摘要:
An integrated circuit having an enhanced on-off swing for pass gate transistors is provided. The integrated circuit includes a core region that includes core transistors and pass gate transistors. The core transistors have a gate oxide associated with a first thickness, the pass transistors having a gate oxide associated with a thickness that is less than the first thickness. In one embodiment, the material used for the gate oxide of the pass gate transistors has a dielectric constant that is greater than four, while the material used for the gate oxide of the core transistors has a dielectric constant that is less than or equal to four. A method for manufacturing an integrated circuit is also provided.
摘要:
A configuration memory cell (“CRAM”) for a field programmable gate array (“FPGA”) integrated circuit (“IC”) device is given increased resistance to single event upset (“SEU”). A portion of the gate structure of the input node of the CRAM is increased in size relative to the nominal size of the remainder of the gate structure. Part of the enlarged gate structure is located capacitively adjacent to an N-well region of the IC, and another part is located capacitively adjacent to a P-well region of the IC. This arrangement gives the input node increased capacitance to resist SEU, regardless of the logical level of the input node. The invention is also applicable to any node of any type of memory cell for which increased resistance to SEU is desired.
摘要:
Apparatus and methods are disclosed for improving the performance of a programmable logic device (PLD). A PLD includes a memory cell configured to provide a pair of voltages to a gate of a pass transistor and a body of the pass transistor, respectively.
摘要:
A configuration memory cell (“CRAM”) for a field programmable gate array (“FPGA”) integrated circuit (“IC”) device is given increased resistance to single event upset (“SEU”). A portion of the gate structure of the input node of the CRAM is increased in size relative to the nominal size of the remainder of the gate structure. Part of the enlarged gate structure is located capacitively adjacent to an N-well region of the IC, and another part is located capacitively adjacent to a P-well region of the IC. This arrangement gives the input node increased capacitance to resist SEU, regardless of the logical level of the input node. The invention is also applicable to any node of any type of memory cell for which increased resistance to SEU is desired.
摘要:
An integrated circuit having an enhanced on-off swing for pass gate transistors is provided. The integrated circuit includes a core region that includes core transistors and pass gate transistors. The core transistors have a gate oxide associated with a first thickness, the pass transistors having a gate oxide associated with a thickness that is less than the first thickness. In one embodiment, the material used for the gate oxide of the pass gate transistors has a dielectric constant that is greater than four, while the material used for the gate oxide of the core transistors has a dielectric constant that is less than or equal to four. A method for manufacturing an integrated circuit is also provided.
摘要:
A configuration memory cell (“CRAM”) for a field programmable gate array (“FPGA”) integrated circuit (“IC”) device is given increased resistance to single event upset (“SEU”). A portion of the gate structure of the input node of the CRAM is increased in size relative to the nominal size of the remainder of the gate structure. Part of the enlarged gate structure is located capacitively adjacent to an N-well region of the IC, and another part is located capacitively adjacent to a P-well region of the IC. This arrangement gives the input node increased capacitance to resist SEU, regardless of the logical level of the input node. The invention is also applicable to any node of any type of memory cell for which increased resistance to SEU is desired.
摘要:
Adaptive regulated power supply voltages are applied to programmable logic integrated circuits. Control circuitry in a programmable logic IC generates control signals that are transmitted to an external voltage regulator. The voltage regulator generates one or more power supply voltages in response to the control signals. The values of control signals determine the target values of the supply voltages. The control circuitry can adapt the power supply voltages to compensate for temperature and process variations on the IC. The power supply voltages can be programmed by a manufacturer or by a user to achieve desired target values. The control circuitry can also put a programmable logic IC into a sleep mode by dropping the high supply voltage to a low value to reduce power consumption during periods of low usage.
摘要:
The present invention is a trigger device useful, for example, in triggering an SCR in an ESD protection circuit. Illustratively, an NMOS trigger device comprises a gate and heavily doped P and N regions in a P-well on opposite sides of the gate. A first N type source/drain extension and a first P-type pocket region extend from the P region toward the N region with the pocket region located under the source/drain extension and extending under the gate. A second N-type source/drain extension and a second P-type pocket region extend from the N region toward the P region with the pocket region located under the source/drain extension and extending under the gate. Preferably, the gate itself is heavily doped so that one half of the gate on the side adjacent the heavily doped P region is also heavily doped with dopants of P-type conductivity and the other half of the gate on the side adjacent the heavily doped N region is also heavily doped with dopants of N-type conductivity. Doping the gate increases the threshold voltage by about one Volt due to an increase in the work function on the source side of the gate.
摘要:
The present invention is a trigger device useful, for example, in triggering an SCR in an ESD protection circuit. Illustratively, an NMOS trigger device comprises a gate and heavily doped P and N regions in a P-well on opposite sides of the gate. A first N type source/drain extension and a first P-type pocket region extend from the P region toward the N region with the pocket region located under the source/drain extension and extending under the gate. A second N-type source/drain extension and a second P-type pocket region extend from the N region toward the P region with the pocket region located under the source/drain extension and extending under the gate. Preferably, the gate itself is heavily doped so that one half of the gate on the side adjacent the heavily doped P region is also heavily doped with dopants of P-type conductivity and the other half of the gate on the side adjacent the heavily doped N region is also heavily doped with dopants of N-type conductivity. Doping the gate increases the threshold voltage by about one Volt due to an increase in the work function on the source side of the gate.
摘要:
A configuration memory cell (“CRAM”) for a field programmable gate array (“FPGA”) integrated circuit (“IC”) device is given increased resistance to single event upset (“SEU”). A portion of the gate structure of the input node of the CRAM is increased in size relative to the nominal size of the remainder of the gate structure. Part of the enlarged gate structure is located capacitively adjacent to an N-well region of the IC, and another part is located capacitively adjacent to a P-well region of the IC. This arrangement gives the input node increased capacitance to resist SEU, regardless of the logical level of the input node. The invention is also applicable to any node of any type of memory cell for which increased resistance to SEU is desired.