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公开(公告)号：US09589922B2
公开(公告)日：2017-03-07
申请号：US14214962
申请日：2014-03-16
Applicant: Infineon Technologies AG
Inventor： Christian Neugirg , Andreas Grassmann , Wolfram Hable , Ottmar Geitner , Frank Winter , Alexander Schwarz , Inpil Yoo
IPC: H01L23/373 , H01L23/00
CPC classification number: H01L23/3733 , H01L21/4853 , H01L21/565 , H01L23/3114 , H01L23/373 , H01L23/49833 , H01L24/36 , H01L24/40 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/181 , Y10T29/4913 , Y10T29/49144 , H01L2924/00012 , H01L2224/37099
Abstract: An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.
Abstract translation: 提供一种电子模块，其包括第一载体; 电子芯片，其包括至少一个电子部件并且布置在所述第一载体上; 间隔元件，包括布置在所述电子芯片上并与所述至少一个电子部件导热连接的表面; 布置在间隔元件上的第二载体; 以及至少部分地包围所述电子芯片和所述间隔元件的模具化合物; 其中所述间隔元件包括具有与至少一个其它CTE匹配的CTE值的材料。
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公开(公告)号：US09532459B2
公开(公告)日：2016-12-27
申请号：US13964263
申请日：2013-08-12
Applicant: Infineon Technologies AG
Inventor： Frank Winter , Ottmar Geitner , Ivan Nikitin , Juergen Hoegerl
CPC classification number: H01L23/4334 , H01L21/4871 , H01L21/565 , H01L23/3121 , H01L24/32 , H01L24/83 , H01L2224/32225 , H01L2224/32245 , H01L2224/838 , H01L2224/83801 , H01L2224/8384 , H05K1/185 , H05K3/4608 , Y10T29/49002
Abstract: According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mold compound and comprises surface structures.
Abstract translation: 根据示例性方面，提供一种电子模块，其中所述电子模块包括电子芯片，该电子芯片包括至少一个电子元件，间隔元件，包括布置在所述电子芯片上并与所述至少一个电子元件导热连接的主表面 以及至少部分地包围电子芯片和间隔元件的模具化合物，其中间隔元件包括与模具化合物接触并包括表面结构的侧表面。
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3.发明申请公开(公告)号：US20140353818A1
公开(公告)日：2014-12-04
申请号：US13909133
申请日：2013-06-04
Applicant: Infineon Technologies AG
Inventor： Ottmar GEITNER , Wolfram HABLE , Andreas Grassmann , Frank Winter , Christian Neugirg , Ivan Nikitin
CPC classification number: H01L24/89 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/97 , H01L25/50 , H01L2224/26135 , H01L2224/29005 , H01L2224/291 , H01L2224/29124 , H01L2224/29147 , H01L2224/30181 , H01L2224/83048 , H01L2224/83139 , H01L2224/83191 , H01L2224/83201 , H01L2224/97 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2224/83 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
Abstract: A method of manufacturing a power module comprising two substrates is provided, wherein the method comprises disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer
Abstract translation: 提供一种制造包括两个基板的功率模块的方法，其中所述方法包括在第一基板之上设置第一厚度的补偿层; 在补偿层之上设置第二衬底; 以及在所述第二衬底设置在所述补偿层上之后，将所述补偿层的厚度从所述第一厚度减小到第二厚度
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公开(公告)号：US09847274B2
公开(公告)日：2017-12-19
申请号：US15375855
申请日：2016-12-12
Applicant: Infineon Technologies AG
Inventor： Frank Winter , Ottmar Geitner , Ivan Nikitin , Jürgen Högerl
CPC classification number: H01L23/4334 , H01L21/4871 , H01L21/565 , H01L23/3121 , H01L24/32 , H01L24/83 , H01L2224/32225 , H01L2224/32245 , H01L2224/838 , H01L2224/83801 , H01L2224/8384 , H05K1/185 , H05K3/4608 , Y10T29/49002
Abstract: According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.
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5.发明授权Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip 有权电源模块，具有用于冷却连接的半导体芯片的接合基板上的冷却结构公开(公告)号：US09275926B2
公开(公告)日：2016-03-01
申请号：US13886284
申请日：2013-05-03
Applicant: Infineon Technologies AG
Inventor： Wolfram Hable , Andreas Grassmann , Frank Winter , Ottmar Geitner , Alexander Schwarz , Alexander Herbrandt , Lothar Koenig , Andre Uhlemann
IPC: H01L23/34 , H01L21/50 , H01L23/00 , H01L23/373 , H01L23/433 , H01L23/467 , H01L23/473 , H01L25/07
CPC classification number: H01L23/34 , H01L21/50 , H01L23/3735 , H01L23/4334 , H01L23/467 , H01L23/473 , H01L24/33 , H01L24/36 , H01L24/40 , H01L25/072 , H01L2224/40137 , H01L2224/84801 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099 , H01L2224/37599
Abstract: According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.
Abstract translation: 根据示例性实施例，提供了一种功率模块，其包括半导体芯片，包括导电片的接合衬底和直接附接到导电片并且热耦合到半导体芯片的电绝缘片，以及 直接连接到导电片的冷却结构的阵列，并被配置为当与冷却流体相互作用时从半导体芯片移除热量。
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Patent Agency Ranking
公开(公告)号：US09585241B2
公开(公告)日：2017-02-28
申请号：US14034669
申请日：2013-09-24
Applicant: Infineon Technologies AG
Inventor： Wolfram Hable , Andreas Grassmann , Frank Winter , Ottmar Geitner , Alexander Schwarz , Alexander Herbrandt
IPC: H05K7/20 , H05K1/02 , H05K3/32 , H01L23/31 , H01L23/373 , H01L21/48 , H05K1/03 , H01L23/467 , H01L23/473 , H01L23/498
CPC classification number: H05K1/021 , H01L21/4882 , H01L23/051 , H01L23/31 , H01L23/3107 , H01L23/3735 , H01L23/467 , H01L23/473 , H01L23/49833 , H01L2924/0002 , H05K1/0203 , H05K1/0306 , H05K3/32 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.
Abstract translation: 在各种实施例中，提供基板。 衬底可以包括：陶瓷载体，其具有与第一侧相对的第一侧和第二侧; 设置在陶瓷载体的第一侧上的第一金属层; 设置在陶瓷载体的第二侧上的第二金属层; 以及形成在第二金属层中或上方的冷却结构。
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7.发明申请Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip 有权电源模块，具有用于冷却连接的半导体芯片的接合基板上的冷却结构公开(公告)号：US20140327127A1
公开(公告)日：2014-11-06
申请号：US13886284
申请日：2013-05-03
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Wolfram HABLE , Andreas Grassmann , Frank Winter , Ottmar Geitner , Alexander Schwarz , Alexander Herbrandt , Lothar Koenig , Andre Uhlemann
CPC classification number: H01L23/34 , H01L21/50 , H01L23/3735 , H01L23/4334 , H01L23/467 , H01L23/473 , H01L24/33 , H01L24/36 , H01L24/40 , H01L25/072 , H01L2224/40137 , H01L2224/84801 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099 , H01L2224/37599
Abstract: According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.
Abstract translation: 根据示例性实施例，提供了一种功率模块，其包括半导体芯片，包括导电片的接合衬底和直接附接到导电片并且热耦合到半导体芯片的电绝缘片，以及 直接连接到导电片的冷却结构的阵列，并被配置为当与冷却流体相互作用时从半导体芯片移除热量。
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公开(公告)号：US11574889B2
公开(公告)日：2023-02-07
申请号：US13909133
申请日：2013-06-04
Applicant: Infineon Technologies AG
Inventor： Ottmar Geitner , Wolfram Hable , Andreas Grassmann , Frank Winter , Christian Neugirg , Ivan Nikitin
IPC: H01L23/48 , H01L23/52 , H01L23/00 , H01L23/495 , H01L23/373 , H01L23/31 , H01L25/00 , H01L23/433
Abstract: A method of manufacturing a power module comprising two substrates is provided, wherein the method comprises disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer.
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公开(公告)号：US20170154835A1
公开(公告)日：2017-06-01
申请号：US15432680
申请日：2017-02-14
Applicant: Infineon Technologies AG
Inventor： Christian Neugirg , Andreas Grassmann , Wolfram Hable , Ottmar Geitner , Frank Winter , Alexander Schwarz , Inpil Yoo
IPC: H01L23/373 , H01L21/56 , H01L21/48 , H01L23/498 , H01L23/31
CPC classification number: H01L23/3733 , H01L21/4853 , H01L21/565 , H01L23/3114 , H01L23/373 , H01L23/49833 , H01L24/36 , H01L24/40 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/181 , Y10T29/4913 , Y10T29/49144 , H01L2924/00012 , H01L2224/37099
Abstract: An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.
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公开(公告)号：US20150085446A1
公开(公告)日：2015-03-26
申请号：US14034669
申请日：2013-09-24
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Wolfram Hable , Andreas Grassmann , Frank Winter , Ottmar Geitner , Alexander Schwarz , Alexander Herbrandt
CPC classification number: H05K1/021 , H01L21/4882 , H01L23/051 , H01L23/31 , H01L23/3107 , H01L23/3735 , H01L23/467 , H01L23/473 , H01L23/49833 , H01L2924/0002 , H05K1/0203 , H05K1/0306 , H05K3/32 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.
Abstract translation: 在各种实施例中，提供基板。 衬底可以包括：陶瓷载体，其具有与第一侧相对的第一侧和第二侧; 设置在陶瓷载体的第一侧上的第一金属层; 设置在陶瓷载体的第二侧上的第二金属层; 以及形成在第二金属层中或上方的冷却结构。
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