公开(公告)号：US20040130434A1

公开(公告)日：2004-07-08

申请号：US10336992

申请日：2003-01-06

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Anil K. Chinthakindi ,  Shwu-Jen Jeng ,  Michael F. Lofaro ,  Christopher M. Schnabel ,  Kenneth J. Stein

IPC分类号： H01C001/012

CPC分类号： H01L28/20 ,  H01L23/5223 ,  H01L27/0802 ,  H01L27/0805 ,  H01L28/40 ,  H01L2924/0002 ,  Y10S438/97 ,  Y10T29/49082 ,  Y10T29/49155 ,  H01L2924/00

摘要： A method is disclosed of fabricating a MIMCAP (a capacitor (CAP) formed by successive layers of metal, insulator, metal (MIM)) and a thin film resistor at the same level. A method is also disclosed of fabricating a MIMCAP and a thin film resistor at the same level, and a novel integration scheme for BEOL (back-end-of-line processing) thin film resistors which positions them closer to FEOL (front-end-of-line processing) devices.

摘要翻译： 公开了制造MIMCAP（由金属，绝缘体，金属（MIM）的连续层形成的电容器（CAP））和同一水平的薄膜电阻器的方法。 还公开了制造相同水平的MIMCAP和薄膜电阻器的方法，以及用于BEOL（后端处理）薄膜电阻器的新颖的集成方案，使它们更接近FEOL（前端 - 线上处理）设备。

公开(公告)号：US20040113279A1

公开(公告)日：2004-06-17

申请号：US10319967

申请日：2002-12-16

申请人： International Business Machines Corporation

发明人： Shyng-Tsong Chen ,  Timothy J. Dalton ,  Kenneth M. Davis ,  Chao-Kun Hu ,  Fen F. Jamin ,  Steffen K. Kaldor ,  Mahadevaiyer Krishnan ,  Kaushik Kumar ,  Michael F. Lofaro ,  Sandra G. Malhotra ,  Chandrasekhar Narayan ,  David L. Rath ,  Judith M. Rubino ,  Katherine L. Saenger ,  Andrew H. Simon ,  Sean P.E. Smith ,  Wei-tsu Tseng

IPC分类号： H01L023/48 ,  H01L023/52 ,  H01L021/4763

CPC分类号： H01L21/76849 ,  H01L21/76834 ,  H01L21/76847 ,  H01L21/76883 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit structure is disclosed that has a layer of logical and functional devices and an interconnection layer above the layer of logical and functional devices. The interconnection layer has a substrate, conductive features within the substrate and caps positioned only above the conductive features.

摘要翻译： 公开了一种集成电路结构，其具有逻辑和功能器件层以及逻辑和功能器件层之上的互连层。 互连层具有衬底，衬底内的导电特征和仅位于导电特征之上的盖。

公开(公告)号：US20020096191A1

公开(公告)日：2002-07-25

申请号：US09768833

申请日：2001-01-24

申请人： International Business Machines Corporation

发明人： Michael F. Lofaro ,  Marc Mattaroccia ,  Leonard C. Stevens JR.

IPC分类号： B08B007/04 ,  B08B001/04

CPC分类号： H01L21/67046 ,  B08B1/04

摘要： A semiconductor wafer is cleaned while a sponge or brush is pressed against the wafer with a constant forced applied utilizing a bias in a constant force pencil. The wafer is cleaned in the state wherein a collapsing portion of the constant force pencil with respect to the cleaning sponge cloth is set in such a way that the cleaning pressure, which is applied from the cleaning sponge to the wafer, can be constant and is adjustable. A method for cleaning wafers using a constant force pencil is also described.

摘要翻译： 清洁半导体晶片，同时用恒定力量的铅笔将偏压用恒定的强制施加的方式将海绵或刷子压在晶片上。 在将恒定力量铅笔相对于清洁用海绵布的塌陷部分设定为使得从清洁海绵向晶片施加的清洁压力可以恒定并且为 可调。 还描述了使用恒力铅笔清洁晶片的方法。