公开(公告)号：US20130146936A1

公开(公告)日：2013-06-13

申请号：US13758647

申请日：2013-02-04

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yao-Jun TSAI ,  Chen-Peng HSU ,  Kuo-Feng LIN ,  Hsun-Chih LIU ,  Ji-Feng CHEN ,  Hung-Lieh HU ,  Chien-Jen SUN

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/10 ,  H01L33/20 ,  H01L33/38 ,  H01L33/48 ,  H01L2224/06102 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/24 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/8592 ,  H01L2224/92244 ,  H01L2924/12032 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than O. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.

Abstract translation: 提供一种发光二极管芯片，发光二极管封装结构及其形成方法。 发光二极管芯片包括具有多个空隙的接合层，或者发光二极管芯片的周围边界和接合层之间的最小水平距离大于O.发光二极管芯片，发光 二极管封装结构和方法可以提高产品产量并提高发光效率。