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    Exposure apparatus
    6.
    发明授权
    Exposure apparatus 有权
    曝光装置

    公开(公告)号：US07190432B2

    公开(公告)日：2007-03-13

    申请号：US11249783

    申请日：2005-10-13

    Applicant: Sang Gi Kim ,  Ju Wook Lee ,  Jong Moon Park ,  Seong Wook Yoo ,  Kun Sik Park ,  Yong Sun Yoon ,  Yoon Kyu Bae ,  Byung Won Lim ,  Jin Gun Koo ,  Boo Woo Kim

    Inventor： Sang Gi Kim ,  Ju Wook Lee ,  Jong Moon Park ,  Seong Wook Yoo ,  Kun Sik Park ,  Yong Sun Yoon ,  Yoon Kyu Bae ,  Byung Won Lim ,  Jin Gun Koo ,  Boo Woo Kim

    IPC: G03B27/32 ,  G03B27/42 ,  G03B27/70 ,  G03B27/54

    CPC classification number: G03F7/70425

    Abstract: Provided is a wafer exposure apparatus used in a semiconductor device manufacturing process, the exposure apparatus including: a reflective mirror for reflecting light provided from a light source; an optical path changer for changing a path of the light provided from the reflective mirror; first mirrors installed at both sides of the optical path changer to change the path of the light; second mirrors installed at both sides of a material to change the path of the light; and third mirrors installed at both sides of a mask to enter the light reflected by the first mirrors to the mask and to enter the light passed through the mask into the second mirrors, whereby it is possible to continuously expose one surface, both surfaces or a specific surface of a wafer in a state that the wafer is once aligned.

    Abstract translation: 提供了一种在半导体器件制造工艺中使用的晶片曝光装置，该曝光装置包括：用于反射从光源提供的光的反射镜; 用于改变从反射镜提供的光的路径的光路改变器; 首先将镜子安装在光路改换器的两侧，以改变光线的路径; 第二个镜子安装在材料的两侧以改变光线的路径; 和第三反射镜，其安装在掩模的两侧，以将由第一反射镜反射的光进入掩模，并将通过掩模的光进入第二反射镜，由此可以连续地将一个表面，两个表面或一个 在晶片一次对准的状态下晶片的比表面。

    Method of fabricating T-type gate
    7.
    发明申请
    Method of fabricating T-type gate 失效

    公开(公告)号：US20060079030A1

    公开(公告)日：2006-04-13

    申请号：US11179983

    申请日：2005-07-12

    Applicant: Jong Moon Park ,  Kun Sik Park ,  Seong Wook Yoo ,  Yong Sun Yoon ,  Sang Gi Kim ,  Yoon Kyu Bae ,  Byung Won Lim ,  Jin Gun Koo ,  Bo Woo Kim

    Inventor： Jong Moon Park ,  Kun Sik Park ,  Seong Wook Yoo ,  Yong Sun Yoon ,  Sang Gi Kim ,  Yoon Kyu Bae ,  Byung Won Lim ,  Jin Gun Koo ,  Bo Woo Kim

    IPC: H01L21/8232 ,  H01L21/338

    CPC classification number: H01L21/28587

    Abstract: Provided is a method of fabricating a T-type gate including the steps of: forming a first photoresist layer, a blocking layer and a second photoresist layer to a predetermined thickness on a substrate, respectively; forming a body pattern of a T-type gate on the second photoresist layer and the blocking layer; exposing a predetermined portion of the second photoresist layer to form a head pattern of the T-type gate, and performing a heat treatment process to generate cross linking at a predetermined region of the second photoresist layer except for the head pattern of the T-type gate; performing an exposure process on an entire surface of the resultant structure, and then removing the exposed portion; and forming a metal layer of a predetermined thickness on an entire surface of the resultant structure, and then removing the first photoresist layer, the blocking layer, the predetermined region of the second photoresist layer in which the cross linking are generated, and the metal layer, whereby it is possible to readily perform a compound semiconductor device manufacturing process, and to reduce manufacturing cost by means of the increase of manufacturing yield and the simplification of manufacturing processes.

    Method for fabricating a high-voltage high-power integrated circuit device
    8.
    发明授权
    Method for fabricating a high-voltage high-power integrated circuit device 有权
    高压大功率集成电路器件的制造方法

    公开(公告)号：US06855581B2

    公开(公告)日：2005-02-15

    申请号：US10153975

    申请日：2002-05-23

    Applicant: Tae Moon Roh ,  Dae Woo Lee ,  Yil Suk Yang ,  Il Yong Park ,  Sang Gi Kim ,  Jin Gun Koo ,  Jong Dae Kim

    Inventor： Tae Moon Roh ,  Dae Woo Lee ,  Yil Suk Yang ,  Il Yong Park ,  Sang Gi Kim ,  Jin Gun Koo ,  Jong Dae Kim

    IPC: H01L21/76 ,  H01L21/84 ,  H01L27/12

    CPC classification number: H01L27/1203 ,  H01L21/84

    Abstract: The present invention relates to a method of fabricating a high-voltage high-power integrated circuit device using a substrate of a SOI structure in which an insulating film and a silicon layer are sequentially stacked on a silicon substrate. The method comprising the steps of sequentially forming an oxide film and a photoresist film on the silicon layer and then performing a photolithography process using a trench mask to pattern the photoresist film; patterning the oxide film using the patterned photoresist film as a mask and then removing the photoresist film remained after the patterning; etching the silicon layer using the patterned oxide film as a mask until the insulating film is exposed to form a trench; forming a nitride film on the entire surface including the trench, performing an annealing process and depositing polysilicon on the entire surface so that the trench is buried; and sequentially removing the polysilicon and the nitride film until the silicon layer is exposed to flatten the surface, thus forming a device isolating film for electrical isolation between devices within the trench. Therefore, the present invention can effectively reduce the isolation area of the trench between the high-voltage high-power device and the logic CMOS device and can easily control the concentration of a deep well.

    Abstract translation: 本发明涉及使用其中绝缘膜和硅层依次层叠在硅衬底上的SOI结构的衬底的高压大功率集成电路器件的制造方法。 该方法包括以下步骤：在硅层上依次形成氧化物膜和光致抗蚀剂膜，然后使用沟槽掩模进行光刻工艺以对光刻胶膜进行图案化; 使用图案化的光致抗蚀剂膜作为掩模来图案化氧化膜，然后在图案化之后除去光致抗蚀剂膜; 使用所述图案化氧化膜作为掩模蚀刻所述硅层，直到所述绝缘膜暴露以形成沟槽; 在包括沟槽的整个表面上形成氮化物膜，执行退火处理并在整个表面上沉积多晶硅，使得沟槽被埋置; 并且顺序地去除多晶硅和氮化物膜，直到硅层暴露以使表面变平，从而形成用于在沟槽内的器件之间进行电隔离的器件隔离膜。 因此，本发明能够有效地降低高压大功率器件与逻辑CMOS器件之间的沟槽的隔离面积，能够容易地控制深井的浓度。

    Concrete block construction method and guide member for installing concrete block
    10.
    发明授权
    Concrete block construction method and guide member for installing concrete block 有权

    公开(公告)号：US10422094B2

    公开(公告)日：2019-09-24

    申请号：US16327074

    申请日：2017-07-25

    Applicant: Sang Gi Kim

    Inventor： Sang Gi Kim

    IPC: E02B3/04 ,  E02D23/08 ,  E02D25/00 ,  E02D23/00

    Abstract: A concrete block construction method, including: manufacturing a plurality of concrete blocks each having a vertical guide hole formed in a vertical direction; preparing a guide member for installing the concrete blocks; forming a lower concrete block structure by installing at least one of the concrete blocks; placing the concrete block subject to be installed on the lower concrete block structure by inserting the installation guide pole into the vertical guide hole of the concrete block subject to be installed; and separating and recovering the guide member for installing the concrete block from the concrete block subject to be installed, after placing the concrete block subject to be installed.

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