公开(公告)号：US20180294252A1

公开(公告)日：2018-10-11

申请号：US15766150

申请日：2015-11-05

Applicant: Intel Corporation

Inventor： Bok Eng CHEAH ,  Jackson Chung Peng KONG ,  Ping Ping OOI ,  Kooi Chi OOI ,  Shanggar PERIAMAN

IPC: H01L25/065 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1816 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward a stacked package assembly for embedded dies and associated techniques and configurations. In one embodiment, stacked package assembly may comprise a first die package and a second die package stacked one upon the other with plural interconnections between them; and a voltage reference plane embedded in at least one of the first and second die packages in proximity and generally parallel to the other of the first and second die packages.

公开(公告)号：US20170345763A1

公开(公告)日：2017-11-30

申请号：US15505901

申请日：2014-09-26

Applicant: INTEL CORPORATION

Inventor： Bok Eng CHEAH ,  Jackson Chung Peng KONG ,  Shanggar PERIAMAN ,  Michael SKINNER ,  Yen Hsiang CHEW ,  Kheng Tat MAR ,  Ridza Effendi ABD RAZAK ,  Kooi Chi OOI

IPC: H01L23/538 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/5387 ,  H01L21/4846 ,  H01L23/3736 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/18 ,  H01L24/19 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73259 ,  H01L2924/15311

Abstract: A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.