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公开(公告)号:US20180236609A1
公开(公告)日:2018-08-23
申请号:US15960463
申请日:2018-04-23
申请人: INTEL CORPORATION
IPC分类号: B23K35/02 , H01L23/00 , B23K35/362 , H05K3/34 , H01L23/488 , H01L21/48 , H01L23/498
CPC分类号: B23K35/025 , B23K35/362 , H01L21/4853 , H01L23/488 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0381 , H01L2224/03828 , H01L2224/03829 , H01L2224/03849 , H01L2224/0401 , H01L2224/05794 , H01L2224/058 , H01L2224/05809 , H01L2224/05811 , H01L2224/05813 , H01L2224/05817 , H01L2224/05839 , H01L2224/05844 , H01L2224/11334 , H01L2224/11848 , H01L2224/11849 , H01L2224/119 , H01L2224/131 , H01L2924/00014 , H01L2924/01049 , H01L2924/3511 , H01L2924/3841 , H05K3/3489 , H05K2203/041 , H05K2203/046 , H01L2924/014 , H01L2924/01032 , H01L2924/01105 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029 , H01L2924/0105 , H01L2924/0103 , H01L2924/01083
摘要: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.
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公开(公告)号:US07618844B2
公开(公告)日:2009-11-17
申请号:US11206605
申请日:2005-08-18
申请人: James Sheats
发明人: James Sheats
CPC分类号: H01L25/0655 , H01L21/4867 , H01L23/4985 , H01L23/49866 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/90 , H01L2224/0401 , H01L2224/05571 , H01L2224/05705 , H01L2224/05794 , H01L2224/058 , H01L2224/05811 , H01L2224/0582 , H01L2224/05824 , H01L2224/05839 , H01L2224/05844 , H01L2224/05847 , H01L2224/05849 , H01L2224/05855 , H01L2224/05857 , H01L2224/0586 , H01L2224/05866 , H01L2224/05869 , H01L2224/05871 , H01L2224/05872 , H01L2224/0588 , H01L2224/05884 , H01L2224/1132 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/16237 , H01L2224/81097 , H01L2224/81099 , H01L2224/81136 , H01L2224/81141 , H01L2224/81801 , H01L2224/90 , H01L2924/0001 , H01L2924/0002 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/3452 , H05K3/3463 , H01L2924/0108 , H01L2924/00014 , H01L2924/00 , H01L2224/05552
摘要: A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low temperature amalgam curing, the chip and the substrate form a flexible substrate IC packaging with high conductivity, controllable interface layer thickness, micron-scale contact density and low process temperature. Adhesion between the chip and the substrate can be further enhanced by coating other areas with non-conducting adhesive.
摘要翻译: 公开了一种在柔性基板上的半导体芯片封装。 芯片和柔性基板设置有对应的凸起和凹入的微米级接触垫,其中凹入的接触垫部分地填充有液体汞齐。 低温汞合金固化后,芯片和基板形成柔性基板IC封装,导电性高,界面层厚度可控,微米级接触密度低,工艺温度低。 通过用非导电粘合剂涂覆其它区域,可以进一步提高芯片和基板之间的粘合性。
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公开(公告)号:US07964964B2
公开(公告)日:2011-06-21
申请号:US12582940
申请日:2009-10-21
申请人: James Sheats
发明人: James Sheats
IPC分类号: H01L23/52 , H01L23/48 , H01L29/40 , H01L23/485 , H01L23/488
CPC分类号: H01L25/0655 , H01L21/4867 , H01L23/4985 , H01L23/49866 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/90 , H01L2224/0401 , H01L2224/05571 , H01L2224/05705 , H01L2224/05794 , H01L2224/058 , H01L2224/05811 , H01L2224/0582 , H01L2224/05824 , H01L2224/05839 , H01L2224/05844 , H01L2224/05847 , H01L2224/05849 , H01L2224/05855 , H01L2224/05857 , H01L2224/0586 , H01L2224/05866 , H01L2224/05869 , H01L2224/05871 , H01L2224/05872 , H01L2224/0588 , H01L2224/05884 , H01L2224/1132 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/16237 , H01L2224/81097 , H01L2224/81099 , H01L2224/81136 , H01L2224/81141 , H01L2224/81801 , H01L2224/90 , H01L2924/0001 , H01L2924/0002 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/3452 , H05K3/3463 , H01L2924/0108 , H01L2924/00014 , H01L2924/00 , H01L2224/05552
摘要: A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low temperature amalgam curing, the chip and the substrate form a flexible substrate IC packaging with high conductivity, controllable interface layer thickness, micron-scale contact density and low process temperature. Adhesion between the chip and the substrate can be further enhanced by coating other areas with non-conducting adhesive.
摘要翻译: 公开了一种在柔性基板上的半导体芯片封装。 芯片和柔性基板设置有对应的凸起和凹入的微米级接触垫,其中凹入的接触垫部分地填充有液体汞齐。 低温汞合金固化后,芯片和基板形成柔性基板IC封装,导电性高,界面层厚度可控,微米级接触密度低,工艺温度低。 通过用非导电粘合剂涂覆其它区域,可以进一步提高芯片和基板之间的粘合性。
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公开(公告)号:US09935044B2
公开(公告)日:2018-04-03
申请号:US15092256
申请日:2016-04-06
发明人: Hsiu-Jen Lin , Wen-Hsiung Lu , Cheng-Ting Chen , Hsuan-Ting Kuo , Wei-Yu Chen , Ming-Da Cheng , Chung-Shi Liu
CPC分类号: H01L23/49816 , H01L21/563 , H01L23/3114 , H01L23/49838 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/02377 , H01L2224/02379 , H01L2224/0239 , H01L2224/0382 , H01L2224/03829 , H01L2224/03849 , H01L2224/0391 , H01L2224/0401 , H01L2224/05024 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05568 , H01L2224/05794 , H01L2224/05811 , H01L2224/10125 , H01L2224/11005 , H01L2224/11334 , H01L2224/119 , H01L2224/1191 , H01L2224/13006 , H01L2224/13014 , H01L2224/13017 , H01L2224/13018 , H01L2224/13022 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13117 , H01L2224/1312 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/14131 , H01L2224/16058 , H01L2224/16145 , H01L2224/16227 , H01L2224/2919 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/812 , H01L2224/8121 , H01L2224/8123 , H01L2224/81815 , H01L2224/9212 , H01L2924/0105 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/20105 , H01L2924/20106 , H01L2924/351 , H05K1/111 , H05K3/34 , H01L2924/00 , H01L2924/01047 , H01L2924/01029 , H01L2924/00014 , H01L2924/01032 , H01L2924/01051 , H01L2924/01083 , H01L2924/01084 , H01L2924/01031 , H01L2924/01049 , H01L2924/01081 , H01L2924/00012 , H01L2924/01082 , H01L2924/01013 , H01L2924/01079 , H01L2924/01028 , H01L2924/01074
摘要: The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape.
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公开(公告)号:US20100038770A1
公开(公告)日:2010-02-18
申请号:US12582940
申请日:2009-10-21
申请人: James Sheats
发明人: James Sheats
IPC分类号: H01L23/52
CPC分类号: H01L25/0655 , H01L21/4867 , H01L23/4985 , H01L23/49866 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/90 , H01L2224/0401 , H01L2224/05571 , H01L2224/05705 , H01L2224/05794 , H01L2224/058 , H01L2224/05811 , H01L2224/0582 , H01L2224/05824 , H01L2224/05839 , H01L2224/05844 , H01L2224/05847 , H01L2224/05849 , H01L2224/05855 , H01L2224/05857 , H01L2224/0586 , H01L2224/05866 , H01L2224/05869 , H01L2224/05871 , H01L2224/05872 , H01L2224/0588 , H01L2224/05884 , H01L2224/1132 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/16237 , H01L2224/81097 , H01L2224/81099 , H01L2224/81136 , H01L2224/81141 , H01L2224/81801 , H01L2224/90 , H01L2924/0001 , H01L2924/0002 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/3452 , H05K3/3463 , H01L2924/0108 , H01L2924/00014 , H01L2924/00 , H01L2224/05552
摘要: A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low temperature amalgam curing, the chip and the substrate form a flexible substrate IC packaging with high conductivity, controllable interface layer thickness, micron-scale contact density and low process temperature. Adhesion between the chip and the substrate can be further enhanced by coating other areas with non-conducting adhesive.
摘要翻译: 公开了一种在柔性基板上的半导体芯片封装。 芯片和柔性基板设置有对应的凸起和凹入的微米级接触垫,其中凹入的接触垫部分地填充有液体汞齐。 低温汞合金固化后,芯片和基板形成柔性基板IC封装,导电性高,界面层厚度可控,微米级接触密度低,工艺温度低。 通过用非导电粘合剂涂覆其它区域,可以进一步提高芯片和基板之间的粘合性。
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公开(公告)号:US20070040272A1
公开(公告)日:2007-02-22
申请号:US11206605
申请日:2005-08-18
申请人: James Sheats
发明人: James Sheats
IPC分类号: H01L23/48
CPC分类号: H01L25/0655 , H01L21/4867 , H01L23/4985 , H01L23/49866 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/90 , H01L2224/0401 , H01L2224/05571 , H01L2224/05705 , H01L2224/05794 , H01L2224/058 , H01L2224/05811 , H01L2224/0582 , H01L2224/05824 , H01L2224/05839 , H01L2224/05844 , H01L2224/05847 , H01L2224/05849 , H01L2224/05855 , H01L2224/05857 , H01L2224/0586 , H01L2224/05866 , H01L2224/05869 , H01L2224/05871 , H01L2224/05872 , H01L2224/0588 , H01L2224/05884 , H01L2224/1132 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/16237 , H01L2224/81097 , H01L2224/81099 , H01L2224/81136 , H01L2224/81141 , H01L2224/81801 , H01L2224/90 , H01L2924/0001 , H01L2924/0002 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/3452 , H05K3/3463 , H01L2924/0108 , H01L2924/00014 , H01L2924/00 , H01L2224/05552
摘要: A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low temperature amalgam curing, the chip and the substrate form a flexible substrate IC packaging with high conductivity, controllable interface layer thickness, micron-scale contact density and low process temperature. Adhesion between the chip and the substrate can be further enhanced by coating other areas with non-conducting adhesive.
摘要翻译: 公开了一种在柔性基板上的半导体芯片封装。 芯片和柔性基板设置有对应的凸起和凹入的微米级接触垫,其中凹入的接触垫部分地填充有液体汞齐。 低温汞合金固化后,芯片和基板形成柔性基板IC封装,导电性高,界面层厚度可控,微米级接触密度低,工艺温度低。 通过用非导电粘合剂涂覆其它区域,可以进一步提高芯片和基板之间的粘合性。
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公开(公告)号:US09950393B2
公开(公告)日:2018-04-24
申请号:US13976001
申请日:2011-12-23
IPC分类号: B23K35/02 , B23K35/362 , H01L23/00 , H05K3/34 , H01L23/488 , H01L23/498 , H01L21/48
CPC分类号: B23K35/025 , B23K35/362 , H01L21/4853 , H01L23/488 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0381 , H01L2224/03828 , H01L2224/03829 , H01L2224/03849 , H01L2224/0401 , H01L2224/05794 , H01L2224/058 , H01L2224/05809 , H01L2224/05811 , H01L2224/05813 , H01L2224/05817 , H01L2224/05839 , H01L2224/05844 , H01L2224/11334 , H01L2224/11848 , H01L2224/11849 , H01L2224/119 , H01L2224/131 , H01L2924/00014 , H01L2924/01049 , H01L2924/3511 , H01L2924/3841 , H05K3/3489 , H05K2203/041 , H05K2203/046 , H01L2924/014 , H01L2924/01032 , H01L2924/01105 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029 , H01L2924/0105 , H01L2924/0103 , H01L2924/01083
摘要: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.
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公开(公告)号:US20160218055A1
公开(公告)日:2016-07-28
申请号:US15092256
申请日:2016-04-06
发明人: HSIU-JEN LIN , WEN-HSIUNG LU , CHENG-TING CHEN , HSUAN-TING KUO , WEI-YU CHEN , MING-DA CHENG , CHUNG-SHI LIU
IPC分类号: H01L23/498 , H05K1/11
CPC分类号: H01L23/49816 , H01L21/563 , H01L23/3114 , H01L23/49838 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/02377 , H01L2224/02379 , H01L2224/0239 , H01L2224/0382 , H01L2224/03829 , H01L2224/03849 , H01L2224/0391 , H01L2224/0401 , H01L2224/05024 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05568 , H01L2224/05794 , H01L2224/05811 , H01L2224/10125 , H01L2224/11005 , H01L2224/11334 , H01L2224/119 , H01L2224/1191 , H01L2224/13006 , H01L2224/13014 , H01L2224/13017 , H01L2224/13018 , H01L2224/13022 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13117 , H01L2224/1312 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/14131 , H01L2224/16058 , H01L2224/16145 , H01L2224/16227 , H01L2224/2919 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/812 , H01L2224/8121 , H01L2224/8123 , H01L2224/81815 , H01L2224/9212 , H01L2924/0105 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/20105 , H01L2924/20106 , H01L2924/351 , H05K1/111 , H05K3/34 , H01L2924/00 , H01L2924/01047 , H01L2924/01029 , H01L2924/00014 , H01L2924/01032 , H01L2924/01051 , H01L2924/01083 , H01L2924/01084 , H01L2924/01031 , H01L2924/01049 , H01L2924/01081 , H01L2924/00012 , H01L2924/01082 , H01L2924/01013 , H01L2924/01079 , H01L2924/01028 , H01L2924/01074
摘要: The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape.
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公开(公告)号:US09355927B2
公开(公告)日:2016-05-31
申请号:US14088513
申请日:2013-11-25
发明人: Hsiu-Jen Lin , Wen-Hsiung Lu , Cheng-Ting Chen , Hsuan-Ting Kuo , Wei-Yu Chen , Ming-Da Cheng , Chung-Shi Liu
IPC分类号: H01L23/488 , H01L23/31 , H01L23/00 , H01L23/498 , H05K3/34 , H01L21/56
CPC分类号: H01L23/49816 , H01L21/563 , H01L23/3114 , H01L23/49838 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/02377 , H01L2224/02379 , H01L2224/0239 , H01L2224/0382 , H01L2224/03829 , H01L2224/03849 , H01L2224/0391 , H01L2224/0401 , H01L2224/05024 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05568 , H01L2224/05794 , H01L2224/05811 , H01L2224/10125 , H01L2224/11005 , H01L2224/11334 , H01L2224/119 , H01L2224/1191 , H01L2224/13006 , H01L2224/13014 , H01L2224/13017 , H01L2224/13018 , H01L2224/13022 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13117 , H01L2224/1312 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/14131 , H01L2224/16058 , H01L2224/16145 , H01L2224/16227 , H01L2224/2919 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/812 , H01L2224/8121 , H01L2224/8123 , H01L2224/81815 , H01L2224/9212 , H01L2924/0105 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/20105 , H01L2924/20106 , H01L2924/351 , H05K1/111 , H05K3/34 , H01L2924/00 , H01L2924/01047 , H01L2924/01029 , H01L2924/00014 , H01L2924/01032 , H01L2924/01051 , H01L2924/01083 , H01L2924/01084 , H01L2924/01031 , H01L2924/01049 , H01L2924/01081 , H01L2924/00012 , H01L2924/01082 , H01L2924/01013 , H01L2924/01079 , H01L2924/01028 , H01L2924/01074
摘要: The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape.
摘要翻译: 本公开提供一种半导体封装,其包括接触焊盘,接触焊盘外部的器件和接触焊盘上的焊料凸块。 该器件具有对应于接触焊盘的导电接触焊盘。 焊锡凸块将接触焊盘与导电接触焊盘连接。 焊料凸块包括从焊料凸块的顶部到接触垫的高度; 以及在垂直于高度的方向上的焊料凸块的最宽尺寸的宽度。 靠近接触垫的焊料凸块的接合部分包括沙漏形状。
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公开(公告)号:US20150145130A1
公开(公告)日:2015-05-28
申请号:US14088513
申请日:2013-11-25
发明人: HSIU-JEN LIN , WEN-HSIUNG LU , CHENG-TING CHEN , HSUAN-TING KUO , WEI-YU CHEN , MING-DA CHENG , CHUNG-SHI LIU
CPC分类号: H01L23/49816 , H01L21/563 , H01L23/3114 , H01L23/49838 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/02377 , H01L2224/02379 , H01L2224/0239 , H01L2224/0382 , H01L2224/03829 , H01L2224/03849 , H01L2224/0391 , H01L2224/0401 , H01L2224/05024 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05568 , H01L2224/05794 , H01L2224/05811 , H01L2224/10125 , H01L2224/11005 , H01L2224/11334 , H01L2224/119 , H01L2224/1191 , H01L2224/13006 , H01L2224/13014 , H01L2224/13017 , H01L2224/13018 , H01L2224/13022 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13117 , H01L2224/1312 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/14131 , H01L2224/16058 , H01L2224/16145 , H01L2224/16227 , H01L2224/2919 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/812 , H01L2224/8121 , H01L2224/8123 , H01L2224/81815 , H01L2224/9212 , H01L2924/0105 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/20105 , H01L2924/20106 , H01L2924/351 , H05K1/111 , H05K3/34 , H01L2924/00 , H01L2924/01047 , H01L2924/01029 , H01L2924/00014 , H01L2924/01032 , H01L2924/01051 , H01L2924/01083 , H01L2924/01084 , H01L2924/01031 , H01L2924/01049 , H01L2924/01081 , H01L2924/00012 , H01L2924/01082 , H01L2924/01013 , H01L2924/01079 , H01L2924/01028 , H01L2924/01074
摘要: The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape.
摘要翻译: 本公开提供一种半导体封装,其包括接触焊盘,接触焊盘外部的器件和接触焊盘上的焊料凸块。 该器件具有对应于接触焊盘的导电接触焊盘。 焊锡凸块将接触焊盘与导电接触焊盘连接。 焊料凸块包括从焊料凸块的顶部到接触垫的高度; 以及在垂直于高度的方向上的焊料凸块的最宽尺寸的宽度。 靠近接触垫的焊料凸块的接合部分包括沙漏形状。
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