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    Cooling system for molded modules and corresponding manufacturing methods
    5.
    发明授权
    Cooling system for molded modules and corresponding manufacturing methods 有权
    模制模块冷却系统及相应的制造方法

    公开(公告)号：US09449895B2

    公开(公告)日：2016-09-20

    申请号：US13886375

    申请日：2013-05-03

    Applicant: Infineon Technologies AG

    Inventor： Inpil Yoo ,  Carlos Castro Serrato

    IPC: H01L23/46 ,  H01L23/28 ,  H01L23/29 ,  H01L23/44 ,  H01L21/48 ,  H01L23/473 ,  H01L23/31 ,  H01L21/56

    CPC classification number: H01L23/44 ,  H01L21/4803 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/28 ,  H01L23/29 ,  H01L23/3107 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A cooling system for molded modules includes a plurality of individual modules each including a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and at least partly uncovered by the mold compound, and a cooling plate at least partly uncovered by the mold compound. A molded body surrounds a periphery of each individual module to form a multi-die module. The leads of each individual module and the cooling plates are at least partly uncovered by the molded body. A lid with a port is attached to a periphery of the molded body at a first side of the multi-die module. The lid seals the multi-die module at the first side to form a cavity between the lid and the molded body for permitting fluid exiting or entering the port to contact the cooling plates of each individual module.

    Abstract translation: 用于模制模块的冷却系统包括多个单独的模块，每个模块包括由模具化合物封装的半导体管芯，多个引线，电连接到半导体管芯并且至少部分地不被模具化合物覆盖;以及冷却板，至少部分地 被模具化合物覆盖。 模制体围绕每个单独模块的周边以形成多模模块。 每个单独模块和冷却板的引线至少部分地被成型体覆盖。 具有端口的盖子在多模模块的第一侧附接到成型体的周边。 盖子在第一侧密封多模模块，以在盖和模制体之间形成空腔，用于允许流体离开或进入端口以接触每个单独模块的冷却板。

    PLASTIC COOLER FOR SEMICONDUCTOR MODULES
    6.
    发明申请
    PLASTIC COOLER FOR SEMICONDUCTOR MODULES 有权
    塑料冷却器用于半导体模块

    公开(公告)号：US20160260654A1

    公开(公告)日：2016-09-08

    申请号：US14636256

    申请日：2015-03-03

    Applicant: Infineon Technologies AG

    Inventor： Inpil Yoo ,  Andreas Grassmann

    IPC: H01L23/473 ,  H01L21/54 ,  H01L23/18 ,  H01L23/498 ,  H01L21/48

    CPC classification number: H01L21/4882 ,  H01L21/4817 ,  H01L21/4875 ,  H01L21/54 ,  H01L21/565 ,  H01L23/08 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/3672 ,  H01L23/3737 ,  H01L23/44 ,  H01L23/473 ,  H01L23/49811

    Abstract: A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.

    Abstract translation: 冷却装置包括多个分立模块和塑料壳体。 每个模块包括由模具化合物封装的半导体管芯，与半导体管芯电连接并从模具化合物突出的多个引线以及由模具化合物至少部分未覆盖的第一冷却板。 塑料壳体围绕每个模块的周边以形成多模模块。 塑料壳体包括容纳模块的第一单体塑料部件和附接到第一塑料部件的周边的第二单个塑料部件。 第二塑料部分具有露出第一冷却板的切口和包含密封材料的密封结构，该密封结构在具有第一冷却板的模块的一侧周围形成围绕每个模块的周边的防水密封。

    Temperature sensing and fault detection for paralleled double-side cooled power modules
    7.
    发明授权
    Temperature sensing and fault detection for paralleled double-side cooled power modules 有权

    公开(公告)号：US10916931B2

    公开(公告)日：2021-02-09

    申请号：US15871661

    申请日：2018-01-15

    Applicant: Infineon Technologies AG

    Inventor： Tomas Manuel Reiter ,  Tom Roewe ,  Inpil Yoo

    IPC: H02H5/04 ,  H01L23/473 ,  H02M1/32 ,  G01N25/72 ,  G05B15/02 ,  H01L25/10 ,  H05K7/20 ,  H01L23/373

    Abstract: In accordance with an embodiment, a method includes: monitoring a temperature difference between two double-side cooled (DSC) power modules of a plurality of DSC power modules arranged in stacks of DSC power modules; comparing the temperature difference with a first temperature threshold; detecting a cooling pipe system blockage when the temperature difference is above the first temperature threshold; and after detecting the cooling pipe system blockage, disabling gate driver circuits coupled to the plurality of DSC power modules or operating the DSC power modules in a low-power mode. Each stack includes a plurality of DSC power modules. Each DSC power module has a top surface and a bottom surface, which are each thermally coupled with one or more cooling channels of a cooling pipe system. The two DSC power modules are thermally coupled with a same cooling channel of the one or more cooling channels.

    Plastic cooler for semiconductor modules
    9.
    发明授权
    Plastic cooler for semiconductor modules 有权

    公开(公告)号：US09564384B2

    公开(公告)日：2017-02-07

    申请号：US14636256

    申请日：2015-03-03

    Applicant: Infineon Technologies AG

    Inventor： Inpil Yoo ,  Andreas Grassmann

    IPC: H01L23/473 ,  H01L21/54 ,  H01L23/498 ,  H01L21/48 ,  H01L23/18

    Abstract: A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.

    Cooling System for Molded Modules and Corresponding Manufacturing Methods
    10.
    发明申请
    Cooling System for Molded Modules and Corresponding Manufacturing Methods 有权
    模制冷却系统及相应的制造方法

    公开(公告)号：US20140327128A1

    公开(公告)日：2014-11-06

    申请号：US13886375

    申请日：2013-05-03

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： Inpil Yoo ,  Carlos Castro Serrato

    IPC: H01L23/44 ,  H01L21/48

    CPC classification number: H01L23/44 ,  H01L21/4803 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/28 ,  H01L23/29 ,  H01L23/3107 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A cooling system for molded modules includes a plurality of individual modules each including a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and at least partly uncovered by the mold compound, and a cooling plate at least partly uncovered by the mold compound. A molded body surrounds a periphery of each individual module to form a multi-die module. The leads of each individual module and the cooling plates are at least partly uncovered by the molded body. A lid with a port is attached to a periphery of the molded body at a first side of the multi-die module. The lid seals the multi-die module at the first side to form a cavity between the lid and the molded body for permitting fluid exiting or entering the port to contact the cooling plates of each individual module.

    Abstract translation: 用于模制模块的冷却系统包括多个单独的模块，每个模块包括由模具化合物封装的半导体管芯，多个引线，电连接到半导体管芯并且至少部分地不被模具化合物覆盖;以及冷却板，至少部分地 被模具化合物覆盖。 模制体围绕每个单独模块的周边以形成多模模块。 每个单独模块和冷却板的引线至少部分地被成型体覆盖。 具有端口的盖子在多模模块的第一侧附接到成型体的周边。 盖子在第一侧密封多模模块，以在盖和模制体之间形成空腔，用于允许流体离开或进入端口以接触每个单独模块的冷却板。

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