公开(公告)号：US20160276294A1

公开(公告)日：2016-09-22

申请号：US15165837

申请日：2016-05-26

Applicant: Invensas Corporation

Inventor： Rajesh KATKAR ,  Laura Wills MIRKARIMI ,  Arkalgud SITARAM ,  Charles G. WOYCHIK

IPC: H01L23/00 ,  H01L21/66 ,  H01L23/367 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

公开(公告)号：US20150262972A1

公开(公告)日：2015-09-17

申请号：US14288064

申请日：2014-05-27

Applicant: Invensas Corporation

Inventor： Rajesh KATKAR ,  Laura Wills MIRKARIMI ,  Arkalgud SITARAM ,  Charles G. WOYCHIK

IPC: H01L25/065 ,  H01L21/66 ,  H01L23/31 ,  H01L23/04 ,  H01L21/78 ,  H01L23/367 ,  H01L23/00

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/78 ,  H01L21/784 ,  H01L22/32 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16176 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/164 ,  H01L2924/167 ,  H01L2924/16788 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.

Abstract translation: 包含集成电路并附接到布线基板（120）的模块（110,1310）的组件由附接到布线基板的一个或多个加强框架（410）加强。 模块位于加强框架中的开口（例如空腔和/或通孔414）中。 还提供其他功能。