公开(公告)号：US12196589B2

公开(公告)日：2025-01-14

申请号：US18065394

申请日：2022-12-13

Applicant: Infineon Technologies AG

Inventor： Martin Seidl ,  Christian Bretthauer ,  Wolfgang Klein ,  Ulrich Krumbein ,  David Tumpold

IPC: G01F1/86 ,  G01F1/688

Abstract: A thermoresistive micro sensor device includes a semiconductor chip; a through hole, which runs through the semiconductor chip from an upper side to a lower side; electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip; an electrically insulating arrangement for electrically insulating the electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; and a contact arrangement including contacts, wherein each of the contacts is electrically connected to one of the first end sections or one of the second end sections, so that electrical energy is fed to at least one of the electrically conductive structures to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures is measured at the contact arrangement.

公开(公告)号：US20240158224A1

公开(公告)日：2024-05-16

申请号：US18540253

申请日：2023-12-14

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geißler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B7/02 ,  B81C1/00103 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0384 ,  B81C2201/013 ,  H04R2201/003

Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

公开(公告)号：US20230224657A1

公开(公告)日：2023-07-13

申请号：US18184197

申请日：2023-03-15

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Wolfgang Friza ,  Wolfgang Klein

IPC: H04R31/00 ,  H04R19/00 ,  H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R7/14

CPC classification number: H04R31/003 ,  H04R19/005 ,  H04R19/04 ,  B81B3/0072 ,  B81C1/00182 ,  H04R7/14 ,  B81C1/00158 ,  B81B3/001 ,  B81C1/00666 ,  B81B2201/0257

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer are removed.

公开(公告)号：US11275057B2

公开(公告)日：2022-03-15

申请号：US16374192

申请日：2019-04-03

Applicant: Infineon Technologies AG

Inventor： Johannes Manz ,  Wolfgang Klein ,  David Tumpold

IPC: G01N29/24 ,  G01N1/22

Abstract: A system for measuring gas concentration includes a package having a cavity and a port, a photoacoustic gas sensor device within the package, and a Micro Electro Mechanical System (“MEMS”) valve separate from the photoacoustic gas sensor device placed over the port of the package and to allow ambient gas diffusion into the cavity in a first mode of operation, and to prevent ambient gas diffusion into the cavity and to acoustically isolate the cavity in a second mode of operation.

公开(公告)号：US20210139319A1

公开(公告)日：2021-05-13

申请号：US17151392

申请日：2021-01-18

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  H04R31/00 ,  B81B3/00 ,  H04R1/08 ,  B81B7/02 ,  H04R7/08 ,  H04R7/02

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US20210044905A1

公开(公告)日：2021-02-11

申请号：US16537308

申请日：2019-08-09

Applicant: Infineon Technologies AG

Inventor： Arnaud Walther ,  Stefan Barzen ,  Wolfgang Klein ,  Johann Strasser

IPC: H04R19/04 ,  B81B3/00

Abstract: A micro electrical mechanical systems (MEMS) device includes a flexible membrane disposed over a substrate, and a first backplate disposed over the flexible membrane. The first backplate includes a first plurality of bumps facing the flexible membrane. The MEMS device further includes a plurality of features disposed at the flexible membrane, where each of the plurality of features being associated with a corresponding one of the first plurality of bumps.

公开(公告)号：US20200319144A1

公开(公告)日：2020-10-08

申请号：US16374192

申请日：2019-04-03

Applicant: Infineon Technologies AG

Inventor： Johannes Manz ,  Wolfgang Klein ,  David Tumpold

IPC: G01N29/24 ,  G01N1/22

Abstract: A system for measuring gas concentration includes a package having a cavity and a port, a photoacoustic gas sensor device within the package, and a Micro Electro Mechanical System (“MEMS”) valve separate from the photoacoustic gas sensor device placed over the port of the package and to allow ambient gas diffusion into the cavity in a first mode of operation, and to prevent ambient gas diffusion into the cavity and to acoustically isolate the cavity in a second mode of operation.

公开(公告)号：US09611135B1

公开(公告)日：2017-04-04

申请号：US14928702

申请日：2015-10-30

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein

IPC: H01L29/84 ,  H04R19/04 ,  B81B3/00 ,  H02N1/00 ,  B81C1/00 ,  H04R19/00

CPC classification number: B81B3/0021 ,  B81B3/0059 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81B2203/0307 ,  B81C1/00158 ,  B81C2201/0197 ,  H01L29/84 ,  H02N1/008 ,  H02N2/02 ,  H04R1/04 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/003 ,  H04R2207/021 ,  H04R2231/003 ,  H04R2410/03

Abstract: According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure including a second plurality of electrostatic comb fingers interdigitated with a first subset of the first plurality of electrostatic comb fingers, and a second anchor structure including a third plurality of electrostatic comb fingers interdigitated with a second subset of the first plurality of electrostatic comb fingers. The second plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a first direction and the third plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a second direction, where the first direction is different from the second direction.

公开(公告)号：US09540226B2

公开(公告)日：2017-01-10

申请号：US14717556

申请日：2015-05-20

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Martin Wurzer ,  Stefan Barzen ,  Alfons Dehe

IPC: H01L29/84 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81B3/007 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/0353 ,  B81C1/00658 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003

Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode.

Abstract translation: 根据实施例，微机电系统（MEMS）换能器包括第一电极，固定到第二电极的周边处的锚固件的第二电极以及与第二电极的周边处的锚固件分离的机械支撑件，并机械连接 到第一电极和第二电极。 机械支撑件固定到第二电极的一部分，使得在操作期间，第二电极的最大偏转发生在机械结构和第二电极的周边之间。

公开(公告)号：US20150145079A1

公开(公告)日：2015-05-28

申请号：US14611953

申请日：2015-02-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Wolfgang Friza ,  Wolfgang Klein

IPC: H04R31/00 ,  H04R19/00 ,  H04R7/14 ,  H04R19/04

CPC classification number: H04R31/003 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/0257 ,  H04R7/14 ,  H04R19/005 ,  H04R19/04

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer is removed.

Abstract translation: 在一个实施例中，制造半导体器件的方法包括氧化衬底以形成在衬底的顶表面上方延伸的局部氧化物区域。 在局部氧化物区域和衬底的顶表面上形成膜层。 去除膜层下面的一部分基底。 去除膜层下面的局部氧化物区域。