摘要:
There is described a method of forming a fine pattern aimed at depositing a silicon-nitride-based anti-reflection film which is stable even at high temperature and involves small internal stress. The method is also intended to preventing occurrence of a footing pattern (a rounded corner) in a boundary surface between a photoresist and a substrate at the time of formation of a chemically-amplified positive resist pattern on the anti-reflection film. The method includes the steps of forming a silicon-nitride-based film directly on a substrate or on a substrate by way of another layer; and forming a photoresist directly on the silicon-nitride-based film or on the silicon-nitride-based film by way of another layer. The silicon-nitride-based film is deposited while the temperature at which the substrate is to be situated is set so as to fall within the range of 400 to 700° C., through use of a plasma CVD system. The method further includes a step of depositing a silicon-oxide-based film immediately below the photoresist. The silicon-oxide-based film is deposited while the temperature at which the substrate is to be situated is set so as to fall within the range of 400 to 700° C., through use of a plasma CVD system.
摘要:
In a method of forming a fine pattern, a silicon-oxide-based film is formed directly or by way of another layer on a substrate or on an underlying layer. The silicon-oxide-based film is formed such that nitrogen content of the surface thereof assumes a value of 0.1 atm. % or less. A chemically-amplified photoresist layer is formed on the silicon-oxide-based film. A mask pattern of a mask is transferred onto the chemically-amplified photoresist layer upon exposure through the mask. Thus, there is prevented generation of a tapered corner in a portion of a resist pattern in the vicinity of a boundary area between the resist pattern and a substrate.
摘要:
The time in the chipset of backup resources is synchronized easily at the system time.An information processing apparatus including: an operational chipset which includes a first Real Time Clock (RTC); a backup chipset which includes a second RTC: a third RTC which times system time; a difference time calculation unit which calculates a difference time between a system time periodically notified of from the first RTC of the operational chipset and the system time which the third RTC times; a holding unit which holds the difference time; a calculation unit which calculates a temporary system time which is set to the second RTC of the backup chipset to which a chipset switching operated, based on the system time of the third RTC and the difference time at the time of the chipset switching; and a configuration unit which sets the temporary system time to the second RTC of the backup chipset.
摘要:
To provide a polyarylene sulfide resin composition which contains decreased amount of chlorine, which has a high fluidity and generates small flashes at the time of molding, which has an excellent heat resistance, which can resist heat-processing under the condition of a high temperature, which has moldability at a low mold temperature, a molded article of which has an extremely small change in surface hue before and after reflow. The resin composition is obtained by blending: 100 parts by weight of a polyarylene sulfide resin (A) containing 500 to 2,000 ppm of chlorine and having 10 to 200 Pa·s of melt viscosity, 10 to 100 parts by weight of a liquid crystalline polyester amide resin (B), and 5 to 250 parts by weight of glass fiber (C) containing 100 ppm or less of nitrogen, and having a total chlorine content of 950 ppm or less,
摘要:
The characteristics of a semiconductor device including a trench-gate power MISFET are improved. The semiconductor device includes a substrate having an active region where the power MISFET is provided and an outer circumferential region which is located circumferentially outside the active region and where a breakdown resistant structure is provided, a pattern formed of a conductive film provided over the substrate in the outer circumferential region with an insulating film interposed therebetween, another pattern isolated from the pattern, and a gate electrode terminal electrically coupled to the gate electrodes of the power MISFET and provided in a layer over the conductive film. The conductive film of the pattern is electrically coupled to the gate electrode terminal, while the conductive film of another pattern is electrically decoupled from the gate electrode terminal.
摘要:
A semiconductor-processing apparatus comprises a susceptor and removable placing blocks detachably placed at a periphery of the susceptor for transferring a substrate. Retractable supporting members are provided for detaching/attaching the placing blocks from/to the susceptor.
摘要:
An information processing unit includes a processing unit including a plurality of processor cores; and a power consumption reduction device configured to reduce power consumption of the processing unit. The power consumption reduction device measures the loads on threads that are running in the plurality of cores; checks the number of high load threads which are threads in a high load state and the number of low load threads which are threads in a low load state for each core, on the basis of the measuring results; selects, when there exists a core having high load threads whose number is less than a preset threshold on the number of high load threads, the core as a candidate core; and replaces the high load threads existing in the candidate core with the low load threads existing in other cores when the total number of the low load threads in a core other than the candidate core is not less than the number of the high load threads in the candidate core.
摘要:
Provided is a PAS resin composition with which molded articles having excellent high- and low-temperature impact properties can be obtained and which can be highly inhibited from leaving mold deposits when molded and is suitable for use in insert molding. Also provided is an insert-molded article obtained using the resin composition. The PAS-derived resin composition comprises a PAS resin having carboxylic terminal groups and an olefin-derived copolymer, wherein the olefin-derived copolymer comprises units of an α-olefin, a glycidyl ester of an α,β-unsaturated acid, and an acrylic ester as comonomer units, the PAS resin has a number average molecular weight of 1,000-10,000, and the content of the comonomer units derived from the glycidyl ester in the resin composition is 0.08-0.20 mass %, the ratio of the content of the comonomer units derived from the glycidyl ester (mmol/kg) to the amount of the carboxylic terminal groups (mmol/kg) being 0.35-1.00.
摘要:
The characteristics of a semiconductor device including a trench-gate power MISFET are improved. The semiconductor device includes a substrate having an active region where the power MISFET is provided and an outer circumferential region which is located circumferentially outside the active region and where a breakdown resistant structure is provided, a pattern formed of a conductive film provided over the substrate in the outer circumferential region with an insulating film interposed therebetween, another pattern isolated from the pattern, and a gate electrode terminal electrically coupled to the gate electrodes of the power MISFET and provided in a layer over the conductive film. The conductive film of the pattern is electrically coupled to the gate electrode terminal, while the conductive film of another pattern is electrically decoupled from the gate electrode terminal.
摘要:
Provided is a PAS resin composition with which molded articles having excellent high- and low-temperature impact properties can be obtained and which can be highly inhibited from leaving mold deposits when molded and is suitable for use in insert molding. Also provided is an insert-molded article obtained using the resin composition. The PAS-derived resin composition comprises a PAS resin having carboxylic terminal groups and an olefin-derived copolymer, wherein the olefin-derived copolymer comprises units of an α-olefin, a glycidyl ester of an α,β-unsaturated acid, and an acrylic ester as comonomer units, the PAS resin has a number average molecular weight of 1,000-10,000, and the content of the comonomer units derived from the glycidyl ester in the resin composition is 0.08-0.20 mass %, the ratio of the amount of the carboxylic terminal groups (mmol/kg) and the content of the comonomer units derived from the glycidyl ester (mmol/kg) being 0.35-1.00.