MOULDING COMPOSITIONS BASED ON VINYLAROMATIC COPOLYMERS FOR 3D PRINTING
    1.
    发明申请
    MOULDING COMPOSITIONS BASED ON VINYLAROMATIC COPOLYMERS FOR 3D PRINTING 审中-公开
    基于用于3D印刷的乙烯基芳族聚合物的成型组合物

    公开(公告)号:US20160312022A1

    公开(公告)日:2016-10-27

    申请号:US15104797

    申请日:2014-12-18

    Abstract: Thermoplastic moulding composition for 3D printing containing a polymer mixture A made of components a and b: a being from 30 to 95% by weight of at least one vinylaromatic copolymer a with average molar mass Mw from 150 000 to 360 000 g/mol, b being from 5 to 70% by weight of at least one impact modifier b, where the viscosity of the moulding composition (measured in accordance with ISO 11443) at shear rates of from 1 to 10 l/sec and at a temperature of 250° C. is not higher than 1×105 Pa*s and the Melt Volume Rate (MVR, measured in accordance with ISO 1133 for 220° C. and 10 kg load) is more than 6 ml/10 min.

    Abstract translation: 含有由a和b组分组成的聚合物混合物A的3D印刷用热塑性成型组合物:a为30至95重量%的至少一种乙烯基芳族共聚物a,平均摩尔质量Mw为150,000至360,000g / mol,b 为至少一种抗冲改性剂b的5至70重量%,其中在1至10升/秒的剪切速率和250℃的温度下模塑组合物的粘度(根据ISO 11443测量) 不高于1×105Pa * s,熔体体积率(MVR,根据ISO 1133测定,220℃和10kg负荷)大于6ml / 10分钟。

    USE OF MOLDING MATERIALS BASED ON VINYL AROMATIC/DIENE BLOCK COPOLYMERS FOR 3-D-PRINTING
    4.
    发明申请
    USE OF MOLDING MATERIALS BASED ON VINYL AROMATIC/DIENE BLOCK COPOLYMERS FOR 3-D-PRINTING 审中-公开
    基于乙烯芳族/二烯嵌段共聚物的成型材料的使用3-D印刷

    公开(公告)号:US20160319122A1

    公开(公告)日:2016-11-03

    申请号:US15105853

    申请日:2014-12-18

    Abstract: The invention relates to the use of molding materials for 3-D printing, containing components A, B1, B2, and C, wherein: A:5 to 100 wt % of at least one vinyl aromatic/diene block copolymer A, containing: a) 30 to 95 wt % of at least one vinyl aromatic and b) 5 to 70 wt % of at least one diene, B1:0 to 95 wt % of at least one polymer B1 selected from the group comprising standard polystyrene, high-impact polystyrene (HIPS), styrene/acrylonitrile copolymers, α-methylstyrene/acrylonitrile copolymers, styrene/maleic anhydride copolymers, styrene/phenylmaleimide copolymers, styrene/methylmethacrylate copolymers, styrene/acrylonitrile/maleic anhydride copolymers, styrene/acrylonitrile/phenylmaleimide copolymers, methylstyrene/acrylonitrile/methylmethacrylate copolymers, α-methylstyrene/acrylonitrile/t-butyl methacrylate copolymers, and styrene/acrylonitrile/t-butyl methacrylate copolymers, B2:0 to 60 wt % of one or more further polymers B2 selected from: polycarbonates, polyamides, poly(meth)acrylates, polyesters, semicrystalline polyolefins, and polyvinyl chloride, C:0 to 50 wt % of common additives and auxiliary agents, wherein the viscosity (measured as per ISO 11443) of the molding material at shear rates of 1 to 10 1/s and at temperatures of 250° C. is not greater than 1×105 Pa*s and the melt volume rate (MVR, measured as per ISO 1133 at 220° C. and 10 kg load) is more than 6 ml/10 min.

    Abstract translation: 本发明涉及成型材料在含有A,B1,B2和C组分的3-D印刷中的用途,其中:A:5至100重量%的至少一种乙烯基芳族二烯嵌段共聚物A,其含有: )30至95重量%的至少一种乙烯基芳族化合物和b)5-70重量%的至少一种二烯,B1:0至95重量%的至少一种选自包含标准聚苯乙烯,高冲击 聚苯乙烯(HIPS),苯乙烯/丙烯腈共聚物,α-甲基苯乙烯/丙烯腈共聚物,苯乙烯/马来酸酐共聚物,苯乙烯/苯基马来酰亚胺共聚物,苯乙烯/甲基丙烯酸甲酯共​​聚物,苯乙烯/丙烯腈/马来酸酐共聚物,苯乙烯/丙烯腈/苯基马来酰亚胺共聚物,甲基苯乙烯/ 丙烯腈/甲基丙烯酸甲酯共​​聚物,α-甲基苯乙烯/丙烯腈/甲基丙烯酸叔丁酯共聚物,和苯乙烯/丙烯腈/甲基丙烯酸叔丁酯共聚物,B2:0-60重量%的一种或多种另外的聚合物B2,其选自聚碳酸酯,聚酰胺,聚 (m 乙基)丙烯酸酯,聚酯,半结晶聚烯烃和聚氯乙烯,C:0至50重量%的常用添加剂和助剂,其中模塑材料的剪切速率为1至10升/秒的粘度(根据ISO 11443测量) 并且在250℃的温度下不大于1×105Pa·s,熔体体积率(MVR,根据ISO 1133在220℃和10kg负荷下测量)大于6ml / 10分钟 。

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