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    IMPROVING MECHANICAL AND THERMAL RELIABILITY IN VARYING FORM FACTORS
    2.
    发明申请
    IMPROVING MECHANICAL AND THERMAL RELIABILITY IN VARYING FORM FACTORS 审中-公开

    公开(公告)号：US20190312001A1

    公开(公告)日：2019-10-10

    申请号：US16464930

    申请日：2016-12-30

    Applicant: Intel Corporation

    Inventor： Veronica A. Strong ,  Sasha N. Oster ,  Shawna M. Liff

    IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065

    Abstract: A system for packaging integrated circuits includes an integrated circuit having one or more integrated circuit terminals. The system for packaging integrated circuits also includes a substrate having one or more substrate terminals. The system for packaging integrated circuits further includes an electrically conductive adhesive in communication with the integrated circuit terminals and the substrate terminals. The electrically conductive adhesive establishes an electrical connection between each of the one or more integrated circuit terminals and the one or more substrate terminals. The electrical connection between each of the one or more integrated circuit terminals and the one or more substrate terminals are enclosed in a dielectric. The system for packaging integrated circuits includes a second adhesive in communication with the integrated circuit and the substrate, wherein the second adhesive couples the integrated circuit and substrate together.

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