少一个 半波驱动单元和具有至少两个LED的并联连接结构的全波驱动单元。 提供了适合于被AC驱动的LED阵列，以确保一些LED的操作中的可靠性错误。

公开(公告)号：US20110127912A1

公开(公告)日：2011-06-02

申请号：US12956812

申请日：2010-11-30

Applicant: Young Jin LEE ,  Hyung Kun Kim

Inventor： Young Jin LEE ,  Hyung Kun Kim

IPC: H01K1/62 ,  H01L33/62 ,  H01L33/58 ,  H01L33/08 ,  F21V11/00

CPC classification number: H01L33/647 ,  F21S41/147 ,  F21V29/677 ,  F21V29/89 ,  H01L2224/13 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10174 ,  H05K2201/10969

Abstract: Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.

Abstract translation: 公开了一种LED封装，具有该LED封装的LED封装模块及其制造方法以及具有该LED封装模块及其控制方法的头灯模块。 发光二极管封装包括：封装衬底; 安装在所述封装基板的一个表面上的发光二极管芯片; 电极焊盘，形成在所述封装基板的另一个表面上并电连接到所述发光二极管芯片; 以及形成在所述封装基板的另一表面上并与所述电极焊盘电绝缘的散热焊盘。

公开(公告)号：US20100128463A1

公开(公告)日：2010-05-27

申请号：US12626813

申请日：2009-11-27

Applicant: Hyung Kun KIM ,  Young Jin LEE

Inventor： Hyung Kun KIM ,  Young Jin LEE

IPC: F21V9/16

CPC classification number: F21S45/43 ,  F21S41/147 ,  F21S41/28 ,  F21V29/677 ,  F21V29/76 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: There is provided a headlight for a vehicle. The headlight uses a light emitting device as a light source, so that light intensity can be enhanced and rectangular beams without discontinuity can be emitted, thereby enhancing light distribution characteristic.

Abstract translation: 为车辆提供前大灯。 头灯使用发光器件作为光源，从而可以增强光强度，并且可以发射不间断的矩形光束，从而增强光分布特性。

公开(公告)号：US20130113111A1

公开(公告)日：2013-05-09

申请号：US13602101

申请日：2012-09-01

Applicant: Young Jin LEE

Inventor： Young Jin LEE

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L21/76883 ,  H01L21/76802 ,  H01L21/7682 ,  H01L21/76843 ,  H01L23/5222 ,  H01L23/5226 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device and methods directed toward preventing a leakage current between a contact plug and a line adjacent to the contact plug, and minimizing capacitance between adjacent lines.

Abstract translation: 一种半导体器件和方法，旨在防止接触插塞和与接触插塞相邻的线路之间的漏电流，并使相邻线路之间的电容最小化。

公开(公告)号：US20090017619A1

公开(公告)日：2009-01-15

申请号：US12169790

申请日：2008-07-09

Applicant: Young Jin LEE ,  Baek Mann KIM ,  Soo Hyun KIM ,  Dong Ha JUNG ,  Jeong Tae KIM ,  Hyeong Tag JEON ,  Keun Woo LEE ,  Keun Jun KIM ,  Tae Yong PARK

Inventor： Young Jin LEE ,  Baek Mann KIM ,  Soo Hyun KIM ,  Dong Ha JUNG ,  Jeong Tae KIM ,  Hyeong Tag JEON ,  Keun Woo LEE ,  Keun Jun KIM ,  Tae Yong PARK

IPC: H01L21/44

CPC classification number: H01L21/28518 ,  H01L21/28556 ,  H01L21/76843 ,  H01L21/76855

Abstract: A metal suicide layer is fabricated in a semiconductor device. A first metal layer is deposited on a silicon substrate formed with an S interlayer dielectric having a contact hole through PVD. A second metal layer is deposited on the first metal layer through any one of CVD and ALD. Annealing is performed on the silicon substrate which is formed with the first and second metal layers to form the metal silicide. The portions of the second metal layer and the first metal layer which have not reacted during annealing are removed.

Abstract translation: 在半导体器件中制造金属硅化物层。 第一金属层沉积在由具有通过PVD的接触孔的S层间电介质形成的硅衬底上。 通过CVD和ALD中的任一种将第二金属层沉积在第一金属层上。 在由第一和第二金属层形成的硅衬底上进行退火以形成金属硅化物。 去除在退火过程中没有反应的第二金属层和第一金属层的部分。

公开(公告)号：US20080157367A1

公开(公告)日：2008-07-03

申请号：US11755390

申请日：2007-05-30

Applicant: Soo Hyun KIM ,  Baek Mann KIM ,  Young Jin LEE ,  Dong Ha JUNG ,  Jeong Tae KIM

Inventor： Soo Hyun KIM ,  Baek Mann KIM ,  Young Jin LEE ,  Dong Ha JUNG ,  Jeong Tae KIM

IPC: H01L23/52 ,  H01L21/4763

CPC classification number: H01L21/76843 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/76846 ,  H01L21/76856 ,  H01L23/53223 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A multi-layer metal wiring of a semiconductor device and a method for forming the same are disclosed. The multi-layer metal wiring of the semiconductor device includes a lower Cu wiring, and an upper Al wiring formed to be contacted with the lower Cu wiring, and a diffusion barrier layer interposed between the lower Cu wiring and the upper Al wiring. The diffusion barrier layer is formed of a W-based layer.

Abstract translation: 公开了一种半导体器件的多层金属布线及其形成方法。 半导体器件的多层金属布线包括下Cu布线和形成为与下Cu布线接触的上Al布线，以及介于下Cu布线和上Al布线之间的扩散阻挡层。 扩散阻挡层由W基层形成。