公开(公告)号：US20170345763A1

公开(公告)日：2017-11-30

申请号：US15505901

申请日：2014-09-26

Applicant: INTEL CORPORATION

Inventor： Bok Eng CHEAH ,  Jackson Chung Peng KONG ,  Shanggar PERIAMAN ,  Michael SKINNER ,  Yen Hsiang CHEW ,  Kheng Tat MAR ,  Ridza Effendi ABD RAZAK ,  Kooi Chi OOI

IPC: H01L23/538 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/5387 ,  H01L21/4846 ,  H01L23/3736 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/18 ,  H01L24/19 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73259 ,  H01L2924/15311

Abstract: A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.