公开(公告)号：US11543461B2

公开(公告)日：2023-01-03

申请号：US16744892

申请日：2020-01-16

Applicant: Infineon Technologies AG

Inventor： Andreas Berger ,  Klaus Hoermaier ,  Guenter Hofer ,  Stefano Marsili ,  Akshay Misra ,  Matthias Rose ,  Christian Winkler

IPC: G01R31/396 ,  H03M1/12 ,  G01R31/3842 ,  G01R31/389 ,  G01R31/392

Abstract: A method for measuring a complex impedance of a plurality of battery cells in a battery pack comprises controlling an excitation current through the plurality of battery cells in the battery pack; receiving, in a single common measurement circuit, a plurality of voltage signals corresponding to the plurality of battery cells; measuring the excitation current; and calculating a complex impedance of each of the battery cells in the plurality of battery cells based on the plurality of voltage signals and the measured excitation current in a single measurement cycle using either one analog-to-digital converter (ADC) per battery cell or two matched ADCs per battery cell.

公开(公告)号：US10649010B2

公开(公告)日：2020-05-12

申请号：US15385694

申请日：2016-12-20

Applicant: Infineon Technologies AG

Inventor： Wolfgang Raberg ,  Goran Keser ,  Matthias Rose ,  Rainer Markus Schaller

IPC: G01R15/20 ,  G01R17/10 ,  H01L21/00

Abstract: Methods and devices related to current sensing are provided. Magnetoresistive sensor elements are provided on opposite sides of a conductor.

公开(公告)号：US20230054812A1

公开(公告)日：2023-02-23

申请号：US17875929

申请日：2022-07-28

Applicant: Infineon Technologies AG

Inventor： Ajay Poonjal Pai ,  Tao Hong ,  Adrian Lis ,  Oliver Markus Kreiter ,  Matthias Rose

IPC: H01L23/49 ,  H01L23/31 ,  H01R12/58 ,  H01L21/48 ,  H01L21/56

Abstract: A power semiconductor module includes: first and second substrates; at least one power semiconductor die arranged between and thermally coupled to a first side of each substrate, and electrically coupled to the first side of the first substrate; at least one rivet having a first end arranged on and electrically coupled to the first side of the first substrate; and an encapsulant encapsulating the at least one power semiconductor die, the at least one rivet and the substrates. At least parts of a second side of the substrates are exposed from the encapsulant. A second end of the at least one rivet is exposed at the encapsulant and configured to accept a press fit pin such that the at least one power semiconductor die can be electrically contacted from the outside.

公开(公告)号：US20210223327A1

公开(公告)日：2021-07-22

申请号：US16744892

申请日：2020-01-16

Applicant: Infineon Technologies AG

Inventor： Andreas Berger ,  Klaus Hoermaier ,  Guenter Hofer ,  Stefano Marsili ,  Akshay Misra ,  Matthias Rose ,  Christian Winkler

IPC: G01R31/396 ,  H03M1/12 ,  G01R31/389 ,  G01R31/3842 ,  G01R31/392

Abstract: A method for measuring a complex impedance of a plurality of battery cells in a battery pack comprises controlling an excitation current through the plurality of battery cells in the battery pack; receiving, in a single common measurement circuit, a plurality of voltage signals corresponding to the plurality of battery cells; measuring the excitation current; and calculating a complex impedance of each of the battery cells in the plurality of battery cells based on the plurality of voltage signals and the measured excitation current in a single measurement cycle using either one analog-to-digital converter (ADC) per battery cell or two matched ADCs per battery cell.

公开(公告)号：US10107867B2

公开(公告)日：2018-10-23

申请号：US14631443

申请日：2015-02-25

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Franz Michael Darrer ,  Thomas Mueller ,  Mathias Vaupel ,  Manfred Fries ,  Guenther Ruhl ,  Horst Theuss ,  Matthias Rose ,  Stephan Auer ,  Tue Fatt David Wee ,  Sie Boo Chiang

IPC: H01M10/48 ,  G01R31/36 ,  H01M10/42 ,  H04Q9/00 ,  H01M10/0525

Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.

公开(公告)号：US20180172739A1

公开(公告)日：2018-06-21

申请号：US15385694

申请日：2016-12-20

Applicant: Infineon Technologies AG

Inventor： Wolfgang Raberg ,  Goran Keser ,  Matthias Rose ,  Rainer Markus Schaller

IPC: G01R15/20 ,  G01R17/10 ,  G01R19/00

CPC classification number: G01R15/205 ,  G01R17/10

Abstract: Methods and devices related to current sensing are provided. Magnetoresistive sensor elements are provided on opposite sides of a conductor.

公开(公告)号：US20150226810A1

公开(公告)日：2015-08-13

申请号：US14631443

申请日：2015-02-25

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Franz Michael Darrer ,  Thomas Mueller ,  Mathias Vaupel ,  Manfred Fries ,  Guenther Ruhl ,  Horst Theuss ,  Matthias Rose ,  Stephan Auer ,  Tue Fatt David Wee ,  Sie Boo Chiang

IPC: G01R31/36 ,  H01M10/42 ,  H01M10/48

CPC classification number: G01R31/3658 ,  H01M10/0525 ,  H01M10/4257 ,  H01M10/48 ,  H01M10/486 ,  H01M2010/4271 ,  H04Q9/00 ,  H04Q2209/40 ,  H04Q2209/823

Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.

Abstract translation: 根据实施例的传感器装置包括基板，以及安装在基板上的至少一个传感器和控制电路，其中至少一个传感器和控制电路位于基板上，以可安装在电池单元内部， 电池单元。