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公开(公告)号:US09577488B2
公开(公告)日:2017-02-21
申请号:US14001922
申请日:2011-05-20
CPC分类号: H02K5/225 , H02K7/116 , H02K7/1166 , H02K11/30 , H02K11/33
摘要: ProblemTo obtain a drive unit integrated rotating electrical machine that makes it easier to connect power circuits and achieves not only excellent vibration resistance but also excellent heat releasing properties.Means for SolutionA drive unit integrated rotating electrical machine has a motor, a drive unit driving the motor under control and provided with power switching elements and conductors passing a current to the power switching elements, and a heat sink cooling the drive unit, which are combined into one unit. The drive unit integrated rotating electrical machine is characterized in that: the power switching elements are molded and formed into mold modules in a state in which terminals thereof are exposed; the conductors are insert-molded in a frame in a state in which terminals thereof are exposed; and the exposed terminals of the mold modules are connected to the exposed terminals of the insert-molded conductors and the mold modules are firmly fixed to the heat sink.
摘要翻译: 驱动单元集成旋转电机具有电机,驱动单元驱动电动机控制并设置有电力开关元件和将电流传递到电力开关元件的导体以及冷却驱动单元的散热器,其组合成一个 单元。 驱动单元集成旋转电机的特征在于:功率开关元件在其端子被暴露的状态下模制并形成模具模块; 导体在其端子露出的状态下嵌入成型在框架中; 并且模块模块的裸露端子连接到嵌入成型导体的裸露端子,并且模块模块牢固地固定到散热器。
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公开(公告)号:US20130334906A1
公开(公告)日:2013-12-19
申请号:US14001922
申请日:2011-05-20
CPC分类号: H02K5/225 , H02K7/116 , H02K7/1166 , H02K11/30 , H02K11/33
摘要: To obtain a drive unit integrated rotating electrical machine that makes it easier to connect power circuits and achieves not only excellent vibration resistance but also excellent heat releasing properties.Means for SolutionA drive unit integrated rotating electrical machine has a motor, a drive unit driving the motor under control and provided with power switching elements and conductors passing a current to the power switching elements, and a heat sink cooling the drive unit, which are combined into one unit. The drive unit integrated rotating electrical machine is characterized in that: the power switching elements are molded and formed into mold modules in a state in which terminals thereof are exposed; the conductors are insert-molded in a frame in a state in which terminals thereof are exposed; and the exposed terminals of the mold modules are connected to the exposed terminals of the insert-molded conductors and the mold modules are firmly fixed to the heat sink.
摘要翻译: 为了获得驱动单元集成旋转电机,能够更容易地连接电源电路,不仅具有优异的耐振动性,而且具有优异的散热特性。 解决方案的方案驱动单元集成旋转电机具有电动机,驱动单元驱动电动机控制并且设置有电力开关元件和将电流传递到电力开关元件的导体以及冷却驱动单元的散热器 组合成一个单位。 驱动单元集成旋转电机的特征在于:功率开关元件在其端子被暴露的状态下模制并形成模具模块; 导体在其端子露出的状态下嵌入成型在框架中; 并且模块模块的裸露端子连接到嵌入成型导体的裸露端子,并且模块模块牢固地固定到散热器。
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公开(公告)号:USD664565S1
公开(公告)日:2012-07-31
申请号:US29389203
申请日:2011-04-07
申请人: Isao Sonoda , Yoshihito Asao , Katsuhiko Omae , Satoru Akutsu , Mamoru Watanabe
设计人: Isao Sonoda , Yoshihito Asao , Katsuhiko Omae , Satoru Akutsu , Mamoru Watanabe
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公开(公告)号:US09129931B2
公开(公告)日:2015-09-08
申请号:US13989932
申请日:2011-04-27
IPC分类号: H01L23/34 , H01L23/367 , H01L23/495 , H01L23/00 , H01L23/31
CPC分类号: H01L23/367 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L2224/29101 , H01L2224/2929 , H01L2224/32245 , H01L2224/37011 , H01L2224/37013 , H01L2224/371 , H01L2224/3754 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/40245 , H01L2224/73263 , H01L2224/8314 , H01L2224/83801 , H01L2224/8385 , H01L2224/84138 , H01L2224/84801 , H01L2924/01029 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要: A power semiconductor module includes: a plurality of first metal plates arranged in the same planar state; a power semiconductor chip mounted on the first metal plate; and an overbridge-shaped second metal plate which is composed of bridge frame sections and leg sections that support the bridge frame sections, the leg sections being for appropriately performing solder bonding between electrodes of the power semiconductor chips and between the electrode of the power semiconductor chip and the first metal plate, the power semiconductor module being configured by a resin package in which these members are sealed with electrically insulating resin. In the power semiconductor module, the solder bonding section of the leg section is formed in a planar shape by bending process and is provided at a position lower than the bridge frame section.
摘要翻译: 功率半导体模块包括:布置成相同平面状态的多个第一金属板; 安装在所述第一金属板上的功率半导体芯片; 以及跨桥状的第二金属板,其由支撑桥框架部的桥架部和支腿部构成,所述腿部用于适当地进行功率半导体芯片的电极之间和功率半导体芯片的电极之间的焊接 和第一金属板,功率半导体模块由树脂封装构成,其中这些构件用电绝缘树脂密封。 在功率半导体模块中,脚部的焊接部通过弯曲加工形成为平面状,并且设置在比桥框部低的位置。
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公开(公告)号:US20130241047A1
公开(公告)日:2013-09-19
申请号:US13989932
申请日:2011-04-27
IPC分类号: H01L23/367
CPC分类号: H01L23/367 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L2224/29101 , H01L2224/2929 , H01L2224/32245 , H01L2224/37011 , H01L2224/37013 , H01L2224/371 , H01L2224/3754 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/40245 , H01L2224/73263 , H01L2224/8314 , H01L2224/83801 , H01L2224/8385 , H01L2224/84138 , H01L2224/84801 , H01L2924/01029 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要: A power semiconductor module includes: a plurality of first metal plates arranged in the same planar state; a power semiconductor chip mounted on the first metal plate; and an overbridge-shaped second metal plate which is composed of bridge frame sections and leg sections that support the bridge frame sections, the leg sections being for appropriately performing solder bonding between electrodes of the power semiconductor chips and between the electrode of the power semiconductor chip and the first metal plate, the power semiconductor module being configured by a resin package in which these members are sealed with electrically insulating resin. In the power semiconductor module, the solder bonding section of the leg section is formed in a planar shape by bending process and is provided at a position lower than the bridge frame section.
摘要翻译: 功率半导体模块包括:布置成相同平面状态的多个第一金属板; 安装在所述第一金属板上的功率半导体芯片; 以及跨桥状的第二金属板,其由支撑桥框架部的桥架部和支腿部构成,所述腿部用于适当地进行功率半导体芯片的电极之间和功率半导体芯片的电极之间的焊接 和第一金属板,功率半导体模块由树脂封装构成,其中这些构件用电绝缘树脂密封。 在功率半导体模块中,脚部的焊接部通过弯曲加工形成为平面状,并且设置在比桥框部低的位置。
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6.
公开(公告)号:US08284632B2
公开(公告)日:2012-10-09
申请号:US12806996
申请日:2010-08-25
申请人: Mamoru Watanabe
发明人: Mamoru Watanabe
IPC分类号: G04B19/20
CPC分类号: G04B19/25 , G04B19/2536
摘要: To provide a calendar mechanism equipped timepiece which, being small and thin, includes two date indicators configuring date characters which are large and easy to see. A calendar mechanism equipped timepiece of the invention includes a first date indicator which displays the ones column of the date, a second date indicator which displays the tenths column of the date, and a program wheel which enables each of the first date indicator and second date indicator to rotate intermittently. The program wheel includes program wheel teeth, first date indicator advance teeth, second date indicator advance teeth having provided at the leading ends thereof second date indicator advance fingers, and correction teeth. A configuration is such that the height of the second date indicator advance teeth is greater than the height of the first date indicator advance teeth, and the height of the first date indicator advance teeth is greater than the height of the correction teeth.
摘要翻译: 为了提供一种装备精简的日历机构,其尺寸小而薄,包括两个日期指示器,其配置大而易于看见的日期字符。 本发明的日历机构配备的钟表包括显示日期的一列的第一日期指示符,显示日期的十分之一列的第二日期指示符以及启用第一日期指示符和第二日期中的每一个的程序轮 指示灯间歇旋转。 程序轮包括程序轮齿,第一日期指示器前进齿,设置在其前端的第二日期指示器前进齿第二日期指示器前进指和校正齿。 第二日期指示器前进齿的高度大于第一日期指示器前进齿的高度,并且第一日期指示器前进齿的高度大于校正齿的高度。
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公开(公告)号:US08262429B2
公开(公告)日:2012-09-11
申请号:US13139624
申请日:2010-11-16
申请人: Masafumi Okawa , Yoshiki Sasaki , Takeo Funaoka , Toshiyuki Watanabe , Masaki Nishinaka , Mamoru Watanabe , Jun-ichi Taira , Yugo Takeda
发明人: Masafumi Okawa , Yoshiki Sasaki , Takeo Funaoka , Toshiyuki Watanabe , Masaki Nishinaka , Mamoru Watanabe , Jun-ichi Taira , Yugo Takeda
IPC分类号: H01J9/38
摘要: A method for producing a plasma display panel includes the steps of: evacuating air from a discharge space formed between a front plate and a rear plate which are substrates facing each other through piping; introducing a discharge gas into the discharge space through gas piping that branches from the piping; and recovering the discharge gas remaining in the piping system through the piping.
摘要翻译: 一种等离子体显示面板的制造方法,其特征在于,包括以下步骤:从形成在前板和后板之间的放电空间排出空气,所述放电空间是通过管道彼此面对的基板; 通过从管道分支的气体管道将放电气体引入放电空间; 并通过管道回收管道系统中残留的排放气体。
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公开(公告)号:US07943114B2
公开(公告)日:2011-05-17
申请号:US11812958
申请日:2007-06-22
申请人: Takayoshi Sasaki , Mamoru Watanabe , Yuichi Michiue , Masaki Iida
发明人: Takayoshi Sasaki , Mamoru Watanabe , Yuichi Michiue , Masaki Iida
IPC分类号: C01G23/04 , C01G23/047 , C01G23/053 , C09C1/36
CPC分类号: C09C1/0018 , A61K8/11 , A61K8/29 , A61K2800/412 , A61K2800/43 , A61Q17/04 , B82Y30/00 , C01G23/005 , C01G23/04 , C01G23/047 , C01P2002/30 , C01P2002/72 , C01P2002/77 , C01P2002/84 , C01P2004/03 , C01P2004/20 , C01P2004/30 , C01P2004/34 , C01P2004/61 , C01P2004/62 , C01P2004/64 , C01P2006/22 , C09C1/3607 , C09C1/363 , G01F1/661 , Y10T428/2991 , Y10T428/2993
摘要: The present invention relates to fine hollow powder with a titanium oxide shell, obtained by spray drying an exfoliated titania sol, and thin flaky titanium oxide powder obtained by pulverizing the fine hollow powder, and also to processes for producing the same. The present fine hollow powder and thin flaky titanium oxide powder have a distinguished dispersibility and are useful for additives to cosmetics, pigments, paints, etc., and the present fine hollow powder also has a distinguished flowability and is useful for seed particles for flow measurement.
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公开(公告)号:US07663073B2
公开(公告)日:2010-02-16
申请号:US10833072
申请日:2004-04-28
申请人: Masahiro Sato , Masashi Ishiguro , Tomoko Fukunaka , Kazuhiko Yamashita , Mamoru Watanabe , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
发明人: Masahiro Sato , Masashi Ishiguro , Tomoko Fukunaka , Kazuhiko Yamashita , Mamoru Watanabe , Ryoji Inutsuka , Kenji Takahashi , Toshikazu Yoneda
IPC分类号: B23K26/06
CPC分类号: B23K1/0056 , B23K26/04 , B23K2101/42
摘要: An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path. The optical processing apparatus further includes an actuator for changing a positional relationship between the optical system and the workpiece, a feeder for supplying a solder to the workpiece, a first shifter for moving the processing head in a first direction in parallel to an optical axis of the light emitted from the emitter, a second shifter for positioning the feeder in the first direction away from the processing head when the processing head is moved away from the workpiece by the first shifter, and a third shifter for moving the feeder against the processing head in a second direction perpendicular to the first direction while the processing head is moved by the first shifter. The optical processing apparatus allows the spot of the incident light and the position of soldering to be readily set depending on the configuration of a workpiece and can thus solder the workpiece at higher quality under soldering conditions optimized for the workpiece.
摘要翻译: 光学处理设备包括用于发射光的发射器,用于将光引导到在工件上被处理的位置的第一光路和处理头。 处理头包括设置在第一光路中的光学系统,用于使光成形,具有与第一光路共享的部分的第二光路,引导从工件反射的光的第二光路和用于接收的光接收器 来自第二光路的反射光。 光学处理装置还包括用于改变光学系统和工件之间的位置关系的致动器,用于向工件供应焊料的馈送器,用于沿第一方向平行于第一方向移动处理头的第一移位器, 从发射器发射的光;第二移位器,用于当处理头通过第一移位器移动离开工件时,将馈送器沿第一方向定位成远离处理头;以及第三移位器,用于将馈送器移动到处理头 在垂直于第一方向的第二方向上,当处理头被第一移位器移动时。 光学处理装置允许入射光的点和焊接位置根据工件的构造容易地设定,并且因此可以在针对工件优化的焊接条件下以更高的质量焊接工件。
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10.
公开(公告)号:US07609588B2
公开(公告)日:2009-10-27
申请号:US11667176
申请日:2004-12-15
申请人: Takeshi Tokoro , Kei Hirano , Mamoru Watanabe
发明人: Takeshi Tokoro , Kei Hirano , Mamoru Watanabe
IPC分类号: G04B19/24
CPC分类号: G04B19/241 , G04B19/25
摘要: A multifunctional watch has a movement including first and second train wheel rotational centers each arranged at a position between a center of a main plate and an outline portion of the main plate. The first and second train wheel rotational centers are provided with respective first and second train wheel guide portions rotatably guiding respective first and second train wheel members about the respective first and second train wheel rotational centers. A first train wheel having the first train wheel member is arranged rotatably relative to the first train wheel rotational center for rotating one of the small hands only in a single direction of rotation to display the first calendar information. A second train wheel having the second train wheel member is arranged rotatably relative to the second train wheel rotational center for rotating another of the small hands only in a single direction of rotation to display the second calendar information.
摘要翻译: 多功能手表具有包括第一和第二列车轮旋转中心的运动,每个轮系旋转中心均布置在主板的中心和主板的轮廓部分之间的位置。 第一和第二列车轮转动中心设置有各自的第一和第二轮系引导部,其可旋转地引导相应的第一和第二轮系构件围绕相应的第一和第二列车轮转动中心。 具有第一列车轮构件的第一行车轮相对于第一轮系转动中心可旋转地布置,用于仅在单个旋转方向上旋转小手之一以显示第一日历信息。 具有第二列车轮构件的第二列车轮相对于第二列车轮旋转中心可旋转地布置,用于仅在单个旋转方向上旋转另一个小手,以显示第二日历信息。
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