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    LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS
    1.
    发明申请
    LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS 审中-公开
    透明材料的激光改性

    公开(公告)号：US20160318122A1

    公开(公告)日：2016-11-03

    申请号：US15208374

    申请日：2016-07-12

    Applicant: IMRA America, Inc.

    Inventor： Michiharu Ota ,  Alan Y. Arai ,  Zhenlin Liu

    IPC: B23K26/0622 ,  B23K26/06 ,  C03B33/10 ,  B23K26/402 ,  B23K26/364 ,  B23K26/382 ,  B23K26/082

    CPC classification number: B23K26/0624 ,  B23K26/0604 ,  B23K26/082 ,  B23K26/36 ,  B23K26/364 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  C03B33/102

    Abstract: In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.

    Abstract translation: 在某些实施例中，公开了一种用于材料的基于激光的材料处理的方法和系统。 在至少一个优选的实施方案中，使用单独的脉冲激光源（例如纳秒（NS））和超短脉冲（USP）源（NS-USP）产生时间上重叠的脉冲序列。 脉冲作为一系列空间和时间重叠的脉冲对传送到材料。 材料可以但不一定是透明材料。 在透明材料加工的一些应用中，发现脉冲的组合比单独采用的单个脉冲系列可获得的材料变化和高加工质量要大得多。 公开了其它微加工方法和布置用于在基底上或内部形成精细特征。 这种方法和装置通常可以用NS-USP组合或与其他来源一起使用。

    Laser-based modification of transparent materials
    5.
    发明授权
    Laser-based modification of transparent materials 有权

    公开(公告)号：US10137527B2

    公开(公告)日：2018-11-27

    申请号：US15208374

    申请日：2016-07-12

    Applicant: IMRA America, Inc.

    Inventor： Michiharu Ota ,  Alan Y. Arai ,  Zhenlin Liu

    IPC: B23K26/06 ,  B23K26/38 ,  B23K26/0622 ,  B23K26/36 ,  B23K26/364 ,  B23K26/082 ,  B23K26/40 ,  B23K26/382 ,  B23K26/402 ,  C03B33/10 ,  B23K103/00

    Abstract: In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.

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