公开(公告)号：US11543868B2

公开(公告)日：2023-01-03

申请号：US16898603

申请日：2020-06-11

Applicant: Intel Corporation

Inventor： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

IPC: G06F1/20 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/324 ,  G06F3/041 ,  G06F11/30 ,  G06F1/32 ,  G06F1/26

Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

公开(公告)号：US20160179158A1

公开(公告)日：2016-06-23

申请号：US14852859

申请日：2015-09-14

Applicant: Intel Corporation

Inventor： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

IPC: G06F1/26 ,  G06F1/18 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F3/0412 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，处理器包括至少一个核心和电源管理逻辑。 电源管理逻辑用于从包括处理器的封装内的多个管芯接收温度数据，并且确定多个温度控制裕度的最小温度控制裕度。 每个温度控制余量将基于与管芯相关联的相应的热控制温度并且还基于与管芯相关联的相应的温度数据来确定。 电源管理逻辑还可以生成包含最小温度控制余量的热报告，并存储热报告。 描述和要求保护其他实施例。

公开(公告)号：US20200301490A1

公开(公告)日：2020-09-24

申请号：US16898603

申请日：2020-06-11

Applicant: Intel Corporation

Inventor： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

IPC: G06F1/20 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/324 ,  G06F3/041

Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

公开(公告)号：US10275001B2

公开(公告)日：2019-04-30

申请号：US14752512

申请日：2015-06-26

Applicant: Intel Corporation

Inventor： Timothy Y. Kam ,  Sandeep Ahuja ,  Rajat Agarwal ,  Avinash Sodani ,  Jinho Suh ,  Meenakshisundaram Chinthamani

IPC: G06F1/20 ,  G06F1/32 ,  G06F1/3206 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3225

Abstract: Disclosed herein is a computing device configured to implement thermal throttling of a component of the computing device. The computing device includes an electronic component and a temperature sensor thermally coupled to the electronic component. The computing device also includes a thermal management controller to receive a temperature measurement from the temperature sensor and generate a throttling factor for the electronic component. If the temperature measurement is greater than a specified threshold, the throttling factor is to reduce performance of the electronic component to be at least the performance guarantee for the electronic component.

公开(公告)号：US20160378149A1

公开(公告)日：2016-12-29

申请号：US14752512

申请日：2015-06-26

Applicant: INTEL CORPORATION

Inventor： Timothy Y. Kam ,  Sandeep Ahuja ,  Rajat Agarwal ,  Avinash Sodani ,  Jinho Suh ,  Meenakshisundaram Chinthamani

IPC: G06F1/20 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/3225 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3275 ,  G06F2212/1028 ,  G11C7/04 ,  Y02D10/126 ,  Y02D10/13 ,  Y02D10/14 ,  Y02D10/16

Abstract: Disclosed herein is a computing device configured to implement thermal throttling of a component of the computing device. The computing device includes an electronic component and a temperature sensor thermally coupled to the electronic component. The computing device also includes a thermal management controller to receive a temperature measurement from the temperature sensor and generate a throttling factor for the electronic component. If the temperature measurement is greater than a specified threshold, the throttling factor is to reduce performance of the electronic component to be at least the performance guarantee for the electronic component.

Abstract translation: 这里公开了一种被配置为实现计算设备的部件的热调节的计算设备。 计算设备包括热耦合到电子部件的电子部件和温度传感器。 计算设备还包括热管理控制器，用于从温度传感器接收温度测量并产生电子部件的节流因子。 如果温度测量值大于指定的阈值，则节流因素是将电子元件的性能降至至少为电子元件的性能保证。