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    Microelectromechanical systems type semiconductor gas sensor using microheater having many holes and method for manufacturing the same
    2.
    发明授权
    Microelectromechanical systems type semiconductor gas sensor using microheater having many holes and method for manufacturing the same 有权
    微机电系统使用具有许多孔的微加热器的半导体气体传感器及其制造方法

    公开(公告)号：US08683847B2

    公开(公告)日：2014-04-01

    申请号：US13345772

    申请日：2012-01-09

    申请人： Seung Eon Moon ,  Jae Woo Lee ,  Nak Jin Choi ,  Hyung Kun Lee ,  Woo Seok Yang ,  Jong Dae Kim

    发明人： Seung Eon Moon ,  Jae Woo Lee ,  Nak Jin Choi ,  Hyung Kun Lee ,  Woo Seok Yang ,  Jong Dae Kim

    IPC分类号： H01L21/02 ,  G01N7/04

    CPC分类号： G01N27/128 ,  G01N27/123

    摘要： Disclosed are an MEMS type semiconductor gas sensor using a microheater having many holes and a method for manufacturing the same. The MEMS type semiconductor gas sensor includes: a substrate of which a central region is etched with a predetermined thickness; a second membrane formed at an upper portion of the central region of the substrate and having many holes; a heat emitting resistor formed on the second membrane and having many holes; a first membrane formed on the second membrane including the heat emitting resistor and having many holes; a sensing electrode formed on the first membrane and having many holes; and a sensing material formed on the sensing electrode.

    摘要翻译： 公开了使用具有许多孔的微加热器的MEMS型半导体气体传感器及其制造方法。 MEMS型半导体气体传感器包括：以预定厚度蚀刻中心区域的基板; 第二膜，形成在所述基板的中心区域的上部并具有许多孔; 形成在第二膜上并具有许多孔的发热电阻器; 形成在包括所述发热电阻器并具有许多孔的所述第二膜上的第一膜; 形成在第一膜上并具有许多孔的感测电极; 以及感测材料，形成在感测电极上。

    MEMS ELECTROCHEMICAL GAS SENSOR
    4.
    发明申请
    MEMS ELECTROCHEMICAL GAS SENSOR 有权
    MEMS电化学气体传感器

    公开(公告)号：US20130075255A1

    公开(公告)日：2013-03-28

    申请号：US13620546

    申请日：2012-09-14

    申请人： Seung Eon Moon ,  Nak Jin Choi ,  Hyung Kun Lee ,  Jae Woo Lee ,  Woo Seok Yang ,  Jong Dae Kim

    发明人： Seung Eon Moon ,  Nak Jin Choi ,  Hyung Kun Lee ,  Jae Woo Lee ,  Woo Seok Yang ,  Jong Dae Kim

    IPC分类号： G01N27/407

    CPC分类号： G01N27/18 ,  G01N33/004

    摘要： Disclosed is an electrochemical gas sensor using micro electro mechanical systems (MEMS). The MEMS electrochemical gas sensor includes: a substrate a lower central region of which is etched by a predetermined thickness; a first insulation film formed on the substrate; a heat emitting resistance body formed on the first insulation film; a second insulation film formed on the heat emitting resistance body; a reference electrode formed in an upper central region of the second insulation film; a solid electrolyte formed on the reference electrode; and a detection electrode formed on the solid electrolyte.

    摘要翻译： 公开了一种使用微机电系统（MEMS）的电化学气体传感器。 MEMS电化学气体传感器包括：其下部中心区域被预定厚度蚀刻的衬底; 形成在所述基板上的第一绝缘膜; 形成在第一绝缘膜上的发热电阻体; 形成在所述发热电阻体上的第二绝缘膜; 参考电极，其形成在所述第二绝缘膜的上中央区域中; 形成在参比电极上的固体电解质; 和形成在固体电解质上的检测电极。

    MEMS electrochemical gas sensor
    5.
    发明授权
    MEMS electrochemical gas sensor 有权
    MEMS电化学气体传感器

    公开(公告)号：US09494543B2

    公开(公告)日：2016-11-15

    申请号：US13620546

    申请日：2012-09-14

    申请人： Seung Eon Moon ,  Nak Jin Choi ,  Hyung Kun Lee ,  Jae Woo Lee ,  Woo Seok Yang ,  Jong Dae Kim

    发明人： Seung Eon Moon ,  Nak Jin Choi ,  Hyung Kun Lee ,  Jae Woo Lee ,  Woo Seok Yang ,  Jong Dae Kim

    IPC分类号： G01N27/407 ,  G01N27/18 ,  G01N33/00

    CPC分类号： G01N27/18 ,  G01N33/004

    摘要： Disclosed is an electrochemical gas sensor using micro electro mechanical systems (MEMS). The MEMS electrochemical gas sensor includes: a substrate a lower central region of which is etched by a predetermined thickness; a first insulation film formed on the substrate; a heat emitting resistance body formed on the first insulation film; a second insulation film formed on the heat emitting resistance body; a reference electrode formed in an upper central region of the second insulation film; a solid electrolyte formed on the reference electrode; and a detection electrode formed on the solid electrolyte.

    摘要翻译： 公开了一种使用微机电系统（MEMS）的电化学气体传感器。 MEMS电化学气体传感器包括：其下部中心区域被预定厚度蚀刻的衬底; 形成在所述基板上的第一绝缘膜; 形成在第一绝缘膜上的发热电阻体; 形成在所述发热电阻体上的第二绝缘膜; 参考电极，其形成在所述第二绝缘膜的上中央区域中; 形成在参比电极上的固体电解质; 和形成在固体电解质上的检测电极。

    ACOUSTIC SENSOR AND FABRICATION METHOD THEREOF
    8.
    发明申请
    ACOUSTIC SENSOR AND FABRICATION METHOD THEREOF 有权
    声学传感器及其制造方法

    公开(公告)号：US20130100779A1

    公开(公告)日：2013-04-25

    申请号：US13557108

    申请日：2012-07-24

    申请人： Jae Woo LEE ,  Chang Han Je ,  Woo Seok Yang ,  Jong Dae Kim

    发明人： Jae Woo LEE ,  Chang Han Je ,  Woo Seok Yang ,  Jong Dae Kim

    IPC分类号： H04R17/00 ,  H04R31/00

    CPC分类号： H04R19/005 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005 ,  H01L2924/00014

    摘要： A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.

    摘要翻译： 根据本公开的示例性实施例的用于制造声学传感器的方法包括：通过在基板的上部形成下电极来形成声传感器单元，在下电极上形成蚀刻孔，在其上形成牺牲层 下部电极的上部，并且将隔膜连接到牺牲层的上部; 将声学传感器单元的基板的下部耦合到其上形成有声压输入孔的印刷电路板，以便通过声压输入孔将声学传感器单元的基板的下部暴露于外部 ; 将覆盖所述声学传感器单元的盖附着在所述印刷电路板上; 蚀刻声学传感器单元的基板以形成声学室; 并去除牺牲层。

    Piezoelectric speaker
    9.
    发明授权
    Piezoelectric speaker 有权
    压电扬声器

    公开(公告)号：US08873776B2

    公开(公告)日：2014-10-28

    申请号：US13289225

    申请日：2011-11-04

    申请人： Hye-Jin Kim ,  Woo Seok Yang ,  Jong Dae Kim

    发明人： Hye-Jin Kim ,  Woo Seok Yang ,  Jong Dae Kim

    IPC分类号： H04R25/00

    CPC分类号： H04R17/005 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2499/15

    摘要： Disclosed is a piezoelectric speaker including: a piezoelectric layer that converts electrical signals into oscillation and outputs sound; an electrode that is formed on a top or a bottom of the piezoelectric layer to apply the electrical signals to the piezoelectric layer; an acoustic diaphragm that is made of a hetero material including a first acoustic diaphragm and a second acoustic diaphragm and is attached to the bottom of the piezoelectric layer on which the electrode is formed; and a frame attached in a form enclosing a side of the acoustic diaphragm.

    摘要翻译： 公开了一种压电扬声器，包括：将电信号转换为振荡并输出声音的压电层; 形成在压电层的顶部或底部上以将电信号施加到压电层的电极; 由包括第一声膜和第二声膜的异质材料制成并附着在其上形成有电极的压电层的底部的声膜; 以及以包围隔膜的一侧的形式附接的框架。

    Acoustic sensor and fabrication method thereof
    10.
    发明授权
    Acoustic sensor and fabrication method thereof 有权
    声传感器及其制造方法

    公开(公告)号：US09066184B2

    公开(公告)日：2015-06-23

    申请号：US13557108

    申请日：2012-07-24

    申请人： Jae Woo Lee ,  Chang Han Je ,  Woo Seok Yang ,  Jong Dae Kim

    发明人： Jae Woo Lee ,  Chang Han Je ,  Woo Seok Yang ,  Jong Dae Kim

    IPC分类号： H04R31/00 ,  H04R19/00 ,  H04R19/04

    CPC分类号： H04R19/005 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005 ,  H01L2924/00014

    摘要： A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.

    摘要翻译： 根据本公开的示例性实施例的用于制造声学传感器的方法包括：通过在基板的上部形成下电极来形成声传感器单元，在下电极上形成蚀刻孔，在其上形成牺牲层 下部电极的上部，并且将隔膜连接到牺牲层的上部; 将声学传感器单元的基板的下部耦合到其上形成有声压输入孔的印刷电路板，以便通过声压输入孔将声学传感器单元的基板的下部暴露于外部 ; 将覆盖所述声学传感器单元的盖附着在所述印刷电路板上; 蚀刻声学传感器单元的基板以形成声学室; 并去除牺牲层。