公开(公告)号：US09401293B2

公开(公告)日：2016-07-26

申请号：US13330881

申请日：2011-12-20

申请人： Itsuki Kobata ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

发明人： Itsuki Kobata ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

IPC分类号： B24B49/12 ,  B24B37/10 ,  B24B37/30 ,  B24B37/013 ,  H01L21/67 ,  H01L21/687 ,  B24B37/04 ,  B24B37/005

CPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/10 ,  B24B49/12 ,  H01L21/31053 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/68721 ,  H01L22/26

摘要： A polishing apparatus for polishing a substrate includes a polishing table holding a polishing pad, a top ring configured to press the substrate against the polishing pad, and first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate. The polishing apparatus also includes spectroscopes each configured to measure at each wavelength an intensity of the reflected light received, and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

摘要翻译： 用于抛光基板的抛光装置包括：保持抛光垫的抛光台，被配置为将基板压靠在抛光垫上的顶环;以及第一和第二光学头，每个被配置为将光施加到基板并且接收来自 底物。 抛光装置还包括分别被配置成在每个波长处测量接收到的反射光的强度，以及处理器，被配置为产生指示反射光的强度和波长之间的关系的光谱。 第一光学头被布置为面对基板的中心，并且第二光学头被布置成面对基板的周边部分。

公开(公告)号：US20120164917A1

公开(公告)日：2012-06-28

申请号：US13330881

申请日：2011-12-20

申请人： Itsuki KOBATA ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

发明人： Itsuki KOBATA ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

IPC分类号： B24B49/00

CPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/10 ,  B24B49/12 ,  H01L21/31053 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/68721 ,  H01L22/26

摘要： A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

摘要翻译： 提供了用于研磨衬底的抛光装置。 抛光装置包括：抛光台，其保持抛光垫; 顶环，构造成将衬底压靠在抛光垫上; 第一和第二光学头，每个被配置为将光施加到衬底并且接收来自衬底的反射光; 每个光谱分别被配置成在每个波长处测量接收到的反射光的强度; 以及处理器，被配置为产生指示反射光的强度和波长之间的关系的光谱。 第一光学头被布置为面对基板的中心，并且第二光学头被布置成面对基板的周边部分。

公开(公告)号：US20100093260A1

公开(公告)日：2010-04-15

申请号：US12461533

申请日：2009-08-14

申请人： Yoichi Kobayashi ,  Noburu Shimizu ,  Shinrou Ohta ,  Toshifumi Kimba ,  Masaki Kinoshita

发明人： Yoichi Kobayashi ,  Noburu Shimizu ,  Shinrou Ohta ,  Toshifumi Kimba ,  Masaki Kinoshita

IPC分类号： B24B49/12

CPC分类号： B24B49/12 ,  B24B37/013

摘要： A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; calculating relative reflectances of the reflected light at respective wavelengths; determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time; identifying a point of time when the wavelengths, indicating the local maximum point and the local minimum point, are determined; and plotting coordinates, specified by the wavelengths and the point of time corresponding to the wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time.

摘要翻译： 提供了一种制造用于选择光学抛光终点检测中的光的波长的图的方法。 该方法包括通过抛光垫抛光具有膜的基板的表面; 在基板的研磨过程中将光施加到基板的表面并接收来自基板的反射光; 计算各波长的反射光的相对反射率; 确定反射光的波长，其指示随抛光时间变化的相对反射率的局部最大点和局部最小点; 识别指示表示局部最大点和局部最小点的波长的时间点; 并且将由波长相对应的波长和时间点指定的坐标绘制到具有指示光的波长和抛光时间的坐标轴的坐标系上。

公开(公告)号：US07960188B2

公开(公告)日：2011-06-14

申请号：US12465024

申请日：2009-05-13

申请人： Shinrou Ohta ,  Mitsuo Tada ,  Noburu Shimizu ,  Yoichi Kobayashi ,  Taro Takahashi ,  Eisaku Hayashi ,  Hiromitsu Watanabe ,  Tatsuya Kohama ,  Itsuki Kobata

发明人： Shinrou Ohta ,  Mitsuo Tada ,  Noburu Shimizu ,  Yoichi Kobayashi ,  Taro Takahashi ,  Eisaku Hayashi ,  Hiromitsu Watanabe ,  Tatsuya Kohama ,  Itsuki Kobata

IPC分类号： H01L21/00 ,  H01L21/302 ,  G01R31/26

CPC分类号： H01L22/26 ,  H01L21/3212 ,  H01L21/67219 ,  H01L22/14

摘要： A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.

摘要翻译： 描述了在其上抛光具有金属膜的基板的方法。 基板具有由金属膜的一部分形成的金属互连。 抛光方法包括进行第一抛光处理，在第一抛光处理之后，在第二抛光处理之后进行去除阻挡膜的第二抛光工艺，进行抛光绝缘膜的第三抛光工艺。 在第二抛光工艺和第三抛光工艺期间，用涡流传感器监测衬底的抛光状态，并且当涡流传感器的输出信号达到预定阈值时，第三抛光处理结束。

公开(公告)号：US20090286332A1

公开(公告)日：2009-11-19

申请号：US12465024

申请日：2009-05-13

申请人： Shinrou OHTA ,  Mitsuo Tada ,  Noburu Shimizu ,  Yoichi Kobayashi ,  Taro Takahashi ,  Eisaku Hayashi ,  Hiromitsu Watanabe ,  Tatsuya Kohama ,  Itsuki Kobata

发明人： Shinrou OHTA ,  Mitsuo Tada ,  Noburu Shimizu ,  Yoichi Kobayashi ,  Taro Takahashi ,  Eisaku Hayashi ,  Hiromitsu Watanabe ,  Tatsuya Kohama ,  Itsuki Kobata

IPC分类号： H01L21/66

CPC分类号： H01L22/26 ,  H01L21/3212 ,  H01L21/67219 ,  H01L22/14

摘要： A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film, during the second polishing process and the third polishing process, monitoring a polishing state of the substrate with an eddy current sensor, and terminating the third polishing process when an output signal of the eddy current sensor reaches a predetermined threshold.

摘要翻译： 描述了在其上抛光具有金属膜的基板的方法。 基板具有由金属膜的一部分形成的金属互连。 抛光方法包括：进行第一抛光处理后的第一抛光处理，在第一抛光处理之后，在第二抛光处理之后执行去除阻挡膜的第二抛光工艺，进行抛光绝缘膜的第三抛光处理 第二抛光工艺和第三抛光工艺，用涡流传感器监测衬底的抛光状态，并且当涡流传感器的输出信号达到预定阈值时终止第三抛光处理。

公开(公告)号：US20120044308A1

公开(公告)日：2012-02-23

申请号：US13198098

申请日：2011-08-04

申请人： Yoichi Kobayashi

发明人： Yoichi Kobayashi

IPC分类号： B41J2/01

CPC分类号： B41J2/1721 ,  B41J11/0065 ,  B41J11/0085 ,  B41J11/06 ,  B41J2002/1742

摘要： A recording apparatus includes a recording head that ejects a liquid thereby performing recording on a recording medium, and a support member disposed so as to oppose the recording head. The support member includes a deposit recess located at a position corresponding to the respective end portion of the recording medium in the width direction intersecting with the transport direction, for receiving the liquid ejected to a region deviated from the recording medium in a marginless recording process, and a support region provided upstream of the deposit recess in the transport direction so as to support a back surface of the recording medium, and most upstream nozzles in the transport direction are not used in the marginless recording process.

摘要翻译： 记录装置包括：喷射液体，从而在记录介质上进行记录的记录头;以及与记录头相对设置的支撑件。 支撑构件包括位于与传送方向相交的宽度方向上与记录介质的相应端部相对应的位置的沉积凹槽，用于在无间隙记录过程中接收喷射到与记录介质偏离的区域中的液体， 以及支撑区域，其设置在输送方向上的沉积凹槽的上游，以支撑记录介质的后表面，并且在无边缘记录处理中不使用传送方向上的大多数上游喷嘴。

公开(公告)号：US08112169B2

公开(公告)日：2012-02-07

申请号：US12881522

申请日：2010-09-14

申请人： Yoichi Kobayashi ,  Yasumasa Hiroo ,  Tsuyoshi Ohashi

发明人： Yoichi Kobayashi ,  Yasumasa Hiroo ,  Tsuyoshi Ohashi

IPC分类号： G05B13/02 ,  G06F19/00 ,  B24B49/00 ,  B24B51/00

CPC分类号： B24B37/005 ,  B24B49/10

摘要： A polishing apparatus has a polishing table having a polishing surface and a top ring for pressing a substrate against the polishing surface while independently controlling pressing forces applied to a plurality of areas on the substrate. The polishing apparatus has a sensor for monitoring substrate conditions of a plurality of measurement points on the substrate, a monitor unit for performing a predetermined arithmetic process on a signal from the sensor to generate a monitor signal, and a controller for comparing the monitor signal of the measurement points with the reference signal and controlling the pressing forces of the top ring so that the monitor signal of the measurement point converges on the reference signal.

摘要翻译： 抛光装置具有抛光台，其具有抛光表面和用于将衬底压靠在抛光表面上的顶环，同时独立地控制施加到衬底上的多个区域的按压力。 抛光装置具有用于监测基板上的多个测量点的基板状况的传感器，用于对来自传感器的信号执行预定的运算处理以产生监视信号的监视单元，以及用于将监视信号 测量点与参考信号，并控制顶环的按压力，使测量点的监视信号收敛于参考信号。

公开(公告)号：US07780503B2

公开(公告)日：2010-08-24

申请号：US12292453

申请日：2008-11-19

申请人： Shinrou Ohta ,  Noburu Shimizu ,  Yoichi Kobayashi

发明人： Shinrou Ohta ,  Noburu Shimizu ,  Yoichi Kobayashi

IPC分类号： B24B49/00

CPC分类号： B24B37/005 ,  B24B49/12 ,  B24B49/16 ,  H01L21/3212 ,  H01L22/12 ,  H01L22/26

摘要： A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for holding a workpiece having a surface conductive film, and pressing the conductive film against the polishing surface to polish the conductive film; an optical sensor for monitoring the polishing state of the conductive film by emitting light toward the conductive film of the workpiece held by the top ring, receiving reflected light from the conductive film, and measuring a change in the reflectance of the reflected light; and a control section for controlling a pressure at which the workpiece is pressed on the polishing surface.

摘要翻译： 抛光装置可以抛光和除去额外的导电膜，同时防止腐蚀的发生而不降低生产量。 抛光装置包括：具有抛光表面的抛光台; 用于保持具有表面导电膜的工件的顶环，并且将导电膜压靠在抛光表面上以抛光导电膜; 光传感器，用于通过向由顶环保持的工件的导电膜发射光，接收来自导电膜的反射光并测量反射光的反射率的变化来监测导电膜的抛光状态; 以及控制部，用于控制在抛光面上压入工件的压力。

公开(公告)号：US20100029177A1

公开(公告)日：2010-02-04

申请号：US12310877

申请日：2007-09-06

申请人： Yoichi Kobayashi ,  Yasumasa Hiroo ,  Tsuyoshi Ohashi

发明人： Yoichi Kobayashi ,  Yasumasa Hiroo ,  Tsuyoshi Ohashi

IPC分类号： B24B49/04 ,  B24B49/10

CPC分类号： B24B37/04 ,  B24B37/013

摘要： The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a semiconductor wafer, to planarize the substrate. The polishing apparatus according to the present invention includes a polishing table (10) having a polishing surface, a top ring (14) configured to press the substrate against the polishing table by applying pressing forces independently to first plural zones on the substrate, a sensor (50) configured to detect a state of the film at plural measuring points, a monitoring device (53) configured to produce monitoring signals with respect to second plural zones on the substrate, respectively, a storage device configured to store plural reference signals each indicating a relationship between reference values of each monitoring signal and polishing times, and a controller configured to operate the pressing forces against the first plural zones such that the monitoring signals, corresponding respectively to the second plural zones, converge on one of the plural reference signals.

摘要翻译： 抛光装置和抛光方法技术领域本发明涉及一种用于抛光半导体晶片等基板的平面化研磨装置和研磨方法。 根据本发明的研磨装置包括具有研磨面的研磨台（10），顶环（14），其构造成通过对基板上的第一多个区域分别施加压力而将基板压靠在研磨台上，传感器 （50），被配置为检测所述胶片在多个测量点的状态;监视装置（53），被配置为相对于所述基板上的第二多个区域产生监视信号;存储装置，被配置为存储多个参考信号， 每个监测信号的参考值和抛光时间之间的关系;以及控制器，被配置为对第一多个区域施加按压力，使得分别对应于第二多个区域的监测信号在多个参考信号中的一个上收敛。

公开(公告)号：US20090096446A1

公开(公告)日：2009-04-16

申请号：US12285674

申请日：2008-10-10

申请人： Taro Takahashi ,  Yoichi Kobayashi ,  Shinrou Ohta ,  Akihiko Ogawa

发明人： Taro Takahashi ,  Yoichi Kobayashi ,  Shinrou Ohta ,  Akihiko Ogawa

IPC分类号： G01B7/06

CPC分类号： G01B7/105

摘要： The present invention provides a method for monitoring a change in thickness of a conductive film brought into sliding contact with a polishing surface of a polishing pad using an eddy current sensor. The output signal of the eddy current sensor comprises two signals corresponding to a resistance component and an inductive reactance component of an impedance of an electric circuit including a coil of the eddy current sensor. The method includes acquiring the output signal of the eddy current sensor when the eddy current sensor is facing the conductive film, defining the two signals as coordinates on a coordinate system, repeating the acquiring of the output signal and the defining of the coordinates, determining a center of curvature of an arc specified by at least three sets of coordinates on the coordinate system, determining an angle of inclination of a line connecting the center of curvature and a latest one of the at least three sets of coordinates, and monitoring a change in thickness of the conductive film by monitoring a change in the angle of inclination.

摘要翻译： 本发明提供一种用于使用涡流传感器监测与抛光垫的抛光表面滑动接触的导电膜的厚度变化的方法。 涡电流传感器的输出信号包括对应于包括涡流传感器的线圈的电路的阻抗的电阻分量和电抗分量的两个信号。 该方法包括当涡流传感器面向导电膜时获取涡流传感器的输出信号，将两个信号定义为坐标系上的坐标，重复获取输出信号和定义坐标，确定 由坐标系上的至少三组坐标指定的圆弧的曲率中心，确定连接曲率中心的直线和最小三个坐标系中的最近一个的线的倾斜角度， 通过监测倾斜角度的变化来确定导电膜的厚度。