公开(公告)号：US20070262393A1

公开(公告)日：2007-11-15

申请号：US11797827

申请日：2007-05-08

申请人： Il-Young Yoon ,  Hong-Jae Shin ,  Nae-In Lee ,  Jae-Ouk Choo ,  Ja-Eung Koo

发明人： Il-Young Yoon ,  Hong-Jae Shin ,  Nae-In Lee ,  Jae-Ouk Choo ,  Ja-Eung Koo

IPC分类号： H01L29/76 ,  H01L21/76 ,  H01L21/461 ,  H01L29/94 ,  H01L21/302 ,  H01L31/00

CPC分类号： H01L21/31053 ,  H01L21/76229

摘要： Example embodiments provide a semiconductor device and a method of forming the same. According to the method, a capping insulation pattern may be formed to cover the top surface of a filling insulation pattern in a trench. The capping insulation pattern may have an etch selectivity according to the filling insulation pattern. As a result, the likelihood that the filling insulation layer may be etched by various cleaning processes and the process removing the buffer insulation pattern may be reduced or prevented.

摘要翻译： 示例性实施例提供半导体器件及其形成方法。 根据该方法，可以形成覆盖绝缘图案以覆盖沟槽中的填充绝缘图案的顶表面。 封盖绝缘图案可以根据填充绝缘图案具有蚀刻选择性。 结果，可以减少或防止填充绝缘层可以通过各种清洁处理蚀刻的可能性以及去除缓冲绝缘图案的过程。

公开(公告)号：US07595253B2

公开(公告)日：2009-09-29

申请号：US11797827

申请日：2007-05-08

申请人： II-Young Yoon ,  Hong-Jae Shin ,  Nae-In Lee ,  Jae-Ouk Choo ,  Ja-Eung Koo

发明人： II-Young Yoon ,  Hong-Jae Shin ,  Nae-In Lee ,  Jae-Ouk Choo ,  Ja-Eung Koo

IPC分类号： H01L21/76

CPC分类号： H01L21/31053 ,  H01L21/76229

摘要： Example embodiments provide a semiconductor device and a method of forming the same. According to the method, a capping insulation pattern may be formed to cover the top surface of a filling insulation pattern in a trench. The capping insulation pattern may have an etch selectivity according to the filling insulation pattern. As a result, the likelihood that the filling insulation layer may be etched by various cleaning processes and the process removing the buffer insulation pattern may be reduced or prevented.

摘要翻译： 示例性实施例提供半导体器件及其形成方法。 根据该方法，可以形成覆盖绝缘图案以覆盖沟槽中的填充绝缘图案的顶表面。 封盖绝缘图案可以根据填充绝缘图案具有蚀刻选择性。 结果，可以减少或防止填充绝缘层可以通过各种清洁处理蚀刻的可能性以及去除缓冲绝缘图案的过程。

公开(公告)号：US06924207B2

公开(公告)日：2005-08-02

申请号：US10696438

申请日：2003-10-29

申请人： Hong-Seong Son ,  Sang-Rok Hah ,  Ja-Eung Koo

发明人： Hong-Seong Son ,  Sang-Rok Hah ,  Ja-Eung Koo

IPC分类号： H01L23/52 ,  H01L21/02 ,  H01L21/3205 ,  H01L21/822 ,  H01L27/04 ,  H01L27/08 ,  H01L27/108 ,  H01L21/20

CPC分类号： H01L28/40 ,  H01L27/0805

摘要： A method of fabricating a semiconductor device is provided. The method includes forming an interconnection line over a ssubstrate. The interconnection line functions as a first electrode. A first insulating layer is formed on the substrate including the metal interconnection line. An electrode layer and an oxide layer are formed on the first insulating layer. A photoresist pattern is formed on the oxide layer. The oxide layer and the electrode layer are etched using the photoresist pattern as an etching mask. As a result, a second electrode and an oxide layer pattern, which are stacked, are formed over the interconnection line. At least the electrode layer is etched using a wet etching technique. The photoresist pattern is then removed.

摘要翻译： 提供一种制造半导体器件的方法。 该方法包括在ssubstrate上形成互连线。 互连线用作第一电极。 在包括金属互连线的基板上形成第一绝缘层。 在第一绝缘层上形成电极层和氧化物层。 在氧化物层上形成光刻胶图形。 使用光致抗蚀剂图案作为蚀刻掩模蚀刻氧化物层和电极层。 结果，在互连线上形成堆叠的第二电极和氧化物层图案。 至少使用湿蚀刻技术蚀刻电极层。 然后去除光致抗蚀剂图案。

公开(公告)号：US07166019B2

公开(公告)日：2007-01-23

申请号：US11044373

申请日：2005-01-27

申请人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

发明人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

IPC分类号： B24B49/00

CPC分类号： B24B37/30 ,  Y10T279/11

摘要： A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

摘要翻译： 提供了一种用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置。 用于抛光头的柔性膜包括具有第一面和与第一面相对的第二面的压缩板。 压缩板的第一面保持提供真空的基板，并将基板压在抛光垫上。 压缩板的第二面与抛光头的支撑件组合。 第二面和支撑件限定了用于保持基板的真空和用于压缩基板的第一气动压力的空间。 与支撑件组合的分隔构件形成在第二面上。 分隔构件将空间分成至少两个区域。 在分隔构件上形成气压导入部。 通过气动压力引入部分向压缩板提供第二气动压力。

公开(公告)号：US20050176354A1

公开(公告)日：2005-08-11

申请号：US11044373

申请日：2005-01-27

申请人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

发明人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

IPC分类号： B24B37/005 ,  B24B37/30 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/30 ,  Y10T279/11

摘要： A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

摘要翻译： 提供了一种用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置。 用于抛光头的柔性膜包括具有第一面和与第一面相对的第二面的压缩板。 压缩板的第一面保持提供真空的基板，并将基板压在抛光垫上。 压缩板的第二面与抛光头的支撑件组合。 第二面和支撑件限定了用于保持基板的真空和用于压缩基板的第一气动压力的空间。 与支撑件组合的分隔构件形成在第二面上。 分隔构件将空间分成至少两个区域。 在分隔构件上形成气压导入部。 通过气动压力引入部分向压缩板提供第二气动压力。

公开(公告)号：US20050048875A1

公开(公告)日：2005-03-03

申请号：US10850688

申请日：2004-05-21

申请人： Ja-Eung Koo ,  Jong-Won Lee ,  Sung-Bae Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son

发明人： Ja-Eung Koo ,  Jong-Won Lee ,  Sung-Bae Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son

IPC分类号： B24B37/02 ,  B24B37/04 ,  B24B49/10 ,  B24B49/14 ,  B24B49/00 ,  B24B1/00

CPC分类号： B24B37/013 ,  B24B49/10 ,  B24B49/14

摘要： There is provided a chemical mechanical polishing apparatus, which may include a polishing table rotated by a polishing table motor and having a pad thereon, a carrier head located above the polishing table to be rotatable by the driving of a carrier head motor and having a wafer located under the bottom thereof, a slurry supplier for supplying a slurry to the upper portion of the polishing table, a first polishing end point detector for detecting a polishing end point through the temperature change of the temperature sensor, at least one temperature sensor for detecting the temperature of a polishing region (the wafer, the pad, and the slurry), and a second polishing end point detector for detecting a polishing end point from the changes of load current, voltage, and resistance of the carrier head motor. Further, instead of the second polishing end point detector, an optical signal polishing end point detector may be employed, for detecting the polishing end point by the light illuminated on the wafer and reflected from the wafer.

公开(公告)号：US20060151887A1

公开(公告)日：2006-07-13

申请号：US11326301

申请日：2006-01-05

申请人： Jun-Hwan Oh ,  Ja-Eung Koo ,  Se-Jong Park

发明人： Jun-Hwan Oh ,  Ja-Eung Koo ,  Se-Jong Park

IPC分类号： H01L23/48

CPC分类号： H01L23/5226 ,  H01L21/76808 ,  H01L21/76829 ,  H01L21/76831 ,  H01L21/76843 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： An interconnection structure and a method of fabricating the same are provided. The interconnection structure includes an interlayer insulating layer having a structure comprising a via hole structure or a trench-shaped line structure. A conformal metal diffusion barrier layer is disposed inside the via hole structure or the trench-shaped line structure of the interlayer insulating layer. An insulating diffusion barrier spacer is disposed to cover the metal diffusion barrier layer on the sidewalls of the via hole structure or the trench-shaped line structure of the interlayer insulating layer. In addition, a copper interconnection is disposed to fill the inside of the via hole structure or the trench-shaped line structure of the interlayer insulating layer.

摘要翻译： 提供互连结构及其制造方法。 互连结构包括具有包括通孔结构或沟槽状线结构的结构的层间绝缘层。 保形金属扩散阻挡层设置在层间绝缘层的通孔结构或沟槽状线结构的内部。 设置绝缘扩散阻挡间隔物以覆盖通孔结构的侧壁上的金属扩散阻挡层或层间绝缘层的沟槽状线结构。 此外，布置铜互连以填充层间绝缘层的通孔结构或沟槽状线结构的内部。

公开(公告)号：US07348277B2

公开(公告)日：2008-03-25

申请号：US11352640

申请日：2006-02-13

申请人： Ja-Eung Koo ,  Byung-Lyul Park

发明人： Ja-Eung Koo ,  Byung-Lyul Park

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/7688 ,  H01L21/76819

摘要： There are provided methods of fabricating a semiconductor device using a sacrificial layer. The methods provide an approach to maintaining thickness distribution of the interlayer insulating layers below a sacrificial layer uniform on an overall surface of a semiconductor substrate during performing a chemical mechanical polishing (CMP) process in a damascene process. To this end, the method includes forming a pad layer, a pad interlayer insulating layer, an etch stop layer pattern, a planarized interlayer insulating layer and a sacrificial layer sequentially on a semiconductor substrate. At least one trench is formed in the sacrificial layer and the planarized interlayer insulating layer. A via contact hole is formed in the etch stop layer pattern, the pad interlayer insulating layer, and the pad layer to be disposed below the trench. A diffusion barrier layer and a conductive layer are sequentially formed to fill the trench and the via contact hole. A CMP process is performed on the conductive layer, the diffusion barrier layer, and the sacrificial layer.

摘要翻译： 提供了使用牺牲层制造半导体器件的方法。 这些方法提供了一种在大理石工艺中进行化学机械抛光（CMP）工艺期间，在半导体衬底的整个表面上均匀地保持牺牲层的厚度分布的方法。 为此，该方法包括在半导体衬底上依次形成焊盘层，焊盘层间绝缘层，蚀刻停止层图案，平坦化的层间绝缘层和牺牲层。 在牺牲层和平坦化层间绝缘层中形成至少一个沟槽。 在蚀刻停止层图案，焊盘层间绝缘层和焊盘层中形成通孔接触孔，以设置在沟槽下方。 依次形成扩散阻挡层和导电层以填充沟槽和通孔接触孔。 在导电层，扩散阻挡层和牺牲层上执行CMP工艺。

公开(公告)号：US20060183333A1

公开(公告)日：2006-08-17

申请号：US11352640

申请日：2006-02-13

申请人： Ja-Eung Koo ,  Byung-Lyul Park

发明人： Ja-Eung Koo ,  Byung-Lyul Park

IPC分类号： H01L21/461 ,  C23F1/00 ,  B44C1/22

CPC分类号： H01L21/7688 ,  H01L21/76819

摘要： There are provided methods of fabricating a semiconductor device using a sacrificial layer. The methods provide an approach to maintaining thickness distribution of the interlayer insulating layers below a sacrificial layer uniform on an overall surface of a semiconductor substrate during performing a chemical mechanical polishing (CMP) process in a damascene process. To this end, the method includes forming a pad layer, a pad interlayer insulating layer, an etch stop layer pattern, a planarized interlayer insulating layer and a sacrificial layer sequentially on a semiconductor substrate. At least one trench is formed in the sacrificial layer and the planarized interlayer insulating layer. A via contact hole is formed in the etch stop layer pattern, the pad interlayer insulating layer, and the pad layer to be disposed below the trench. A diffusion barrier layer and a conductive layer are sequentially formed to fill the trench and the via contact hole. A CMP process is performed on the conductive layer, the diffusion barrier layer, and the sacrificial layer.

摘要翻译： 提供了使用牺牲层制造半导体器件的方法。 这些方法提供了一种在大理石过程中执行化学机械抛光（CMP）工艺期间，在半导体衬底的整个表面上均匀地保持牺牲层的厚度分布的方法。 为此，该方法包括在半导体衬底上依次形成焊盘层，焊盘层间绝缘层，蚀刻停止层图案，平坦化的层间绝缘层和牺牲层。 在牺牲层和平坦化层间绝缘层中形成至少一个沟槽。 在蚀刻停止层图案，焊盘层间绝缘层和焊盘层中形成通孔接触孔，以设置在沟槽下方。 依次形成扩散阻挡层和导电层以填充沟槽和通孔接触孔。 在导电层，扩散阻挡层和牺牲层上执行CMP工艺。

公开(公告)号：US06976902B2

公开(公告)日：2005-12-20

申请号：US10850688

申请日：2004-05-21

申请人： Ja-Eung Koo ,  Jong-Won Lee ,  Sung-Bae Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son

发明人： Ja-Eung Koo ,  Jong-Won Lee ,  Sung-Bae Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son

IPC分类号： B24B37/02 ,  B24B37/04 ,  B24B49/10 ,  B24B49/14 ,  B24B1/00

CPC分类号： B24B37/013 ,  B24B49/10 ,  B24B49/14

摘要： There is provided a chemical mechanical polishing apparatus, which may include a polishing table rotated by a polishing table motor and having a pad thereon, a carrier head located above the polishing table to be rotatable by the driving of a carrier head motor and having a wafer located under the bottom thereof, a slurry supplier for supplying a slurry to the upper portion of the polishing table, a first polishing end point detector for detecting a polishing end point through the temperature change of the temperature sensor, at least one temperature sensor for detecting the temperature of a polishing region (the wafer, the pad, and the slurry), and a second polishing end point detector for detecting a polishing end point from the changes of load current, voltage, and resistance of the carrier head motor. Further, instead of the second polishing end point detector, an optical signal polishing end point detector may be employed, for detecting the polishing end point by the light illuminated on the wafer and reflected from the wafer.

摘要翻译： 提供了一种化学机械抛光装置，其可以包括由抛光台马达旋转并且具有垫的抛光台，位于抛光台上方的载体头可以通过载体头马达的驱动旋转并具有晶片 位于其底部的浆料供应器，用于向抛光台的上部供应浆料;第一抛光终点检测器，用于通过温度传感器的温度变化检测抛光终点;至少一个检测温度传感器 抛光区域（晶片，焊盘和浆料）的温度，以及用于从承载头电动机的负载电流，电压和电阻的变化检测抛光终点的第二抛光终点检测器。 此外，代替第二研磨终点检测器，可以采用光信号抛光终点检测器，用于通过照射在晶片上的光并从晶片反射来检测抛光终点。