公开(公告)号：US20240079530A1

公开(公告)日：2024-03-07

申请号：US17903126

申请日：2022-09-06

Applicant: Intel Corporation

Inventor： Jacob VEHONSKY ,  Onur OZKAN ,  Vinith BEJUGAM ,  Mao-Feng TSENG ,  Nicholas HAEHN ,  Andrea NICOLAS FLORES ,  Ali LEHAF ,  Benjamin DUONG ,  Joshua STACEY

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/005 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: Embodiments of an integrated circuit (IC) package are disclosed. In some embodiments, the IC package includes a semiconductor die, a glass substrate, and a package substrate. The semiconductor die includes a micro light emitting diode (LED). The semiconductor die is at least partially embedded within the glass substrate and the glass substrate including a through glass via (TGV) embedded in the glass substrate wherein the TGV is electrically coupled to the semiconductor die to provide power to the micro LED. The package substrate that is coupled to the TGV.

公开(公告)号：US20240215163A1

公开(公告)日：2024-06-27

申请号：US18089489

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Onur OZKAN ,  Jacob VEHONSKY ,  Vinith BEJUGAM ,  Nicholas S. HAEHN ,  Andrea NICOLAS FLORES ,  Mao-Feng TSENG

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/112 ,  H05K1/0306 ,  H05K1/183 ,  H01L23/49838

Abstract: Embodiments disclosed herein include a package core. In an embodiment, the package core comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, the substrate comprise glass. In an embodiment, a via is provided through the substrate, where the via is electrically conductive. In an embodiment, a recess is formed into the first surface of the substrate, and a trace is embedded in the recess. In an embodiment, the trace is electrically conductive.