公开(公告)号：US20160169666A1

公开(公告)日：2016-06-16

申请号：US14583432

申请日：2014-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tzung-Te CHEN ,  Chien-Ping WANG ,  SHANG-PING YING ,  Yi-Keng FU ,  Hsun-Chih LIU

IPC: G01B11/25 ,  G01B11/255

CPC classification number: G01B11/2513 ,  G01B11/255

Abstract: An apparatus for measuring of a curvature of a thin film, is adapted to measure the curvature of a thin-film. The apparatus includes a light emitting module, a first optical module, a second optical module, a third optical module, an image capture module, and an image analysis module. The light emitting module emits at least one line laser as an incident light whose cross-sectional shape is a geometric picture formed of lines. The incident light is transmitted through a first optical path formed of the first optical module, and is directed to incident the thin film by the second optical module. The reflected light is reflected by the thin film go through the second optical path, and is directed to transmit through the third optical path by the third optical module, and then is captured by the capture module to form a second geometric picture.

Abstract translation: 用于测量薄膜曲率的装置适于测量薄膜的曲率。 该装置包括发光模块，第一光学模块，第二光学模块，第三光学模块，图像捕获模块和图像分析模块。 发光模块发射至少一条线激光器作为入射光，其入射光的横截面形状是由线形成的几何图形。 入射光通过由第一光学模块形成的第一光路透射，并且被引导通过第二光学模块入射薄膜。 反射光被薄膜反射穿过第二光路，并且被第三光学模块引导通过第三光路传输，然后被捕获模块捕获以形成第二几何图像。

公开(公告)号：US20130146936A1

公开(公告)日：2013-06-13

申请号：US13758647

申请日：2013-02-04

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yao-Jun TSAI ,  Chen-Peng HSU ,  Kuo-Feng LIN ,  Hsun-Chih LIU ,  Ji-Feng CHEN ,  Hung-Lieh HU ,  Chien-Jen SUN

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/10 ,  H01L33/20 ,  H01L33/38 ,  H01L33/48 ,  H01L2224/06102 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/24 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/8592 ,  H01L2224/92244 ,  H01L2924/12032 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than O. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.

Abstract translation: 提供一种发光二极管芯片，发光二极管封装结构及其形成方法。 发光二极管芯片包括具有多个空隙的接合层，或者发光二极管芯片的周围边界和接合层之间的最小水平距离大于O.发光二极管芯片，发光 二极管封装结构和方法可以提高产品产量并提高发光效率。