公开(公告)号：US11908760B2

公开(公告)日：2024-02-20

申请号：US17575015

申请日：2022-01-13

Applicant: Infineon Technologies AG

Inventor： Andreas Grassmann

IPC: H01L23/31 ,  H01L23/29 ,  H01L23/14 ,  H01L21/56

CPC classification number: H01L23/31 ,  H01L21/56 ,  H01L23/14 ,  H01L23/29

Abstract: A package is disclosed. In one example, the package comprises a carrier comprising a thermally conductive and electrically insulating layer, a laminate comprising a plurality of connected laminate layers, an electronic component mounted between the carrier and the laminate. An encapsulant is at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component.

公开(公告)号：US20230035550A1

公开(公告)日：2023-02-02

申请号：US17873909

申请日：2022-07-26

Applicant: Infineon Technologies AG

Inventor： Andreas Grassmann ,  Edward Fuergut ,  Uwe Schindler

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/367 ,  H01L23/31

Abstract: A semiconductor device module includes an application board, a plurality of semiconductor device packages disposed on the application board, each one of the semiconductor device packages including a semiconductor die, a leadframe including a plurality of leads, the leads including a spring support and a heat dissipation element, and an encapsulant embedding the semiconductor die and first portions of the leads, an external heatsink, and one or more thermally conductive interface layers disposed between the semiconductor device package and the heatsink.

公开(公告)号：US11171066B2

公开(公告)日：2021-11-09

申请号：US16690963

申请日：2019-11-21

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Andreas Grassmann

IPC: H01L23/055 ,  H01L21/48 ,  H01L21/52 ,  H01L23/08

Abstract: A method for manufacturing a semiconductor panel is disclosed. In one example, the method includes providing a first preformed polymer form. The method further includes arranging multiple semiconductor chips over the first preformed polymer form. The method further includes attaching a second preformed polymer form to the first preformed polymer form, wherein the semiconductor chips are arranged between the attached preformed polymer forms, and wherein the attached preformed polymer forms form the semiconductor panel encapsulating the semiconductor chips.

公开(公告)号：US20200183056A1

公开(公告)日：2020-06-11

申请号：US16704873

申请日：2019-12-05

Applicant: Infineon Technologies AG

Inventor： Ivan Nikitin ,  Dirk Ahlers ,  Andreas Grassmann ,  Andre Uhlemann

IPC: G02B1/118 ,  H05K3/40

Abstract: A power semiconductor module includes a first substrate, wherein the first substrate includes aluminum, a first aluminum oxide layer arranged on the first substrate, a conductive layer arranged on the first aluminum oxide layer, a first semiconductor chip, wherein the first semiconductor chip is arranged on the conductive layer and is electrically connected thereto, and an electrical insulation material enclosing the first semiconductor chip, wherein the first aluminum oxide layer is configured to electrically insulate the first semiconductor chip from the first substrate.

公开(公告)号：US10461017B2

公开(公告)日：2019-10-29

申请号：US15665574

申请日：2017-08-01

Applicant: Infineon Technologies AG

Inventor： Andreas Grassmann ,  Wolfram Hable ,  Juergen Hoegerl ,  Ivan Nikitin ,  Achim Strass

IPC: H01L23/473 ,  B60R16/02 ,  H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L23/46 ,  H01L21/48 ,  H01L23/373 ,  H01L23/42 ,  H01L23/00 ,  H01L25/07

Abstract: A power module which comprises a semiconductor chip, at least one cooling plate with at least one cooling channel thermally coupled to the semiconductor chip and being configured so that a coolant is guidable through the at least one cooling channel, and an encapsulant encapsulating at least part of the semiconductor chip and part of the at least one cooling channel, wherein at least part of a main surface of the cooling plate forms part of an external surface of the power module.

公开(公告)号：US20170140946A1

公开(公告)日：2017-05-18

申请号：US15420321

申请日：2017-01-31

Applicant: Infineon Technologies AG

Inventor： Inpil Yoo ,  Andreas Grassmann

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/31 ,  H01L21/54 ,  H01L23/473 ,  H01L23/08 ,  H01L21/56

CPC classification number: H01L21/4882 ,  H01L21/4817 ,  H01L21/4875 ,  H01L21/54 ,  H01L21/565 ,  H01L23/08 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/3672 ,  H01L23/3737 ,  H01L23/44 ,  H01L23/473 ,  H01L23/49811

Abstract: A cooling apparatus is manufactured by: receiving a discrete module by a first singular part, the discrete module including a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, and a first cooling plate at least partly uncovered by the mold compound; attaching a second singular part to a periphery of the first part to form a housing, the housing surrounding a periphery of the discrete module, the second part having a cutout which exposes the first cooling plate and a sealing structure facing a side of the discrete module with the first cooling plate; and filling the sealing structure with a sealing material which forms a water-tight seal around the periphery of the discrete module at the side of the discrete module with the first cooling plate.

公开(公告)号：US09613885B2

公开(公告)日：2017-04-04

申请号：US14636256

申请日：2015-03-03

Applicant: Infineon Technologies AG

Inventor： Inpil Yoo ,  Andreas Grassmann

IPC: H01L23/473 ,  H01L21/54 ,  H01L23/498 ,  H01L21/48 ,  H01L23/18

CPC classification number: H01L21/4882 ,  H01L21/4817 ,  H01L21/4875 ,  H01L21/54 ,  H01L21/565 ,  H01L23/08 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/3672 ,  H01L23/3737 ,  H01L23/44 ,  H01L23/473 ,  H01L23/49811

Abstract: A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.

公开(公告)号：US09585241B2

公开(公告)日：2017-02-28

申请号：US14034669

申请日：2013-09-24

Applicant: Infineon Technologies AG

Inventor： Wolfram Hable ,  Andreas Grassmann ,  Frank Winter ,  Ottmar Geitner ,  Alexander Schwarz ,  Alexander Herbrandt

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/32 ,  H01L23/31 ,  H01L23/373 ,  H01L21/48 ,  H05K1/03 ,  H01L23/467 ,  H01L23/473 ,  H01L23/498

CPC classification number: H05K1/021 ,  H01L21/4882 ,  H01L23/051 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0306 ,  H05K3/32 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.

Abstract translation: 在各种实施例中，提供基板。 衬底可以包括：陶瓷载体，其具有与第一侧相对的第一侧和第二侧; 设置在陶瓷载体的第一侧上的第一金属层; 设置在陶瓷载体的第二侧上的第二金属层; 以及形成在第二金属层中或上方的冷却结构。

公开(公告)号：US20160260654A1

公开(公告)日：2016-09-08

申请号：US14636256

申请日：2015-03-03

Applicant: Infineon Technologies AG

Inventor： Inpil Yoo ,  Andreas Grassmann

IPC: H01L23/473 ,  H01L21/54 ,  H01L23/18 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L21/4882 ,  H01L21/4817 ,  H01L21/4875 ,  H01L21/54 ,  H01L21/565 ,  H01L23/08 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/3672 ,  H01L23/3737 ,  H01L23/44 ,  H01L23/473 ,  H01L23/49811

Abstract: A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.

Abstract translation: 冷却装置包括多个分立模块和塑料壳体。 每个模块包括由模具化合物封装的半导体管芯，与半导体管芯电连接并从模具化合物突出的多个引线以及由模具化合物至少部分未覆盖的第一冷却板。 塑料壳体围绕每个模块的周边以形成多模模块。 塑料壳体包括容纳模块的第一单体塑料部件和附接到第一塑料部件的周边的第二单个塑料部件。 第二塑料部分具有露出第一冷却板的切口和包含密封材料的密封结构，该密封结构在具有第一冷却板的模块的一侧周围形成围绕每个模块的周边的防水密封。

公开(公告)号：US20140327127A1

公开(公告)日：2014-11-06

申请号：US13886284

申请日：2013-05-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Wolfram HABLE ,  Andreas Grassmann ,  Frank Winter ,  Ottmar Geitner ,  Alexander Schwarz ,  Alexander Herbrandt ,  Lothar Koenig ,  Andre Uhlemann

IPC: H01L23/34 ,  H01L21/50

CPC classification number: H01L23/34 ,  H01L21/50 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/467 ,  H01L23/473 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099 ,  H01L2224/37599

Abstract: According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.

Abstract translation: 根据示例性实施例，提供了一种功率模块，其包括半导体芯片，包括导电片的接合衬底和直接附接到导电片并且热耦合到半导体芯片的电绝缘片，以及 直接连接到导电片的冷却结构的阵列，并被配置为当与冷却流体相互作用时从半导体芯片移除热量。