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公开(公告)号:US10964476B2
公开(公告)日:2021-03-30
申请号:US16234015
申请日:2018-12-27
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Chun-An Lu , Ying-Jung Chiang , Yuan-Ling Tsai
Abstract: A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin.
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公开(公告)号:US11812663B2
公开(公告)日:2023-11-07
申请号:US16862724
申请日:2020-04-30
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Ying-Jung Chiang , Ren-Der Jean , Hong-Ching Lin , Hsu-Shen Chu
IPC: H10N10/17 , H10N10/01 , H10N10/852 , H10N10/853 , H10N10/857 , H10N10/85 , H10N10/00
CPC classification number: H10N10/17 , H10N10/01 , H10N10/852 , H10N10/853 , H10N10/857 , H10N10/00 , H10N10/85
Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.
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公开(公告)号:US20170148540A1
公开(公告)日:2017-05-25
申请号:US14983484
申请日:2015-12-29
Applicant: Industrial Technology Research Institute
Inventor: Yuan-Ling Tsai , Ying-Jung Chiang , Jiun-Jang Yu
CPC classification number: H01B3/30 , B32B3/26 , B32B3/263 , B32B3/30 , B32B7/04 , B32B15/01 , B32B15/04 , B32B15/043 , B32B15/092 , B32B15/16 , B32B15/20 , H01B1/20 , H01B1/22 , Y10T428/12389 , Y10T428/12396 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12479 , Y10T428/12486 , Y10T428/12493 , Y10T428/12535 , Y10T428/12569 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/12993
Abstract: A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.
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公开(公告)号:US20250081632A1
公开(公告)日:2025-03-06
申请号:US18818614
申请日:2024-08-29
Applicant: Industrial Technology Research Institute
Inventor: Hsin-Chung Wu , Chun-Wei Su , Tzu-Ting Lin , En-Yu Pan , Yu-Tsung Chiu , Chih-Lung Lin , Teng-Yu Wang , Chiou-Chu Lai , Ying-Jung Chiang
IPC: H01L31/048 , H01L31/024
Abstract: A solar cell module includes a first substrate, a second substrate, at least one cell unit, a first packaging film, a second packaging film, a first protective layer, a second protective layer, and a plurality of support members. The first substrate and the second substrate are disposed opposite to each other. The cell unit is disposed between the first substrate and the second substrate. The first packaging film is disposed between the cell unit and the first substrate. The second packaging film is disposed between the cell unit and the second substrate. The first protective layer is disposed between the cell unit and the first packaging film. The second protective layer is disposed between the cell unit and the second packaging film. The support members are respectively disposed between the first packaging film and the second packaging film and surround at least two opposite sides of the cell unit.
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公开(公告)号:US09905327B2
公开(公告)日:2018-02-27
申请号:US14983484
申请日:2015-12-29
Applicant: Industrial Technology Research Institute
Inventor: Yuan-Ling Tsai , Ying-Jung Chiang , Jiun-Jang Yu
IPC: H01B3/30 , B32B15/01 , B32B3/26 , B32B7/04 , B32B3/30 , B32B15/04 , B32B15/092 , B32B15/16 , B32B15/20 , H01B1/22 , H01B1/20
CPC classification number: H01B3/30 , B32B3/26 , B32B3/263 , B32B3/30 , B32B7/04 , B32B15/01 , B32B15/04 , B32B15/043 , B32B15/092 , B32B15/16 , B32B15/20 , H01B1/20 , H01B1/22 , Y10T428/12389 , Y10T428/12396 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12479 , Y10T428/12486 , Y10T428/12493 , Y10T428/12535 , Y10T428/12569 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/12993
Abstract: A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.
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