公开(公告)号：US09761505B2

公开(公告)日：2017-09-12

申请号：US14921067

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US10595401B1

公开(公告)日：2020-03-17

申请号：US16424874

申请日：2019-05-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  Arthur J. Higby ,  David C. Long ,  Michael J. Fisher ,  Russell A. Budd ,  Michel Turgeon ,  Sylvain Tetreault

IPC: H05K1/02 ,  H05K5/02 ,  H05K1/18 ,  H05K3/06 ,  H05K3/00 ,  H05K3/46

Abstract: Tamper-respondent assemblies are provided which include an enclosure assembly mounted to a circuit board and enclosing an electronic component(s) within a secure volume. The enclosure assembly includes an enclosure with an edge surface coupled to the circuit board, and a tamper-respondent sensor. The tamper-respondent sensor covers the edge surface and an inner surface of the enclosure. The sensor includes multiple layers, and at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern covered, at least in part, by at least one layer of the multiple layers. The at least one layer is partially removed to provide exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure. The conductive trace(s) is contacted where exposed by an adhesive securing the sensor to the circuit board. A monitor circuit monitors the tamper-detect circuit(s) for a tamper event.

公开(公告)号：US10798816B1

公开(公告)日：2020-10-06

申请号：US16747075

申请日：2020-01-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. Busby ,  Arthur J. Higby ,  David C. Long ,  Michael J. Fisher ,  Russell A. Budd ,  Michel Turgeon ,  Sylvain Tetreault

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/18 ,  H05K5/02 ,  H05K3/06 ,  H05K3/00

Abstract: Tamper-respondent assemblies are provided which include an enclosure with an edge surface, and a tamper-respondent sensor. The tamper-respondent sensor covers, at least in part, the edge surface and an inner surface of the enclosure. The sensor includes at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern. The tamper-respondent sensor includes exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure to facilitate an adhesive directly contacting the at least one conductive trace in the exposed regions.

公开(公告)号：US20180190565A1

公开(公告)日：2018-07-05

申请号：US15907802

申请日：2018-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L23/367 ,  H01L25/00 ,  H01L21/48 ,  H01L23/42 ,  H01L21/50 ,  H01L21/56 ,  H01L21/321 ,  H01L21/66 ,  H01L21/52

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09881848B2

公开(公告)日：2018-01-30

申请号：US14921072

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/48 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09257308B2

公开(公告)日：2016-02-09

申请号：US14836461

申请日：2015-08-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L21/48 ,  H01L25/00

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US10896862B2

公开(公告)日：2021-01-19

申请号：US15907802

申请日：2018-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/50 ,  H01L21/48 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09941184B2

公开(公告)日：2018-04-10

申请号：US15791815

申请日：2017-10-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L23/367 ,  H01L23/00 ,  H01L21/66 ,  H01L21/56 ,  H01L23/04 ,  H01L21/48 ,  H01L23/42 ,  H01L25/00 ,  H01L21/50 ,  H01L21/324 ,  H01L21/321 ,  H01L21/52 ,  H01L21/3105 ,  H01L23/50 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09646913B2

公开(公告)日：2017-05-09

申请号：US14921026

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/66 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L23/04 ,  H01L23/42 ,  H01L21/48 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09576878B2

公开(公告)日：2017-02-21

申请号：US14921051

申请日：2015-10-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC: H01L21/00 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/48 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC classification number: H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

Abstract translation: 公开了一种封装的组件，包括分配在有机封装上的热界面材料和制造方法。 该方法包括在电子组件上分配热界面材料（TIM）。 该方法还包括在盖子放置在电子组件上之前去除TIM的挥发性物质。 该方法还包括将盖子放置在TIM上方的电子组件上。 该方法还包括将盖子按压到电子组件上。