公开(公告)号：US20230091205A1

公开(公告)日：2023-03-23

申请号：US17479582

申请日：2021-09-20

Applicant: Intel Corporation

Inventor： Adrian Moga ,  Ugonna Echeruo ,  Eduard Roytman ,  Krishnakanth Sistla ,  Joseph Nuzman ,  Brinda Ganesh ,  Meenakshisundaram Chinthamani ,  Yen-Cheng Liu ,  Sai Prashanth Muralidhara ,  Vivek Kozhikkottu ,  Hanna Alam ,  Narasimha Sridhar Srirangam

IPC: G06F12/0862 ,  G06F13/28

Abstract: Methods and apparatus relating to memory side prefetch architecture for improved memory bandwidth are described. In an embodiment, logic circuitry transmits a Direct Memory Controller Prefetch (DMCP) request to cause a prefetch of data from memory. A memory controller receives the DMCP request and issues a plurality of read operations to the memory in response to the DMCP request. Data read from the memory is stored in a storage structure in response to the plurality of read operations. Other embodiments are also disclosed and claimed.

公开(公告)号：US10275001B2

公开(公告)日：2019-04-30

申请号：US14752512

申请日：2015-06-26

Applicant: Intel Corporation

Inventor： Timothy Y. Kam ,  Sandeep Ahuja ,  Rajat Agarwal ,  Avinash Sodani ,  Jinho Suh ,  Meenakshisundaram Chinthamani

IPC: G06F1/20 ,  G06F1/32 ,  G06F1/3206 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3225

Abstract: Disclosed herein is a computing device configured to implement thermal throttling of a component of the computing device. The computing device includes an electronic component and a temperature sensor thermally coupled to the electronic component. The computing device also includes a thermal management controller to receive a temperature measurement from the temperature sensor and generate a throttling factor for the electronic component. If the temperature measurement is greater than a specified threshold, the throttling factor is to reduce performance of the electronic component to be at least the performance guarantee for the electronic component.

公开(公告)号：US20160378149A1

公开(公告)日：2016-12-29

申请号：US14752512

申请日：2015-06-26

Applicant: INTEL CORPORATION

Inventor： Timothy Y. Kam ,  Sandeep Ahuja ,  Rajat Agarwal ,  Avinash Sodani ,  Jinho Suh ,  Meenakshisundaram Chinthamani

IPC: G06F1/20 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/3225 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3275 ,  G06F2212/1028 ,  G11C7/04 ,  Y02D10/126 ,  Y02D10/13 ,  Y02D10/14 ,  Y02D10/16

Abstract: Disclosed herein is a computing device configured to implement thermal throttling of a component of the computing device. The computing device includes an electronic component and a temperature sensor thermally coupled to the electronic component. The computing device also includes a thermal management controller to receive a temperature measurement from the temperature sensor and generate a throttling factor for the electronic component. If the temperature measurement is greater than a specified threshold, the throttling factor is to reduce performance of the electronic component to be at least the performance guarantee for the electronic component.

Abstract translation: 这里公开了一种被配置为实现计算设备的部件的热调节的计算设备。 计算设备包括热耦合到电子部件的电子部件和温度传感器。 计算设备还包括热管理控制器，用于从温度传感器接收温度测量并产生电子部件的节流因子。 如果温度测量值大于指定的阈值，则节流因素是将电子元件的性能降至至少为电子元件的性能保证。