公开(公告)号：US20180236609A1

公开(公告)日：2018-08-23

申请号：US15960463

申请日：2018-04-23

Applicant: INTEL CORPORATION

Inventor： Rajen S. SIDHU ,  Martha A. DUDEK ,  James C. MATAYABAS, JR. ,  Michelle S. PHEN-GIVONI ,  Wei TAN

IPC: B23K35/02 ,  H01L23/00 ,  B23K35/362 ,  H05K3/34 ,  H01L23/488 ,  H01L21/48 ,  H01L23/498

CPC classification number: B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01083

Abstract: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.