公开(公告)号：US10812900B2

公开(公告)日：2020-10-20

申请号：US14293502

申请日：2014-06-02

Applicant: INVENSENSE, INC.

Inventor： Aleksey S. Khenkin ,  Fariborz Assaderaghi ,  Peter Cornelius

IPC: H04R3/00 ,  H04R17/02 ,  H04R9/06 ,  H04R19/04 ,  H04R19/00

Abstract: Smart sensors comprising one or more microelectromechanical systems (MEMS) sensors and a digital signal processor (DSP) in a sensor package are described. An exemplary smart sensor can comprise a MEMS acoustic sensor or microphone and a DSP housed in a package or enclosure comprising a substrate and a lid and a package substrate that defines a back cavity for the MEMS acoustic sensor or microphone. Provided implementations can also comprise a MEMS motion sensor housed in the package or enclosure. Embodiments of the subject disclosure can provide improved power management and battery life from a single charge by intelligently responding to trigger events or wake events while also providing an always on sensor that persistently detects the trigger events or wake events. In addition, various physical configurations of smart sensors and MEMS sensor or microphone packages are described.

公开(公告)号：US20190052944A1

公开(公告)日：2019-02-14

申请号：US16164922

申请日：2018-10-19

Applicant: INVENSENSE, INC.

Inventor： Anthony D. Minervini ,  Kieran Harney ,  Aleksey S. Khenkin ,  Baris Cagdaser

IPC: H04R1/02 ,  H04R19/04 ,  H04R19/00 ,  B81B7/00 ,  G01K13/00

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

公开(公告)号：US10031877B2

公开(公告)日：2018-07-24

申请号：US14622439

申请日：2015-02-13

Applicant: INVENSENSE, INC.

Inventor： Jerad M. Lewis ,  Kieran P. Harney ,  Aleksey S. Khenkin

IPC: H05K7/10 ,  G06F13/40 ,  G06F13/42 ,  G06F1/10

Abstract: Including control data in a serial audio stream is presented herein. A device can include a clock component that is configured to send, via a clock pin of the device, a bit clock signal directed to a slave device. A frame component can send, via a frame pin of the device, a frame clock signal directed to the slave device. A control component can receive, via a data pin of the device during a first portion of a phase of a period of the frame clock signal, slave data from the slave device on a bit-by-bit basis based on the bit clock signal according to an integrated interchip sound (I2S) based protocol; and send, via the data pin during a second portion of the phase after the first portion, a set of control bits directed to the slave device on the bit-by-bit basis based on the bit clock signal.

公开(公告)号：US20170190571A1

公开(公告)日：2017-07-06

申请号：US15468066

申请日：2017-03-23

Applicant: INVENSENSE, Inc.

Inventor： Julius Ming-Lin Tsai ,  Baris Cagdaser ,  Martin Lim ,  Aleksey S. Khenkin

IPC: B81B7/02 ,  H04R1/04 ,  H04R29/00 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

公开(公告)号：US09510106B2

公开(公告)日：2016-11-29

申请号：US14244149

申请日：2014-04-03

Applicant: INVENSENSE, INC.

Inventor： Aleksey S. Khenkin ,  Anthony D. Minervini

IPC: H04R19/00

CPC classification number: H04R19/005 ,  H01L2224/16145 ,  H01L2224/48465 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R2201/003

Abstract: Microelectromechanical systems (MEMS) microphones associated with a tunable back cavity are described. Provided implementations can comprise a MEMS acoustic sensor element associated with a first back cavity, which first back cavity can be separated and/or acoustically coupled by a tuning port to a second back cavity. In addition, various physical and acoustic filtering configurations of MEMS microphones and tunable back cavities are described.

Abstract translation: 描述了与可调谐后腔相关联的微机电系统（MEMS）麦克风。 所提供的实现可以包括与第一后腔相关联的MEMS声学传感器元件，第一后腔可以通过调谐端口分隔和/或声学耦合到第二后腔。 此外，描述了MEMS麦克风和可调谐后腔的各种物理和声学滤波配置。

公开(公告)号：US20160165355A1

公开(公告)日：2016-06-09

申请号：US14561843

申请日：2014-12-05

Applicant: INVENSENSE, INC.

Inventor： Aleksey S. Khenkin ,  Mike Daneman

IPC: H04R19/01 ,  H04R31/00

CPC classification number: H04R19/016 ,  B81B3/00 ,  H04R31/003 ,  H04R2201/003

Abstract: Microelectromechanical systems (MEMS) electret acoustic sensors or microphones, devices, systems, and methods are described. Exemplary embodiments employ electret comprising an inorganic dielectric material such as silicon nitride in MEMS electret acoustic sensors or microphones. Provided implementations include variations in electret acoustic sensor or microphone configuration and recharging of the electret.

Abstract translation: 描述了微机电系统（MEMS）驻极体声传感器或麦克风，装置，系统和方法。 示例性实施例使用驻极体，其包括MEMS驻极体声传感器或麦克风中的无机介电材料，例如氮化硅。 所提供的实施方式包括驻极体声传感器或麦克风配置的变化以及驻极体的再充电。

公开(公告)号：US20160165330A1

公开(公告)日：2016-06-09

申请号：US14856262

申请日：2015-09-16

Applicant: INVENSENSE, INC.

Inventor： Anthony D. Minervini ,  Kieran Harney ,  Aleksey S. Khenkin ,  Baris Cagdaser

IPC: H04R1/02 ,  H04R19/04 ,  G01K13/00 ,  H04R19/00

CPC classification number: H04R1/028 ,  B81B7/0087 ,  B81B2201/0257 ,  B81B2201/0278 ,  B81B2207/012 ,  G01K13/00 ,  H04R19/005 ,  H04R19/04 ,  H04R2231/00

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Abstract translation: 各种实施例提供了一种集成温度传感器和麦克风封装，其中温度传感器位于与麦克风相关联的声学端口中，上方或附近。 温度传感器靠近声学端口的放置使得温度传感器能够更准确地确定环境空气温度并减少与集成电路相关联的热引起的热岛干扰。 在一个实施例中，温度传感器可以是形成在衬底上的热电偶，热电偶的温度感测部分形成在声学端口上。 在另一个实施例中，温度传感器可以形成在延伸到声学端口中或上方的专用集成电路上。 在另一个实施例中，衬底中的导热通道可以放置在声学端口附近，以使得温度传感器能够经由通道确定环境温度。

公开(公告)号：US20160050475A1

公开(公告)日：2016-02-18

申请号：US14461643

申请日：2014-08-18

Applicant: INVENSENSE, INC.

Inventor： Aleksey S. Khenkin ,  Anthony D. Minervini ,  Kieran P. Harney

IPC: H04R1/08

CPC classification number: H04R1/08 ,  H04R19/00 ,  H04R2201/003

Abstract: A microelectromechanical systems (MEMS) device optimized for flip-chip assembly and method of attaching the same are presented herein. A device can include a substrate, an acoustic seal, and a MEMS device mechanically attached to the substrate utilizing bond pad(s) that electrically couple the MEMS device to the substrate and/or an application-specific integrated circuit (ASIC). A portion of the MEMS device includes an acoustic area, an acoustic seal area that surrounds the acoustic area and includes the acoustic seal, and electrical interconnect area(s) that are located outside of the acoustic seal area and include the bond pad(s). The acoustic seal can be compressed between the acoustic seal area and the substrate and/or the ASIC, and include a thixotropic adhesive material. Mechanical support(s) that define a gap between the MEMS device and the substrate and/or the ASIC can be attached to the acoustic seal area and/or the substrate.

Abstract translation: 本文给出了针对倒装芯片组装优化的微机电系统（MEMS）装置及其附接方法。 器件可以包括使用将MEMS器件电耦合到衬底和/或专用集成电路（ASIC）的接合焊盘机械连接到衬底的衬底，声学密封件和MEMS器件。 MEMS器件的一部分包括声学区域，围绕声学区域并包括声学密封的声学密封区域以及位于声学密封区域外部并且包括接合焊盘的电气互连区域， 。 声学密封件可以在声学密封区域和基底和/或ASIC之间被压缩，并且包括触变粘合剂材料。 限定MEMS器件与衬底和/或ASIC之间的间隙的机械支撑件可附接到声学密封区域和/或衬底。

公开(公告)号：US09226052B2

公开(公告)日：2015-12-29

申请号：US13746488

申请日：2013-01-22

Applicant: Invensense, Inc.

Inventor： Aleksey S. Khenkin ,  Vikram Venkatadri ,  David Bolognia

IPC: H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R19/04 ,  H04R21/02 ,  H04R1/00 ,  H04R1/04 ,  H04R1/08

CPC classification number: H04R1/326 ,  H01L2224/48091 ,  H04R1/00 ,  H04R1/04 ,  H04R1/083 ,  H04R9/08 ,  H04R11/04 ,  H04R17/02 ,  H04R21/02 ,  H04R2201/003 ,  H01L2924/00014

Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.

Abstract translation: 麦克风系统具有与基座结合以形成具有内部腔室的包装的盖子。 封装具有顶部，底部和多个侧面，并且这些侧面中的至少一个具有形成用于接收声学信号的开口的基本平坦的表面的部分。 麦克风系统还具有位于内部腔室内的麦克风管芯。 麦克风相对于至少一侧的开口位于非正交非零角度。

公开(公告)号：US10911850B2

公开(公告)日：2021-02-02

申请号：US16164922

申请日：2018-10-19

Applicant: INVENSENSE, INC.

Inventor： Anthony D. Minervini ,  Kieran Harney ,  Aleksey S. Khenkin ,  Baris Cagdaser

IPC: G01K13/00 ,  H04R1/02 ,  B81B7/00 ,  H04R19/00 ,  H04R19/04

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.