公开(公告)号：US20230395460A1

公开(公告)日：2023-12-07

申请号：US18450928

申请日：2023-08-16

Applicant: Intel Corporation

Inventor： David Shia ,  Rick Canham ,  Eric W. Buddrius ,  Jeffory L. Smalley ,  John Beatty ,  Kenan Arik ,  Mohanraj Prabhugoud ,  Kirk Wheeler ,  Shelby Ferguson ,  Jorge Contreras Perez ,  Daniel Neumann ,  Ernesto Borboa Lizarraga

IPC: H01L23/40

CPC classification number: H01L23/4093 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2023/405

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.

公开(公告)号：US09806002B2

公开(公告)日：2017-10-31

申请号：US14757845

申请日：2015-12-23

Applicant: INTEL CORPORATION

Inventor： Arnab Choudhury ,  John Beatty ,  Prakriti Choudhary

IPC: H01L23/10 ,  H01L21/00 ,  H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/10 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/433 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/27848 ,  H01L2224/29019 ,  H01L2224/29021 ,  H01L2224/29022 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29149 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29163 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29172 ,  H01L2224/29176 ,  H01L2224/2918 ,  H01L2224/29181 ,  H01L2224/29184 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32058 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/8321 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/92225 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1304 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/0532 ,  H01L2924/01004 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/01048 ,  H01L2924/01072 ,  H01L2924/00012

Abstract: Methods, systems, and apparatuses that assist with cooling semiconductor packages, such as multi-chip packages (MCPs) are described. A semiconductor package includes a component on a substrate. The component can include one or more semiconductor dies. The package can also include a multi-reference integrated heat spreader (IHS) solution (also referred to as a smart IHS solution), where the smart IHS solution includes a smart IHS lid. The smart IHS lid includes a cavity formed in a central region of the smart lid. The smart IHS lid can be on the component, such that the cavity corresponds to the component. A first thermal interface material layer (TIM-layer 1) can be on the component. An individual IHS lid (IHS slug) can be on the TIM-layer 1. The IHS slug can be inserted into the cavity. Furthermore, an intermediate thermal interface material layer (TIM-1A layer) can be between the IHS slug and the cavity.