公开(公告)号：US20180324955A1

公开(公告)日：2018-11-08

申请号：US15777893

申请日：2015-12-23

Applicant: Intel Corporation

Inventor： Mohit SOOD ,  Huili XU ,  Wei TAN ,  Suriyakala RAMALINGAM ,  Jan KRAJNIAK ,  Nish ANANTHAKRISHNAN

IPC: H05K3/34 ,  H01L23/498 ,  H05K3/40 ,  H05K3/12 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K3/3436 ,  H01L23/12 ,  H01L23/48 ,  H01L23/49816 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/81024 ,  H01L2924/15311 ,  H05K1/111 ,  H05K1/181 ,  H05K3/1283 ,  H05K3/3494 ,  H05K3/4007 ,  H05K2201/10159 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/166 ,  Y02P70/613

Abstract: An apparatus is described. The apparatus includes a first planar board to second planar board interface. The first planar board to second planar board interface includes a reflowed solder electrical connection structure between the first and second boards and a no flow adhesive. The reflowed solder electrical connection structure includes a reflowed solder ball and a reflowed tinned pad.