公开(公告)号：US12130665B2

公开(公告)日：2024-10-29

申请号：US17230724

申请日：2021-04-14

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Ivan Wang ,  Tim Liu ,  Jason Y. Jiang

IPC: H02J50/10 ,  G06F1/16 ,  G06F1/26 ,  H02J7/00 ,  H02J50/80

CPC classification number: G06F1/1632 ,  G06F1/1616 ,  G06F1/1681 ,  G06F1/266 ,  H02J7/0042 ,  H02J7/0044 ,  H02J50/10 ,  H02J50/80

Abstract: An example portable computer disclosed herein includes a first housing, a keyboard carried by the first housing, a second housing pivotally coupled to the first housing, a display carried by the second housing, a wireless charger, and a pad to carry the wireless charger. The pad is pivotally coupled to the first housing. The pad is moveable relative to the first housing between a first orientation to position the wireless charger above the first housing and a second orientation to position the wireless charger adjacent the first housing. The pad to support a body part of a user adjacent the keyboard when the pad is in the first orientation. The pad is to support an external electronic device proximate the wireless charger when the pad is in the second orientation.

公开(公告)号：US11153990B2

公开(公告)日：2021-10-19

申请号：US16231169

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Tim Liu ,  Gerry Juan ,  Jason Y. Jiang

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/08 ,  H05K1/02

Abstract: In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.

公开(公告)号：US20180314068A1

公开(公告)日：2018-11-01

申请号：US15582000

申请日：2017-04-28

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Simon S. Yuan ,  Lance Lin ,  Jason Y. Jiang

IPC: G02B27/01

Abstract: A wearable computing device having a main computing element having a center portion and at least two arms and a display element operably connected to arms to enclose a region within which a body part may be inserted. Each arm may include a docking element connectable to the display element and may be configured to slide within the arm to move the display element relative to the center portion of the main computing element. A pivot arm may pivotably connect the display element to the slider arm to permit pivoting of the display element relative to the plane of the main computing element.

公开(公告)号：US09768553B2

公开(公告)日：2017-09-19

申请号：US14976170

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Gavin Sung ,  Jeff Ku ,  Lance Lin ,  Tim Liu ,  Jason Y. Jiang

IPC: H01R13/64 ,  H01R13/24

CPC classification number: H01R13/64 ,  G06F1/1613 ,  H01R13/24 ,  H01R13/2442 ,  H01R13/631 ,  H01R2201/06

Abstract: In one example an electronic device comprises at least one electronic component, a chassis comprising a first section, a connector to connect the first section of the chassis to a second section, the connector comprising a housing defining a first shaft, a retention structure disposed in the shaft, and a plurality of electrical contacts positioned within a corresponding plurality of channels in the retention structure. Other examples may be described.

公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US11649993B2

公开(公告)日：2023-05-16

申请号：US16457229

申请日：2019-06-28

Applicant: INTEL CORPORATION

Inventor： Gavin Sung ,  Gerry Juan ,  Harish Jagadish ,  Ivan By Wang ,  Jason Y. Jiang ,  Sammi Wy Liu ,  Tim Liu ,  Jeff Ku

IPC: F25B21/02 ,  F25B9/00 ,  F25B25/00

CPC classification number: F25B21/02 ,  F25B9/006 ,  F25B25/00

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.

公开(公告)号：US20210210051A1

公开(公告)日：2021-07-08

申请号：US17212834

申请日：2021-03-25

Applicant: Intel Corporation

Inventor： Andy B. Wang ,  Gavin Sung ,  Nee Shen Ho ,  Tim Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Tong Liang Chew

IPC: G09G5/12 ,  G06K7/14

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to configure multiple displays. An example apparatus disclosed herein includes memory, and a processor to execute instructions to detect, via a tag reader on a first display, a tag on a second display, the first display and second display communicatively coupled to a computing device, determine, based on a location of the tag reader relative to the first display, a position of the second display relative to the first display, and update an operating system of the computing device based on the determined position.

公开(公告)号：US20190033932A1

公开(公告)日：2019-01-31

申请号：US15663433

申请日：2017-07-28

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Michael Chih-Huei Wang ,  Vincent Hung ,  Jason Y. Jiang

IPC: G06F1/20 ,  H05K7/20

Abstract: Thermal management system for unmanned aerial vehicles are disclosed. An example housing for an unmanned aerial vehicle includes a central portion defining a cavity. The housing also includes a first arm to support a first propeller. The first arm has a first proximal end coupled to the central portion and a first distal end spaced from the central portion. The first distal end defines an inlet. The first arm defines a first fluid path in communication with the inlet and the central cavity. The housing also includes a second arm to support a second propeller. The second arm has a second proximal end coupled to the central portion and a second distal end spaced from the central portion. The second distal end defines an outlet. The second arm defines a second fluid path in communication with the outlet and the central cavity. The inlet and outlet are in fluid communication via the first path, the central cavity and the second path.

公开(公告)号：US11930620B2

公开(公告)日：2024-03-12

申请号：US16914294

申请日：2020-06-27

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Cora Nien ,  Gavin Sung ,  Tim Liu ,  Lance Lin ,  Wan Yu Liu ,  Gerry Juan ,  Jason Y. Jiang ,  Justin M. Huttula ,  Evan Piotr Kuklinski ,  Juha Tapani Paavola ,  Arnab Sen ,  Hari Shanker Thakur ,  Prakash Kurma Raju

IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  G06F1/203 ,  H01L23/427 ,  H05K7/20136 ,  H05K7/20336

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

公开(公告)号：US20210234403A1

公开(公告)日：2021-07-29

申请号：US17230724

申请日：2021-04-14

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Ivan Wang ,  Tim Liu ,  Jason Y. Jiang

IPC: H02J50/10 ,  G06F1/26 ,  H02J50/80 ,  G06F1/16 ,  H02J7/00

Abstract: In one example an electronic device comprises at least one electronic component, a least one power storage device, and a chassis comprising a body formed from a rigid material and comprising a first pad coupled to the body by a first hinge, wherein the first pad is rotatable about the first hinge between a first position in which the first pad is closed and a second position in which the first pad is open, wherein the first pad comprises a first wireless power transmitting device. Other examples may be described.