公开(公告)号：US11052637B2

公开(公告)日：2021-07-06

申请号：US16769545

申请日：2018-11-27

Applicant: ISHIHARA CHEMICAL CO., LTD.

Inventor： Shoya Iuchi ,  Masaru Hatabe ,  Takahiro Tanaka ,  Fuka Yamaoka

IPC: B32B15/01 ,  B32B15/04 ,  B32B15/18 ,  C25D3/12 ,  C25D3/30 ,  C25D5/14 ,  H01L23/532

Abstract: A structure containing a Sn layer or a Sn alloy layer includes a substrate, a Sn layer or Sn alloy layer formed above the substrate, and an under barrier metal formed between the substrate and the Sn layer or Sn alloy layer in the form of a single metal layer containing any one of Fe, Co, Ru and Pd, or an alloy layer containing two or more of Fe, Co, Ru and Pd.

公开(公告)号：US11939691B2

公开(公告)日：2024-03-26

申请号：US16309088

申请日：2017-06-13

Applicant: ISHIHARA CHEMICAL CO., LTD.

Inventor： Syohei Yamaguchi ,  Hiroki Ishida ,  Masaru Hatabe ,  Shoya Iuchi

IPC: C25D3/32 ,  C25D3/58 ,  C25D3/60 ,  C25D7/12 ,  H01L23/00

CPC classification number: C25D3/32 ,  C25D3/60 ,  C25D7/12 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11462 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2924/014

Abstract: An electrodeposit formed by using a tin or tin alloy plating bath containing a prescribed branched polyoxyalkylene compound, such as an alkylene oxide adduct of aliphatic monoamine or polyamine in which a plurality of oxyalkylene chains are bonded to a nitrogen atom of an amine structure in a molecule, or an alkylene oxide adduct of glycerin or polyglycerin in which oxyalkylene chains are respectively bonded to a plurality of oxygen atoms of an alcohol structure in a molecule, suppresses formation defect such as abnormal growth of the electrodeposit. The electrodeposit also improves yield from the viewpoint of quality control.

公开(公告)号：US10062657B2

公开(公告)日：2018-08-28

申请号：US15518219

申请日：2015-10-09

Applicant: ISHIHARA CHEMICAL CO., LTD.

Inventor： Shoya Iuchi ,  Masaru Hatabe

IPC: H01L23/00 ,  H05K3/34

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13139 ,  H05K3/34 ,  H01L2924/014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047

Abstract: In order to manufacture an alloy bump, a resist pattern having openings which expose a substrate is formed on the substrate, an under-bump metal is formed on the substrate inside the openings, a first plating film is formed on the under-bump metal by electroplating, a second plating film containing no metal components which are contained in the first plating film is formed on the first plating film by electroplating, the resist pattern is removed, and the alloy bump is formed by heat treating the substrate to thereby alloy the first plating film and the second plating film.